Hbm Advanced Package Process Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Verify IP, subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional correctness, performance, power efficiency, and product quality. Develop comprehensive verification plans from architecture and functional specifications in collaboration with architecture and design teams. Create, enhance, and maintain verification environments, UVM testbenches, test suites, and automated regression infrastructures. Define and execute coverage-driven verification strategies to achieve functional, assertion, and code coverage goals. Lead debug and root-cause analysis of complex design issues, drive bug resolution, and ensure verification closure. Apply advanced digital and mixed-signal verification methodologies using industry-standard simulation and verification tools. Drive continuous improvements in verification methodologies, automation, regression efficiency, and AI-assisted verification workflows. Collaborate closely with global design, architecture, product engineering, and system engineering teams to ensure successful project execution. Lead verification efforts for major HBM development programs and mentor engineers through technical leadership and knowledge sharing. Minimum Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent experience. 10+ years of experience in digital and/or mixed-signal design verification with a proven record of deli

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within Micron’s Heterogeneous Integration Group (HIG), we are driving the next generation of High Bandwidth Memory (HBM) solutions that power advanced computing and AI applications. Our team brings together experts across design, product development, manufacturing, and ecosystem partnerships to solve complex technical challenges and deliver innovative memory technologies. The Design Development Technical Lead (DDTL) plays a critical role in enabling predictable, high-quality execution across the HBM design lifecycle. As the single-threaded technical program owner for HBM Build, you will coordinate cross-functional teams. You will manage technical dependencies and risks. You will provide clear leadership across build, product, and executive collaborators to ensure successful program delivery. Responsibilities: Lead end-to-end execution of HBM build achievements across DRAM, base die, test vehicles, interposers, IP, and sustaining development efforts Drive multi-functional alignment, manage dependencies, and maintain execution plans to achieve schedule, cost, and quality objectives Lead governance activities including design reviews, program reviews, risk management, and change control processes Partner with foundries, IP vendors, contractors, and procurement teams to resolve execution challenges and support design delivery Own roadmap communication, executive reporting, and collaborator alignment for HBM build programs Minimum Qualifications: Bachelor’s degree in Electri

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the HIG HBM Product Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. You will collaborate with cross-functional teams across Product Engineering, Design Engineering , System Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that imp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a build Engineer at Micron Technology, Inc., you will be responsible for crafting and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve design quality and manufacturability. You will coordinate with multi-functional partners to support tape‑out readiness and future technology scaling. This role offers hands‑on impact across the full semiconductor design flow. Responsibilities Contribute to new product opportunities by supporting overall circuit design, layout, and optimization for memory and logic or analog circuits. Perform parasitic modeling and support design validation, including reticle experim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Principal Layout Designer in the Next-generation HBM Architecture Team , you will drive layout for 3D-stacked, high-performance memories. Apply your knowledge to deliver high-quality layout designs across analog and/or mixed-signal domains in collaboration with peer architecture, design, and packaging teams. Implement layout designs for early architecture concepts to demonstrate feasibility and identify optimizations. Responsibilities: Design layouts for critical analog and mixed-signal blocks. Drive exploratory layout process for next-generation architectures, including floorplanning, placement, and routing. Integrate full chip designs and perform layout verification (LVS, DRC), quality checks, and documentation. Collaborate and communicate across domains, including signal integrity, architecture, design, and advanced packaging, to ensure successful architecture exploration. Minimum Qualifications: Hands-on layout experience with critical analog blocks and full designs. Experience with Cadence VLE/VXL and Mentor Graphics Calibre DR

Job Summary Reporting to the Memory Validation leadership team, the Senior Silicon DDR/HBM Validation Engineer will be responsible for the bring-up, validation, characterization and debug of advanced memory subsystems used in next-generation AI compute platforms. The role will focus on DDR and HBM technologies, working closely with silicon design, firmware, characterization, platform and systems teams to ensure robust memory subsystem functionality, performance and reliability. The successful candidate will take ownership of significant validation activities, contribute to debug and root-cause analysis efforts, and help improve validation methodologies, automation and infrastructure. The Team The Memory Validation team sits within the Validation organisation and is responsible for the bring-up, validation, characterization and debug of memory subsystems across Graphcore silicon and platform products. The team supports DDR and HBM validation activities throughout the product lifecycle, from first silicon through production readiness. Engineers work closely with architecture, RTL, firmware, characterization, systems and platform teams to ensure memory technologies meet functionality, performance, reliability and performance objectives. Responsibilities and Duties Execute validation and bring-up activities for DDR and HBM memory subsystems Verify memory bring-up software, firmware and scripts against defined project requirements Debug firmware, hardware and system-level issues and contribute to root-cause analysis activities Analyse system logs, validation data and characterization results to identify failures and performance issues Perform PHY characterization and analog-level analysis during stress testing and validation activities Develop and execute functional, stress, performance and corner-case validation tests Perform signal integrity, voltage, frequency and timing measurements using laboratory instrumentation Char

