Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the CMOS Device Integration Team at Micron, where we push the limits of memory technology every day. We work at the intersection of device physics, process integration, and product performance to enable the next wave of DRAM, HBM, and Compute-in-Memory innovation. If you’re excited by challenging technical problems and real-world impact, you’ll feel right at home here! In this role, you’ll serve as a technical leader shaping the future of Micron’s most advanced memory products. As a Distinguished Member of Technical Staff, you’ll drive CMOS device and module development that directly impacts array efficiency, data rates, and product scalability. Your expertise and influence will help guide technology decisions that power AI, high-performance computing, and emerging applications. Responsibilities: Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures Perform detailed electrical characterization of CMOS devices and circuits to drive performance improvements Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions Provide technical leadership, strategic recommendations, and clear presentations to guide technology direction Minimum Qualifications: Master’s degree or PhD in Electrical Engineering or equivalent practical experience 10 or more years of hands-on experience in advanced CMOS device design and/or integration 1
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures. Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability. Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals. Evaluate and implement new etch technologies, chemistries, and hardware platforms. Mentor and guide junior engineers; foster a culture of innovation and technical excellence. Interface with equipment vendors and external partners to co-develop solutions. Drive root cause analysis and continuous improvement initiatives for process-related issues. Present findings and recommendations to executive leadership and global teams. Qualifications: Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field. Minimum 10 years of hands-on experience in Dry Etch process development , preferably in DRAM or advanced memory technologies . Proven track record of technical leadership in semiconductor process engineering. Deep understanding of plasma etch mechanisms, process control, and defect mitigation. Experience with advanced etch tools (e.g., Lam, TEL, AMAT) and process characterization techniques. Strong analytical, problem-solving,
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof
NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. Responsibilities: Safely identify, handle, and work with chemicals and associated hazards in the work area. Recognize and respond appropriately to safety alarms and events, including EES, fire alarms, MDA, and ERT notifications. <l
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Process Control Engineer, you will be responsible for developing, driving, and sharing process and equipment control solutions. You'll have the opportunity to collaborate with process engineering, IT, equipment automation, data engineering, and data science teams to develop and deliver high quality control strategies and sophisticated methods of variation prediction, identification, and reduction. Specifically, we need someone to craft models and systems solutions to predict and control future process variation with an end goal of efficiency, process variation reduction and yield improvement. You will collaborate with a global community of control engineers to share best known methods and ensure global alignment. Are you curious and enjoy continually learning? Come join our team of dedicated engineers! Job Responsibilities: Design and implement solutions to reduce process variation and develop systems that automate or simplify process control tasks.</li
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior/Staff/Principal Engineer and Member of the Technical Staff in the Procurement and Operations Central Teams (PROCT) and Advanced Development Team (ADT), you will primarily focus in the early maturity phase of new products as they transition from technology development centers to our high-volume manufacturing sites. Your contributions to our team will support innovation and enable improvements in product yield, quality and cost reduction that are vital to enable our manufacturing strategy. We are looking for outstanding candidates experienced with semiconductor process development/optimization, hardware and supplier management, and an understanding of NAND & DRAM integration to contribute and grow with our organization. Good organization skills and the ability to work independently or in teams is a must and because this role is essential to the success of Micron's products it will require international travel to Micron manufacturing and technology development sites. Responsibilities Collaborate with Technology Development (TD) on future technology requirements and model of record requirements to ensure manufacturing roadmap is aligned with the forward technology path Partner with TD and Manufacturing on supplier engagement to ensure resources meet Micron's strategic objectives. Collaborate with Manufacturing as new products are introduced to improve performance and enable customer qualification. Connect with corporate EHSS and site Process Hazard Analysis engine
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Micron’s High Bandwidth Memory (HBM) Design Verification team is responsible for ensuring the functionality, performance, and quality of next‑generation memory products that enable advanced computing applications. As a Senior Design Verification Engineer, you will collaborate closely with design, architecture, and product engineering teams to verify complex, high‑density DRAM circuits and deliver robust, production‑ready designs. This role combines deep technical verification expertise with cross‑functional collaboration in a global environment. You will be challenged by the complexity and difficulty of verifying high density memory chips (up to 32Gb) with huge scale of circuit capability (over 4M transistors), ultra-high speed designs, sophisticated functionality which includes next Generation DDR/LPDDR (ex: DDR5, LPDDR5) and advanced low power and power management technologies. You will be responsible to evaluate the functionality and performance of the Full-chip and block-level circuit designs using different verification tools, techniques, and strategies. In addition, you will also n
