Hbm Mrda Shift Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities and Tasks: Coordinate with Internal and External Teams on Preparation for Silicon Work with Manufacturing teams to ensure resources are available Identify HBM Component Validation equipment needs Identify and validate HBM Component Validation equipment and testing flow Ensure that Silicon Meets Product Expectations Debug and identify root cause for failures Implement fixes for fails (Design or Process) Work with Design Validation (DV) and Quality Assurance (QA) Teams on customer returns to identify new tests Work with Global Quality Team (GQ) to ensure reliability Partner with Engineering, Manufacturing and Marketing Create and deliver presentations both inside and outside Micron Participate in meetings Troubleshoot, develop or validate HBM Component Validation testing programs Evaluate data sheets and provide feedback to Application Engineers Prioritize work with other groups Provide Technical Training and Expertise Provide On-the-Job Training (OJT) for new engineers

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Guadalajara, Mexico. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Responsibilities: Design and development of analog, mixed-signal, custom digital block and full chip level integration support. Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Will bee leading planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Effectively communicating with Global engineering teams to assure the success of layout project. Minimum Qualification: 5+ years of experience in analog/custom layout design in advanced CMOS process, in various technology nodes (Planar, Fin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a member of the HIG HBM Media Health HVM team, you will embody an outstanding approach to Next Generation HBM Product driven by important metrics: Quality, Cost, Cycle Time, and Scale. You will work closely with various teams within and outside of HBM to achieve strategic and operational goals. Key Responsibilities Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain effectiveness and efficiency in high-volume manufacturing. Encouraging Innovation: Motivate innovation and inspire changes that will help Micron maintain a technical advantage over its competition, ensuring Micron’s competitive edge in the market. Product Development and Validation: Develop, validate, characterize, and qualify Micron’s next-generation HBM products, ensuring reliability and market readiness. Support for New Product Design Validation: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations. Yield Improvement and Cost Reduction: Improve manufacturing test yields, reduce test time, and resolve yield-related issues, contributing to cost reduction and meeting yield targets. Root Cause and Resolution of Qual and RMA Device Issues: Identify and resolve issues related to device qualification and return material authorization, ensuring product quality. Process Conversions and HVM: Recommen

Sr HBM Design Architect, PhD NCG — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks Your main task will be operating Equipment. Manning of multiple machines Demonstrate ability to use computer based programs and applications to perform daily duties Provide machine coverage during breaks Logging machines accurately Monitoring and awareness of equipment performance discrepancies with timely communication to your Lead Working hours are 12 hours shift with biweekly rotation for day and night. Use Generative AI to enhance daily work quality Ensure Quality of Process and Product Run equipment based on current process specifications (e.g. procedures, change notifications, etc.) Organize own workstations and ensuring 6S Make suggestions to improve quality and safety Complete Certification and Recertification Participate actively in assigned on-the-job and other required training; asking questions to increase knowledge and abilities Complete certification requirements by demonstrating understanding and abilities Communication Information Receive and understand pass down, providing clear, accurate, and detailed pass down Seek and provide feedback to leadership, coworkers, and support groups to make positive changes in performance Offer suggestions for improvements when appropriate Always seek clarification when in doubt Contribute to a Safe and Compliant Work Environment Identify and promptl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within Micron’s Heterogeneous Integration Group (HIG), we are developing advanced High Bandwidth Memory (HBM) solutions that enable the next generation of AI, high-performance computing, and data-centric applications. Our team collaborates across design, product, manufacturing, and ecosystem partners to deliver innovative memory technologies with exceptional quality and execution excellence. The HBM Tapeout and Release Technical Lead plays a critical role in ensuring successful design releases into Micron manufacturing. In this role, you will drive tapeout execution, release readiness, and design governance across complex HBM programs, partnering with design, integration, verification, and product teams to deliver high-quality designs on schedule. Responsibilities: Lead tapeout execution and release coordination for HBM builds, managing schedules, DBR achievements, and release readiness Drive preparation, review, and completion of tapeout collateral, including TOAST, RCDB, TWIT, and related release documentation Coordinate signoff readiness across timing, power, physical verification, integration, and other release-critical activities Ensure database quality, completeness, traceability, and signoff evidence are in place prior to tapeout Manage release risks, waivers, open items, and governance processes while maintaining strong r

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an HBM PE Principal Component Validation Engineer for the Heterogenous Integration Group, you will be part of a forward-thinking team of engineers that solves complex problems, responsible for enabling Micron’s products with flawless and issue free release to both internal and external customers. Responsibilities and Tasks: Coordinate with Internal and External Teams on Preparation for Silicon Work with Manufacturing teams to ensure resources are available Identify HBM Component Validation equipment needs Identify and validate HBM Component Validation equipment and testing flow Ensure that Silicon Meets Product Expectations Debug and identify root cause for failures Implement fixes for fails (Design or Process) Work with Design Validation (DV) and Quality Assurance (QA) Teams on customer returns to identify new tests Work with Global Quality Team (GQ) to ensure reliability Partner with Engineering, Manufacturing and Marketing Create and deliver presentations both inside and outside Micron Participate in meetings Troubleshoot, develop or validate HBM Compone

