Hbm Hardware Emulation Architect Jobs

HBM PRODUCTION OPERATOR — Taichung - MTB, Taiwan. Apply via Workday.

HBM Engineering Technician — Taichung - MTB, Taiwan. Apply via Workday.

HBM ASSEMBLY PRODUCTION SUPERVISIOR — Taichung - MTB, Taiwan. Apply via Workday.

HBM Customer Systems Validation Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.

HBM ASSY EQUIPMENT ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM Manufacturing Production Engineer — Taichung - MTB, Taiwan. Apply via Workday.

HBM ENGINEERING SUPPORT TECHNICIAN — Taichung - AATT, Taiwan. Apply via Workday.

HBM MRDA SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM Equipment Technician 輪班助理工程師 — Taichung - MTB, Taiwan. Apply via Workday.

HBM 招募專區｜加入 MTB，站上 AI 與先進記憶體最前線 — Taichung - MTB, Taiwan. Apply via Workday.

HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM Customer Systems Validation Engineer — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration. Key Responsibilities Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance. Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements. Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance. Drive cross-functional technical investigations and