Hbm Assembly Production Supervisior Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Principal Layout Designer in the Next-generation HBM Architecture Team , you will drive layout for 3D-stacked, high-performance memories. Apply your knowledge to deliver high-quality layout designs across analog and/or mixed-signal domains in collaboration with peer architecture, design, and packaging teams. Implement layout designs for early architecture concepts to demonstrate feasibility and identify optimizations. Responsibilities: Design layouts for critical analog and mixed-signal blocks. Drive exploratory layout process for next-generation architectures, including floorplanning, placement, and routing. Integrate full chip designs and perform layout verification (LVS, DRC), quality checks, and documentation. Collaborate and communicate across domains, including signal integrity, architecture, design, and advanced packaging, to ensure successful architecture exploration. Minimum Qualifications: Hands-on layout experience with critical analog blocks and full designs. Experience with Cadence VLE/VXL and Mentor Graphics Calibre DR

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Memory Systems Engineering team and contribute to the development of premier digital and mixed-signal foundations for our high-bandwidth memory (HBM) products. This position offers an outstanding chance to work intimately with multiple engineering areas, guaranteeing the smooth integration and implementation of HBM base die. Join a motivated team committed to delivering robust first-pass silicon that meets our strict bandwidth, latency, power, and reliability objectives! Responsibilities Assist in defining and carrying out digital micro-architecture for HBM base-die subsystems, covering channel support logic, boot and initialization sequencing, training orchestration, configuration and status registers, telemetry, performance counters, and reliability features. Translate system requirements into timing, power, and area considerations by partnering with physical layer and system architects, and help maintain interface specifications for bus protocols, clock-domain crossings, and reset strategies. Implement and integrate synthesizable SystemVerilog RTL, including multi-channel logic, interrupts, events, register maps, scan hooks, and design-for-test interfaces, while supporting clean integration and ECO flows. Collaborate with design verification teams to support verification planning, coverage goals, CDC/RDC checks, and debugging of RTL, testbench, and gate-level issues. Support silicon bring-up and post-silicon validation through debug enablement, issue correlation to RTL or architecture, and col

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Mechanical Engineering, Materials Science, or related technical field. Hands-on experience in one or more areas: product development, sys

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Join us as a Senior Verification Engineer and contribute to modular, scalable verification solutions for next-generation HBM DRAM products! You will work independently within a multi-functional team of technical domain experts, spanning both IP-level and SoC-level verification. You will collaborate with Design Engineering, Product Engineering, and Business Units to complete the HBM verification roadmap. You will apply your solid understanding of testbench architecture, custom or SoC verification methodologies, and 2.5D & 3D package integration to evaluate issues, define solutions, and broaden your expertise. Responsibilities: Develop and implement verification plans and architecture collateral across IP-level and SoC-level verification for current and future HBM designs Support co-verification of the overall system and participate in customer interactions to gather feedback and provide recommendations for future HBM solutions Build and improve verification methodology components and GenAI applications aligned to HBM design cycles, broadening cross-disc

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities: Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.</li

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Sr Manager, High Bandwidth Memory (HBM), Product Development Team Leader — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About the Team At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops future High-Bandwidth Memory (HBM) architectures, PHY design methodologies, and automation solutions that enable next-generation AI, high-performance computing, networking, and data center applications. The team works closely with Architecture, Design Engineering, Verification, Product Engineering, and external partners to advance memory technologies while improving design quality, productivity, and development efficiency. Position Overview As a Senior or Graduate Engineering Intern, you will collaborate with experienced HBM architects and engineers to support the development of digital design methodologies, automation frameworks, timing analysis flows, and architecture validation solutions for next-generation HBM PHY and IO subsystems. This role offers hands-on experience in digital design, verification, automation, and timing analysis, while providing opportunities to leverage AI Assisted engineering workflows, Large Language Models (LLMs), and Generative AI tools to enhance engineering productivity and design efficiency. Responsibilities Support digital design, integration, and timing analysis activities for HBM PHY and IO subsystems, including timing constraint development and timing closure efforts. Develop an

Sr Design Verification Engineer/Architect, HBM — Richardson, TX. Apply via Workday.

Senior SOC Physical Design Engineer, HBM — Richardson, TX. Apply via Workday.

New College Grad - Mixed Signal Design Engineer, HBM — Richardson, TX. Apply via Workday.

New College Grad - Design Engineer, HBM DFT — Richardson, TX. Apply via Workday.

Engineering Execution Manager, HIG High Bandwidth Memory (HBM) — Fab 10A, Singapore. Apply via Workday.

New College Grad - Memory Design Engineer, HBM — Richardson, TX. Apply via Workday.