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's ASIC Logic Design team develops next-generation ASICs and controller IP that enable industry-leading memory solutions. Working across advanced process technologies, the team collaborates with architecture, analog, verification, physical design, and validation engineers to deliver high-performance, production-ready silicon for future DRAM products. As an ASIC Digital Design Engineer, you will contribute to the design and development of RTL for next-generation DRAM memory controllers and subsystems. You will work in a collaborative engineering environment supporting design implementation, simulation, validation, and chip bring-up activities while leveraging AI-enabled tools to improve productivity and design quality. Responsibilities Design and develop RTL for DRAM memory controllers and subsystem components using SystemVerilog. Collaborate with analog, verification, physical design, validation, and other cross-functional teams to support successful product development. Develop and validate HDL models, support simulation and co-simulation activities, and analyze design functionality and performance. Support chip bring-up, debugging, and validation activities to identify and resolve design issues. Use scripting, automation, and AI-enabled tools to improve design workflows, productivity, and engineering efficiency. Minimum Qualifications 0-2 years of relevant experience through intern
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we accelerate the transformation of information into intelligence, enabling advances in learning, communication, and technology. Micron's Boise site is at the center of a historic semiconductor manufacturing expansion, supported by a $15 billion investment. This growth creates exciting opportunities for students to contribute to leading-edge DRAM manufacturing while developing technical expertise in one of the world's most advanced fabrication environments. The ID1 High Volume Manufacturing Process Engineer supports process quality, yield improvement, manufacturing efficiency, and cost reduction within a high-volume semiconductor fabrication environment. This role partners closely with equipment engineers, manufacturing teams, process owners, and operations leaders to find opportunities, resolve process issues, and optimize wafer output. The successful candidate will apply statistical analysis, engineering principles, and data-driven decision making to improve manufacturing performance, support operational excellence, and contribute to key area performance indicators. Responsibilities Monitor, analyze, and improve manufacturing processes to achieve yield, quality, throughput, and cost objectives. Apply SPC, FDC, Design of Experiments, and systematic problem-solving methodologies to identify and resolve process deviations and chronic is
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Architecture team is responsible for defining the system‑level and silicon‑level architectures that enable Micron’s memory products. The team works across technology generations and product lines, collaborating with design, product, systems, and ecosystem partners to deliver scalable, reliable, and high‑performance memory solutions aligned with customer and market needs. This role provides senior‑level architectural leadership to help shape Micron’s next‑generation DRAM products. As a Distinguished Member of Technical Staff, you will influence memory architecture decisions across semiconductor chips, assembly methods, component units, and system interfaces, contributing to both near‑term product execution and long‑term technology direction. This role requires AI proficiency or AI‑enabled ways of working. Responsibilities: • Define and evolve DRAM system architectures that address performance, capacity scaling, reliability (RAS), and observability requirements. • Collaborate across functions to evaluate architectural trade‑offs spanning DRAM silicon, packaging, modules, boards, and system platforms. • Influence host memory controller and platform architecture through technical engagement with CPU, GPU, and SoC partners. • Contribute to RAS and telemetry feature definition, translating system‑level needs into implementable architectural concepts. • Support exploration of emerging memory technologies and assess their impact on future product roadmaps. • Engage with cus
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. This job requisition is to seek senior technical leaders in the field of process engineering to join ID1, reporting directly to Director of DE/WP/CMP. As a member of technical staff (MTS) or Senior member of technical staff (SMTS), you will play a pivotal role in driving innovation, leading technical projects, defining the technical roadmap, and mentoring fellow engineers. Your expertise will be instrumental in developing cutting-edge DRAM process solutions to support yield ramp-up. Your contribution will have a lasting impact on the DRAM industry! Responsibilities for Process Engineering MTS/SMTS include (but not limited to): Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures. Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability. Define and execute
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 先端DRAM半導体製品において、設備技術部門 DRY ETCH の一員として、量産技術改善から生産技術・管理を横断的に担い、ものづくりを推進する役割になります。 業務詳細 安全トレーニングを受講し、マイクロンの安全ポリシーに従い業務を遂行してもらいます。 設備技術部門 DRY グループ内において、Equipment および Process エンジニアの役割を担います。より高い生産性と高品質の量産技術の確立に向けて、多角的に活動し、課題・改善を進めて行きます。 新規最先端装置の導入や改造を行い、生産計画の向上を進めます。 開発製品の導入時には、製品や生産技術の問題点を洗い出し、関連部門と連携しながら、量産化を実現して行きます。 DRY内において、プロセス担当エンジニア、ファシリティ担当エンジニア、テクニシャンと密にコミュニケーションをとり、改善活動を牽引する。 日々の問題から、長期的なプロジェクトまで参画しながら、上司、チームメンバーそして関係者への報告を行う。マイクロンの海外生産拠点と技術交流にも参加して、情報の共有から、標準化を進めて行きます。 生成 AI やデータ分析ツールを活用し、技術文書作成、知見共有、プロジェクト管理、および意思決定の質向上に貢献する。 要件(全て満たしている必要は無い) 先進的技術に興味を持ち、仕事に前向きに取り組むことができる。 課題を発見し、解決できる能力を有する。 関係部門と協議しプロジェクトを推進する能力を有する。 社内外の人とコミュニケーションを円滑に取ることができる。 Microsoft Office(Excel、PowerPoint、Word)などのソフトウェアを使用できる。 自己管理(業務、健康)ができる。 物事を学び、知識、知見の蓄積知識について、大学卒業以上の知識を有することが望ましい。 日本語で読み書きができる。 AI ツール(生成 AI を含む)を活用して情報収集、データ分析、文書作成、業務改善を行う能力、または新しい AI 技術を主体的に学習・活用する姿勢を有する。 About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. A thorough understanding of semiconductor device physics, process operation,
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