About the Team OpenAI’s Hardware organization develops system and infrastructure solutions optimized for advanced AI workloads. We collaborate across research, software, and external hardware partners to design and deploy next-generation AI systems at scale. Our team works closely with silicon vendors and system partners to evaluate emerging technologies, validate performance characteristics, and ensure that hardware capabilities translate effectively to real-world AI workloads. About the Role We are seeking a 3P Hardware Architecture Expert with deep expertise in GPU and accelerator architectures to engage directly with silicon vendors and guide hardware decisions for AI infrastructure. In this role, you will evaluate architectural tradeoffs across compute, memory, and interconnect systems, translating vendor specifications into real-world workload impact. You will play a critical role in early silicon evaluation, benchmarking, and performance validation, helping ensure that next-generation hardware meets the needs of our workloads. This role is highly hands-on and requires both deep technical understanding and the ability to engage at a high level with partners such as NVIDIA and AMD on architectural direction and design tradeoffs. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance. Key Responsibilities Engage deeply with silicon vendors (e.g NVIDIA & AMD) on GPU and accelerator architecture tradeoffs. Analyze and interpret performance, power, and efficiency characteristics of next-generation hardware. Translate vendor specifications into expected real-world performance for AI workloads. Evaluate architectural aspects including: compute throughput and utilization memory systems (HBM, cache hierarchies, bandwidth constraints) data types and precision tradeoffs (FP16, BF16, FP8, etc.) interconnect and scaling behavior. Run benchmarks and profiling to validate hardware performance a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the design and own critical HBM analog circuits, including: High‑speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes‑related analog blocks Biasing, reference, and calibration circuits Power delivery and regulation circuits (LDOs, regulators) Define and lead IP interfaces, power domains, clocking schemes, and reset strategies across subsystems Perform detailed pre‑layout and post‑layout simulations Conduct PVT, Monte Carlo, mismatch, and aging analyses Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance Review and sign off on analog layouts Drive layout‑aware build optimizations for advanced nodes <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Introduction: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you eager to be a pioneer in AI and semiconductor breakthroughs? At Micron, we invite a passionate Staff Engineer, Collateral Integration Engineer to join our upbeat group. This opportunity offers the chance to work on innovative technology within a team-orie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build the Future of Memory and AI from India At Micron India , we are helping shape the next generation of memory and storage solutions that power Artificial Intelligence, cloud computing, mobile devices, automotive systems, and data centers worldwide. Join a team of innovators, engineers, and technology leaders working at the forefront of semiconductor design, verification, product development, advanced packaging, data analytics, and manufacturing technology. From pioneering High Bandwidth Memory (HBM) solutions for AI to developing next-generation DRAM and NAND technologies, Micron India plays a critical role in delivering innovations that enable the world's most demanding computing applications. As one of Micron's fastest-growing innovation hubs, our teams collaborate globally to solve complex engineering challenges, accelerate technology development, and transform breakthrough ideas into products used by billions of people around the world. Opportunities Across Micron India Engineering Teams DTPG (Design Technology & Product Group) Design and develop next-generation DRAM, NAND, and emerging memory technologies powering AI, high-performance computing, mobile, and cloud applications. Work across memory architecture, circuit design, layout, verification, characterization, and product engineering to bring cutting-edge semiconductor innovations to market. TD (Technology Development) Drive the future of memory technology

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design and CAD Enablement Own the development, deployment, and support of scalable CAD tools, automation frameworks, design flows, and methodologies for NAND, DRAM, HBM, SoC, mixed-signal, and other advanced semiconductor products. Develop, improve, and maintain infrastructure for circuit build capture, layout, simulation, characterization, implementation, physical verification, and signoff workflows. Create robust software and scripts using Python, Tcl, SKILL, Shell, Perl, C/C&#43;&#43;, Java, Lisp, or related languages to automate engineering workflows, analytics, and quality checks. Evaluate and integrate advanced EDA technologies, AI-assisted engineering solutions, and emerging methodologies to improve productivity, scalability, and silicon quality. Validated ability to demonstrate AI‑assisted (vibe) coding techniques to improve efficiency or automate design and analysis methodologies Leverage AI tools to automate the tools and workflow Applying Artificial Intelligence in workflows to improve build efficiency undefined undefined Lead implementation and signoff activities across physical design, static timing analysis, and design for test for complex digital, memory, SoC, or mixed-signal products. Drive floor planning, power planning, placement, clock tree synthesis, routing, optimization, timing closure, and physical verification to meet power, performance, area, reliability, and sche

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Chip in to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop sophisticated capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5&#43; years of direct CAD or Design experience in mixed-signal, custom IC design flows. Proven experience w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including