Hbm Mrda Shift Process Engineer Jobs

ENGINEER - HBM VERIFICATION — Jalisco, Mexico. Apply via Workday.

Staff HBM Design Architect — 2 Locations. Apply via Workday.

Probe HBM application integration engineer — Taichung - TCP, Taiwan. Apply via Workday.

MTB HBM Assembly Equipment Manager — Taichung - MTB, Taiwan. Apply via Workday.

Intern - HBM SoC RTL Design Engineer — Folsom, CA. Apply via Workday.

TCP HBM production technician — Taichung - TCP, Taiwan. Apply via Workday.

MTB HBM Manufacturing Engineer — Taichung - MTB, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal/MTS Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction At Micron's High Bandwidth Memory (HBM) team, we develop advanced memory solutions that enable next-generation artificial intelligence and high-performance computing applications. We collaborate across global engineering teams to deliver innovative semiconductor technologies that help transform how the world uses information. Join us and help build the future of memory innovation! Position Overview As a Layout Build Engineer within the HBM organization in Guadalajara, Mexico, you will develop and integrate analog, mixed-signal, and custom digital layouts for advanced memory solutions. You will support physical build implementation, verification, and project execution while collaborating with global engineering teams to deliver high-quality layouts on schedule. This role contributes directly to AI-enabled and high-performance computing products through efficient and reliable layout development. Responsibilities Develop analog, mixed-signal, custom digital block layouts, and support full-chip integration activities. Perform layout verification activities, including Build Rule Check (DRC), Layout Versus Schematic (LVS), antenna checks, quality reviews, and documentation. Deliver block-level layout builds on schedule while meeting established quality requirements. Lead layout planning, area and schedule estimation, task delegation, and execution across multiple concurrent projects. Work together with international engineering groups to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal Engineer, you will be a senior technical authority who owns complex validation scopes, optimizes test flows, and leads technical problem solving for next generation HBM products. You’ll drive coverage completeness, improve detection efficiency, and mentor junior engineers—ensuring flawless product readiness through deep platform, Verilog simulation, and analysis expertise. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient IQP/ETV material usage . Own time‑bound data crunching pipelines (automated log parsing, metrics aggregation, anomaly ranking) and deliver decision‑ready summary reports and sightings by agreed Cycle Time. Guarantee coverage completeness across MBIST and flows; drive Hot/Cold corners , TSV screen/AQLK , async timing boundary coverage, and evidence‑backed closure . Platform Leadership Develop and debug test programs on SM3/Cobra and Advantest V93K ; enforce code quality, reviews, and r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits • AI Relevant Job Responsibilities: - Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. - Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. - Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how th

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient material usage . Own time‑bound data crunching pipelines (automated log parsing, metrics aggregation, anomaly ranking) and deliver decision‑ready summary reports and sightings by agreed Cycle Time. Guarantee coverage completeness across Validation flows; drive Hot/Cold corners , screen , timing boundary coverage, and evidence‑backed closure . Platform Leadership Develop and debug test programs on ATEs like Advantest and In-house ATE; enforce code quality, reviews, and release discipline. Align hardware configs ( handler, socket, loadboard, probe card ) to test intent and throughput targets. Advanced Analysis, Verilog Simulation & Automation Perform power/thermal characterization ; correlate IDD/thermal data with performance/reliability; author recommendations for content changes and silicon fixes. Architect and execute Verilog simulations (bench cre

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions for AI, machine learning, and high-performance computing applications. We are seeking an experienced HBM Architecture Engineer to define and drive the architecture of high-speed analog and mixed-signal IO subsystems for HBM products. This role focuses on PHY IO architecture, timing methodology, analog calibration schemes, and silicon learning frameworks that enable industry-leading bandwidth, power efficiency, and robustness. The successful candidate will collaborate across Design, Product Engineering, Modeling, Verification, Packaging, and System Architecture teams to define architectural requirements, drive technology innovation, and ensure successful translation from concept to silicon. As a technical leader, you will influence future HBM roadmap decisions, develop engineering methodologies, and mentor design teams on architectural principles, calibration strategies, and best practices for high-speed IO design. Key Responsibilities Define and drive next-generation HBM PHY and IO architecture , balancing performance, power, area, reliability, and manufacturability requirements. Architect high-performance transmit and receive paths , including clocking, signaling, equalization, timing alignment, and interface optimization. Define and optimize analog calibration architectures , including impedance calibration, reference v