Hbm Assembly Production Supervisior Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the design and own critical HBM analog circuits, including: High‑speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes‑related analog blocks Biasing, reference, and calibration circuits Power delivery and regulation circuits (LDOs, regulators) Define and lead IP interfaces, power domains, clocking schemes, and reset strategies across subsystems Perform detailed pre‑layout and post‑layout simulations Conduct PVT, Monte Carlo, mismatch, and aging analyses Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance Review and sign off on analog layouts Drive layout‑aware build optimizations for advanced nodes <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is hiring an experienced MTS - Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams . Key Responsibilities Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration. Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions. Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures. Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior. Assess material prop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Introduction: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you eager to be a pioneer in AI and semiconductor breakthroughs? At Micron, we invite a passionate Staff Engineer, Collateral Integration Engineer to join our upbeat group. This opportunity offers the chance to work on innovative technology within a team-orie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role Overview As a New Product Introduction (NPI) Product Lead within the Cloud Memory Business Unit (CMBU), you will lead end-to-end manufacturing and fulfillment execution for complex new-product sample demand across DDR, LPDDR, CXL-attached DRAM, GDDR and HBM-based memory products and solutions. This role operates across the build-to-ship portion of the NPI execution chain, where material availability, manufacturing progress, yield, holds, finished goods, order readiness and logistics dependencies must be actively managed. You will organize cross-functional teams, expose blockers early, drive recovery actions and maintain momentum across sites and time zones. The role remains grounded in NPI Operations: maintaining accurate demand and execution data, coordinating priorities, tracking builds against committed dates, managing exceptions and ensuring stakeholders receive a clear fact-based view of delivery risk and recovery. What You Will Solve · Supply shortages, material constraints, stuck lots and unclear ownership that prevent builds from progressing to committed dates. · Low yield, excursions, holds, rebuilds, test constraints and site-execution issues that require rapid cross-functional recovery. · Mismatch between approved demand, finished goods, order information and shipment requirements. · Pricing, sales-order, release, customs, logistics and waybill blocks that keep available product from reaching the destination. ·

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are building a global Process Safety function that directly supports the next generation of memory technology. Our team partners across development, manufacturing, and EHS to ensure complex processes scale safely and consistently. If you’re energized by solving high-impact challenges and shaping global safety programs, you’ll find meaningful work here. In this role, you will help drive the Risk-Based Process Safety (RBPS) framework for High Bandwidth Memory (HBM) technologies. You’ll work across global teams to identify and handle safety challenges associated with processes in fast-paced development and manufacturing environments. Your expertise will influence how new technologies are safely developed, transferred, and scaled worldwide. Responsibilities: Lead RBPS governance and drive consistency across sites supporting HBM processes Partner with engineering and manufacturing teams to identify, assess, and mitigate process safety risks tied to new materials and complex processes Support Management of Change (MOC), ensuring timely risk assessments and closure of actions for tool, chemistry, and process changes Facilitate hazard analyses, audits, investigations, and share findings to improve system-wide performance Develop clear updates and guidance for leaders on process safety risks, trends, and program health Minimum Qualifications: Bachelor’s degree in Chemical Engineering, Safety, Industrial Hygiene, or related field 5&#43; years of experience in process e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build the Future of Memory and AI from India At Micron India , we are helping shape the next generation of memory and storage solutions that power Artificial Intelligence, cloud computing, mobile devices, automotive systems, and data centers worldwide. Join a team of innovators, engineers, and technology leaders working at the forefront of semiconductor design, verification, product development, advanced packaging, data analytics, and manufacturing technology. From pioneering High Bandwidth Memory (HBM) solutions for AI to developing next-generation DRAM and NAND technologies, Micron India plays a critical role in delivering innovations that enable the world's most demanding computing applications. As one of Micron's fastest-growing innovation hubs, our teams collaborate globally to solve complex engineering challenges, accelerate technology development, and transform breakthrough ideas into products used by billions of people around the world. Opportunities Across Micron India Engineering Teams DTPG (Design Technology & Product Group) Design and develop next-generation DRAM, NAND, and emerging memory technologies powering AI, high-performance computing, mobile, and cloud applications. Work across memory architecture, circuit design, layout, verification, characterization, and product engineering to bring cutting-edge semiconductor innovations to market. TD (Technology Development) Drive the future of memory technology

