Dram Technology Transfer Process Integration Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where bold ideas become real technology. We push the limits of memory and storage innovation, and we thrive in a collaborative environment where engineers learn, build, and solve challenges together. We are driven by curiosity, creativity, and the pursuit of better solutions every day! We are seeking a Principal or Member of Technical Staff (MTS) in Analog Design to join our DRAM IP Design team. As a Principal/ MTS, you will help shape the next generation of Micron's memory products, while working closely with global design, verification, and product teams to bring innovative circuit designs from concept to silicon. Your work will directly influence product performance, quality, and reliability—and contribute to advancements that define the semiconductor industry. Responsibilities: Design, optimize, and verify block‑level analog and mixed-signal circuits for DRAM projects. Work with the internal data science team and EDA vendors to leverage and improve AI-assisted design flow and circuits optimization. Propose, evaluate and implement new or improved circuit topology to further enhance PPAC of the circuit block. Improve design verification scope and coverage to increase circuit robustness to enhance mass production yield. Partner with global design groups and provide layout guidance through post‑layout simulation. Compare silicon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities · Lead pre-silicon readiness activities across new DRAM products, including risk assessment, DFMEA preparation, validation planning, and readiness reviews with cross-functional engineering teams. · Partner closely with Design, Verification, Component Validation, Product Engineering, Product Architecture, System Compatibility Group, and Silicon Strategy teams to identify product risks, define validation coverage, and align debug priorities. · Apply strong technical judgment to analyze circuit behavior, silicon data, validation results, failure signatures, and product-level interactions across design, test, and manufacturing flows. · Drive structured investigation and resolution of silicon findings, including root-cause analysis, experiment planning, evidence review, and alignment of mitigation or screen strategies to project milestones. · Influence product readiness decisions by connecting design intent, silicon behavior, validation results, manufacturing constraints, and customer quality expectations. · Mentor engineers, strengthen technical practices, and help capture lessons learned that improve execution, product robustness, and organizational readiness across future DRAM programs. ·Apply AI-enabled ways of working to improve engineering productivity, including use of approved AI tools for technical research, data synthesis, debug plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Shift Process Engineer is responsible for improving process quality, working on yield and efficiency improvements, cost reduction, and resolving line issues in their assigned area to achieve area KPIs and optimize manufacturing wafer outs. They partner with equipment team members, leaders within the area, shift operations leaders, and periphery stakeholders to ensure critical area priorities are understood and executed on Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures proper tool documentation/reaction mechanisms exist and submits updates to content Leads in expertise of executing area operations to ensure throughput needs are accomplished Resolves or escalates issues that

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary The TD Electrical Device Characterization team at Micron is where deep device physics meets real product impact. We work at the groundbreaking edge of DRAM and emerging memory technologies, partnering closely across build, process, and systems teams to develop what ships next. If you enjoy turning complex measurements into insight and influence, this is a place to do your best work. In this role, you will lead electrical characterization for advanced memory devices, driving new methods from early development through production. You will combine hands-on experimentation, data-driven analysis, and technical leadership to connect device behavior to reliability, performance, and product outcomes. This position offers strong ownership, visibility, and the opportunity to mentor others while pushing technology forward. Responsibilities: Lead electrical characterization of advanced DRAM and emerging memory devices Develop and scale characterization methodologies, models, and standards Design and automate test flows, data pipelines, and analysis tools Investigate device behavior, reliability mechanisms, and root causes Collaborate across functions and present technical findings with clarity Minimum Qualifications: MS or PhD or equivalent experience in Electrical Engineering or related field Strong foundation in semiconductor device phys

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 先端DRAM半導体製品において、生産技術部門 DRYエッチプロセスの一員として、量産技術改善から生産技術・管理を横断的に担い、ものづくりを推進する役割になります。 業務詳細 安全トレーニングを受講し、マイクロンの安全ポリシーに従い業務を遂行してもらいます。 生産技術部門DRY グループ内において、Process＆Equipment担当エンジニアの役割を担います。 Process＆Equipment担当エンジニアは、より高い生産性と高品質の量産技術の確立に向けて、多角的に活動し、業務・改善を進めて行きます。 良品率の改善や管理システムの改善、生産性向上の改善を進めて行く必要があります。 また、新規最先端装置の導入や改修もサポートし、より生産計画の向上を進めて行きます。 開発製品の導入時には、製品や生産技術の問題点を洗い出し、関連部門と連携しながら、量産化を実現して行きます。 DRY内において、装置担当エンジニアや、他のプロセス担当エンジニア、そしてシフト勤務に従事するテクニシャンと、コミュニケーションをとり、改善活動を牽引する。 日々の問題から、長期的なプロジュクトまで参画しながら、上司、チームメンバーそして関係者への報告を行う。マイクロンの海外生産拠点と技術交流にも参加して、情報の共有から、標準化を進めて行きます。 要件（全て満たしている必要は無い） ・先端の技術に興味を持ち、仕事に前向きに取り組むことができる。 ・課題を整理し、解決できる能力を有する。 ・関係部門と協議しプロジェクトを補佐する能力を有する。 ・社内外の人とコミュニケーションを円滑に取ることができる。 ・Microsoft Office (Excel, PowerPoint, Word) などのソフトウェアを使用できる。 ・自己管理（業務、健康）ができる。 ・物理化学、機械、電気等の基礎知識について、大学卒業以上の知識を有することが望ましい。 About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Contribute to the development of new product opportunities by assisting with the overall design, layout, and optimization of DRAM Memory array/Peripheral Logic/Analog circuits Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate schematic optimization and design‑space exploration Assist in parasitic analysis, sensitivity studies, and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Oversee and manage the layout process including floor-planning, placement, and routing Perform circuit-level verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Drive innovation into the future memory generations and design methodology within a dynamic work environment Minimum Qualifications Master’s degree in electrical or computer engineering with 15+ years of experience in vlsi design. Strong fundamentals in CMOS circuit design, device physics and memory operation. Proven lea