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Validation Execution Assist in executing Validation Runs on IQP/ETV materials under defined timelines, ensuring coverage completeness across MBIST and Native Mode flows. Support time-bound data crunching (log parsing, statistical summaries) and contribute to summary report preparation. Platform & Test Program Support Operate and debug programs on SM3/Cobra (MBIST) and Advantest V93K (Native) . Assist in hardware readiness: handler, socket, loadboard, and probe card setup. Technical Analysis & Simulation Validate high-speed I/O (>11 Gbps) and assist with eye diagram and signal integrity checks. Support Verilog simulation tasks (testbench execution, waveform review) to reproduce sightings and validate fixes. Data & Automation Develop basic scripts in Python for log parsing and data visualization. Maintain documentation in Confluence/Jira and version control in Git/Perforce. Debug & Collaboration Participate in root cause analysis sessions and assis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has been at the forefront of innovation, delivering the world’s most advanced memory and semiconductor technologies. Our distributed team of engineers, scientists, and visionaries is developing groundbreaking solutions that redefine how the world uses information to enrich life for all. We are seeking a Layout Design Engineering Manager to join Micron’s High Bandwidth Memory (HBM) organization in Guadalajara, Mexico. In this leadership role, you will guide a distributed team focused on developing complex analog, mixed‑signal, and custom layouts powering next‑generation AI and high‑performance computing solutions. Responsibilities Manage a team responsible for crafting and developing critical layouts for analog circuits, mixed-signal components, and custom blocks, including support for full-chip-level integration. Oversee layout verification activities, including LVS, DRC, Antenna checks, documentation, and quality reviews. Ensure timely and high‑quality delivery of block‑level layouts that meet all project requirements. Coordinate planning, area/time estimation, scheduling, task delegation, and execution for multiple concurrent projects. Mentor and guide layout engineers of all levels. Perform detailed reviews of sub‑block‑level layouts. Collaborate with global engineering teams to drive successful project execution and alignment across Micron’s worldwide footprint. </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology has delivered world‑leading memory and semiconductor solutions. As an HBM Memory Design Engineer on the HBM Architecture Team, you will design, simulate, optimize, and floorplan advanced DRAM circuits for next‑generation High Bandwidth Memory products. You will work across digital, analog, and mixed-signal domains to ensure functional correctness, performance, and power efficiency. Your role includes collaborating with globally distributed teams developing modern HBM solutions for AI and ML applications. Responsibilities • Design, simulate, and optimize DRAM memory arrays, data paths, ECC, command/control logic, and high‑speed interface circuits • Evaluate block‑level and full‑chip functionality and propose solutions to ensure functional correctness • Analyze timing, area, power, and complexity trade‑offs in high‑speed DRAM and mixed‑signal designs • Perform pathfinding and feasibility studies for new architectures and future HBM products • Contribute to the design, layout, and optimization of memory, logic, and analog circuits • Support large‑scale verification, debug, and silicon validation activities • Collaborate across multi-functional teams involved in TSV‑based 3D stacking and vertical integration • Participate in design reviews and drive continuous improvement of design methodologies Minimum Qualifications • BSEE with 7&#43; years or MSEE with 5&#43; years of relevant engineering experience • Strong knowledge of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You will evaluate block-level and full-chip functionality, perform architectural pathfinding, and contribute to the development of next‑generation high‑bandwidth DRAM solutions. This role works across diverse engineering teams to deliver functionally accurate, low‑power, and high‑performance HBM products by bringing to bear 3D stacking and TSV-based integration. Responsibilities • Design, simulate, and optimize digital and analog DRAM circuits including data path, ECC, command/control, and high‑speed timing structures • Evaluate full‑chip and block‑level functionality and propose solutions to achieve correct circuit and system behavior • Perform timing, area, power, and complexity analysis for high‑speed DRAM and mixed‑signal circuits • Conduct pathfinding studies and feasibility analyses for future HBM architectures • Contribute to the development, layout, and optimization of memory, logic, and analog circuits • Analyze circuit behavior under varying PVT and parasitic conditions to ensure robust operation • Collaborate with multi-functional teams across build, verification, product engineering, process, and packaging • Support design reviews, documentation, and continuous improvement of design methodologies Minimum Qualifications • BSEE with 7&#43; years, or MSEE with 5&#43; years of releva

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts Experience with wafer probe and fin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology, Inc. has advanced the world’s most innovative memory and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you will design, simulate, and optimize digital and analog DRAM circuits for next‑generation high‑bandwidth memory products. You will evaluate block‑level and full‑chip functionality, solve complex challenges in building, and collaborate with a distributed team to deliver highly reliable, industry‑leading HBM solutions. This role provides the opportunity to contribute to groundbreaking DRAM design, TSV‑based 3D integration, and high‑speed mixed‑signal architectures supporting Machine Learning and AI applications. Responsibilities Design and analyze digital, analog, and mixed‑signal circuits for HBM DRAM products. Perform schematic entry, simulation, and optimization of DRAM blocks including data path, ECC, command control, and clocking circuits. Evaluate full‑chip and block‑level functionality and deliver solutions ensuring functional accuracy. Conduct pathfinding and feasibility studies for next‑generation HBM architectures. Optimize circuit timing, area, power, and complexity across high‑speed DRAM designs. Support design floor planning, layout reviews, and cross‑domain integration of memory, logic, and analog circuits. Collaborate with global engineering teams to drive innovation and support vertical integration across design

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and control logic, as well serializing and de-serializing scheme. You will collaborate with a highly creative and motivated development team applying brand-new memory technologies to build groundbreaking HBM products! Responsibilities: Responsible for the high-speed DRAM and Base die interface in HBM cube. Design the DRAM command and control logic, as well as serializing and de-serializing scheme at the interface. Conduct circuit simulations using standard industry simulators such as FINESIM, HSPICE and VERILOG Collaborate with data path design on floor planning and full chip testbench. Analyze timing/area/power in high-speed DRAM or mixed-signal design. Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits. Qualifications: Extensive experience with DRAM operation and JEDEC specifications across DDR, LPDDR, GDDR, and HBM product families. Strong technical expertise in analog and mixed-signal circuit design. Hands-on proficiency in DRAM command decoding, bank logic, and RAS/CAS chain design. Demonstrated innovation and problem‑solving capabilities in