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design and CAD Enablement Own the development, deployment, and support of scalable CAD tools, automation frameworks, design flows, and methodologies for NAND, DRAM, HBM, SoC, mixed-signal, and other advanced semiconductor products. Develop, improve, and maintain infrastructure for circuit build capture, layout, simulation, characterization, implementation, physical verification, and signoff workflows. Create robust software and scripts using Python, Tcl, SKILL, Shell, Perl, C/C&#43;&#43;, Java, Lisp, or related languages to automate engineering workflows, analytics, and quality checks. Evaluate and integrate advanced EDA technologies, AI-assisted engineering solutions, and emerging methodologies to improve productivity, scalability, and silicon quality. Validated ability to demonstrate AI‑assisted (vibe) coding techniques to improve efficiency or automate design and analysis methodologies Leverage AI tools to automate the tools and workflow Applying Artificial Intelligence in workflows to improve build efficiency undefined undefined Lead implementation and signoff activities across physical design, static timing analysis, and design for test for complex digital, memory, SoC, or mixed-signal products. Drive floor planning, power planning, placement, clock tree synthesis, routing, optimization, timing closure, and physical verification to meet power, performance, area, reliability, and sche

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to ESD Architecture Leadership & Strategy Define and own ESD architecture and protection strategy for high-speed I/O portfolios including: HBM (High Bandwidth Memory) / DDR / LPDDR PHY I/Os PCIe, USB, Ethernet, MIPI, and proprietary interfaces Lead ESD–I/O co‑design trade‑off decisions, balancing: Aggressive ESD targets (HBM / CDM / MM).Ultra‑low capacitance and leakage requirements Eye margin , jitter , bandwidth , return loss, and impedance matching Drive architectural choices for: Snapback clamps, rail clamps, diode steering networks. Triggered and advanced ESD devices (technology‑dependent). Domain isolation and sequencing protection for sophisticated SoCs Advanced Circuit Design, Modeling & Signoff : Perform and guide ESD circuit design and analysis at block and full‑chip level. Establish simulation methodologies for: Transient ESD stress (TLP‑equivalent behavior). Dynamic clamp triggering and current handling. I/O performance impact (cap loading, ringing, overshoot/undershoot. Own ESD modeling correlation: Work with device/modeling teams on compact models (dynamic R, triggering, CV behavior). Drive correlation between SPICE simulations, TLP/VF‑TLP, and silicon results. Act as the final technical authority for ESD Design reviews and signoff. Silicon Debug, Reliability & Qualification Ownership : Lead silicon-l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Sr Principal CAD & HPC Workflow Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Position Overview Micron is seeking a Senior Principal CAD Engineer to help shape the engineering environment that powers Memory product development across DRAM, HBM, NAND, and custom memory programs. In this high-impact technical role, you will partner with Micron’s CAD Software and HPC teams to architect, modernize, and scale the platforms our worldwide design teams rely on every day, from CAD software infrastructure, project setup flows, and quality-gating solutions to engineering automation and compute workload scalability. You will also define how success is measured. By developing improvement and quality metrics for job management and workflow performance, you will establish customer-facing service levels that give design teams clear visibility into the performance of their environment and give engineering leaders a data-driven path to continuous improvement. Along the way, you will help bring next-generation AI and agentic software solutions into Design Automation, working closely with CAD, Design Engineering, HPC, and EDA vendors. Key Responsibilities Serve as a senior engineer partnering with the CAD Software and HPC team

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a PDE MRDA KEG Engineer / Senior Engineer , you will be responsible for developing, qualifying, deploying, and sustaining advanced defect inspection and metrology solutions that support New Product Introduction (NPI), HBM technology ramps, and High Volume Manufacturing (HVM). You will drive inspection capability readiness, equipment performance improvement, and defectivity reduction through close collaboration with cross functional team. The role requires strong expertise in semiconductor manufacturing, defect inspection technologies, data analytics, equipment qualification, and cross-functional problem solving to enable industry-leading process control and yield performance. Inspection Technology & Equipment Ownership Manage advanced inspection and metrology platforms throughout package development and manufacturing. Develop technology roadmaps and capability strategies to meet future packaging requirements. Drive equipment lifecycle management, capacity planning, and technology insertion activities. Equipment Qualification & Deployment Lead tool installation, qualification (TIQ), release, and production readiness activities. Establish equipment acceptance criteria, qualification methodologies, and deployment pla