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Lead Principal Engineer, Layout Design at Micron, you will be at the forefront of developing groundbreaking memory solutions! This role is an outstanding opportunity to lead the physical implementation of modern DRAM and mixed-signal circuits, turning schematics and specifications into flawless, manufacturable layouts. You will collaborate with a world-class team of Circuit Designers, Verification Engineers, CAD/Methodology experts, Process Integrators, Product Engineers, Test/Probe specialists, Assembly professionals, and Marketing strategists. Together, we will drive cost, quality, reliability, time-to-market, and customer happiness through outstanding layout and build. Key Responsibilities Lead the layout build and physical realization of new memory products. Interpret device and circuit specifications to implement custom layout solutions meeting PPA (power, performance, area) and reliability targets. Develop hierarchical layouts for analog, digital, and memory-array-related circuitry using industry-standard EDA tools. Build block and top-level floorplans optimizing placement, routing resources, signal integrity, power delivery, and manufacturability. Optimize layout for critical metrics such as die size/area efficiency, matching, coupling/noise, and timing. Produce layout collateral and documentation for cross-team integration. Physical Verification and Tapeout Signoff Run and debug physical verification flows and ensure closure using indust

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Contribute to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop advanced capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. applying Artificial Intelligence Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5+ years of direct CAD or Design experience in mixed

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Wet Etch/CMP/Bond , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies within the Wet Etch/CMP/Bond Process Areas. This position operates on a 12-hour rotating shift schedule and serves as the primary engineering decision-maker for development activities occurring during off-hours for one of the three listed areas while also supporting the other two areas as needed. You will work closely with Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to ensure uninterrupted development execution, increase learning velocity, and support technology roadmap objectives. Unlike traditional manufacturing shift engineering roles, this MDE Shift Engineer operates in a highly dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. This role requires strong engineering judgment to disposition development wafers, make real-time process decisions, troubleshooting process and equipment issues, and appropriately balance execution needs with development objectives. Responsibilities Serve as the primary off-shift engineering decision-maker for development activities, using sound engineering judgment to disposition wafers, release or hold tools, define actions on development targets, respond to process deviations, handle execution risk

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. UPWARDSサマーインターンシッププログラムの手続き専用ページです ※求人情報ではありませんので応募できません Applying AI About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_japan@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other paymen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern Product Yield Enhancement (PYE) Engineer at Micron Technology Inc., you will assist in taking next generation DRAM devices from design to mass production! PYE Engineers are crucial partners between Research and Development, Manufacturing, Product Engineering and Global Quality teams. Our goal is to offer hands-on and substantial engineering projects that allow interns to gain valuable experience with memory systems and the product life cycle while adding impact to Micron’s business. Our intern programs help prepare engineers for future roles and offer an extraordinary experience that supplements your academic experience! The PYE Engineering role is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory while delivering the quality and reliability that customers expect from the Micron brand. This position is for a 3-month internship. Responsibilities: Your job duties will include detailed DRAM electrical and physical failure analysis. Identify defects introduced by the semiconductor fabrication process. You will data mine using statistical analysis, AI assisted engineering tools, and automation workflows. Find the root cause of failure mechanisms, communicating results with Management, Product, Process and Test Engineering teams. Complete 3-month internship. Minimum Qualifications: Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Cloud Memory Business Unit (CMBU) is driving the future of memory solutions for cloud computing, AI infrastructure, enterprise systems, and client platforms. We work across engineering, marketing, finance, and operations to deliver industry-leading DRAM innovations that enable next-generation computing experiences. Our team values strategic thinking, customer focus, and collaboration as we bring advanced memory technologies to market. As Director of Product Management, you will lead the strategy, roadmap, and lifecycle management of a global DRAM product portfolio serving hyperscale cloud, enterprise OEM, AI accelerator, and PC markets. This highly visible leadership role will shape Micron’s position in emerging memory technologies and datacenter LPDDR solutions while influencing product direction through customer engagement, market insight, and technology leadership. You will lead a global team of product managers and serve as a key voice for the business with executive leadership, customers, and industry partners. Responsibilities: Define and execute the multi-year product strategy and roadmap for a global DRAM portfolio Own the full product lifecycle, including product planning, stage gate reviews, and end-of-life decisions Lead cross-functional collaboration to deliver products through Micron’s Product Lifecycle Management (

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Participate in simulating, analyzing, and debugging pre-silicon full chip designs by applying leading edge verification technique Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Co-work with international colleagues on developing new verification flows to take on the challenges in DRAM and emerging memory design. Participate in developing verification methodology and verification environ

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, s