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will connect various engineering groups and specialties. You will combine diverse expertise to develop new and improved test strategies, features, and technologies. This role offers an outstanding opportunity to work with the newest technology, helping to build the future of memory and storage solutions. You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Collaborate with Design Engineering (DE) to conduct pre-silicon simulations to validate test strategies and circuits for Test. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE). Support pre-silicon checklist tasks and collaborate with TE to identify vital tester resources. Collaborate with TE and PE to adjust test programs for particular product needs to guarantee that silicon performance aligns with expectations. Support TE by aiding in test program debug, data analysis, and test development using AI assistants. Assist fabrication sites and process integration with test creation to improve effective process feedback. Debug and i

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【募集職種/Position Title】 Senior / Staff / Principal Process Development Engineer 【日本語】 MicronのDRAM Technology Development Process Development Teamは、MicronのDRAMおよびHBM (High Bandwidth Memory) 製品向けのプロセス技術、装置ソリューションを開発する、世界最高水準のエンジニアと技術専門家で構成された組織です。 当チームでは、先端DRAM、HBM、およびCMOS技術の開発を推進しており、リソグラフィ、CVD、ドライエッチ、ウェットプロセス、メタライゼーション、拡散、イオン注入、CMP、先端材料開発など、幅広いプロセス分野で経験豊富な人材を募集しています。 本ポジションでは、ユニットプロセス技術の探索、開発、最適化を担当し、プロセスインテグレーション、デバイス、設計エンジニアと連携しながら、装置メーカーや材料サプライヤーと協働して、次世代のDRAMおよびHBM向けの高性能かつコスト競争力のある技術開発を推進していただきます。 本ポジションでは、半導体プロセス開発、デバイス物理、CMOS技術に関する高度な知識が求められます。また、データ解析能力や材料分析、表面解析技術への理解も重要です。チームワークと高いコミュニケーション能力は、本職務で成功するための重要な要素となります。 歓迎する技術経験 以下の技術分野における実務経験をお持ちの方を歓迎します。 ・成膜技術 (CVD、ALD、PVD) ・エピタキシャル成長技術 (Si、SiGe、選択成長など) ・ゲートスタックおよび誘電体技術 ・先端パターニングおよびドライエッチ技術 ・ウェット洗浄および表面処理技術 ・イオン注入および熱処理技術 ・コンタクト形成、配線メタライゼーション技術 ・化学機械研磨技術 (CMP) ・ストレスエンジニアリングおよび先端材料統合技術 ・先端トランジスタ開発を含むロジック技術開発 ・メモリCMOSおよび周辺回路向けプロセスインテグレーション技術 主な職務内容 以下を含みますが、これらに限定されません。 ・デバイス、プロセスインテグレーション、および製品要求事項の理解 ・技術目標およびコスト目標達成に向けたプロセス技術ロードマップおよびサプライヤー戦略の策定 ・開発環境および量産環境におけるプロセスレシピの開発、最適化 ・構造解析、材料分析、および電気特性評価データの解析 ・デバイス性能、歩留まり、信頼性、およびコスト競争力向上に向けた技術革新の推進 ・AI&#xff08;人工知能&#xff09;を活用した開発業務の効率化、高度化の推進 ・社内関係部門および外部パートナーとの連携による複雑な技術課題の解決 ・技術戦略および開発方針に関する経営層への提言 ・エンジニアの育成、指導を通じた組織能力の向上 ・高い倫理観、オーナーシップ、および他者への敬意を持った業務遂行 応募資格&#xff08;必須&#xff09; ・電気工学、物理学、化学工

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Micron Global Quality FE Central Wafer Quality (SNR) Engineer, you will be a member of the worldwide quality team, responsible for driving quality and reliability initiatives into FE MFG network for compute and mobile products, including LPDDR for critical customer AI applications and support fab expansion quality equivalency governance. You will work closely with DEG PE/PYE/GQ, FE fab teams and Central PIE to establish BKMs, set up program with line of sight metric, develop a strategy and closely work on execution to achieve program milestone. Key program activities include FE and supporting Time to Mature DPM program and Time to Mature Uncorrectable Error program execution for HBM product and improving customer field DPM excellence. Responsibilities and Tasks Provide Strategic Support in Quality Program/Project Management Develop, manage, and/or communicate quality strategy with line of sight metrics and goals to monitor execution health. Lead cross-functional initiatives or enabling projects that support FLT and companywide quality objectives. Develop and drive compliance in global business process related to product quality. Manage the projects to enable the implementation path for new initiatives. Support program expansion for ID1 including 170s DRAM Provide Tactical Support Work with cross-functional team

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Chip in to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop sophisticated capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5&#43; years of direct CAD or Design experience in mixed-signal, custom IC design flows. Proven experience w