Hbm Mtb Ai Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【募集職種/Position Title】 Senior / Staff / Principal Process Development Engineer 【日本語】 MicronのDRAM Technology Development Process Development Teamは、MicronのDRAMおよびHBM (High Bandwidth Memory) 製品向けのプロセス技術、装置ソリューションを開発する、世界最高水準のエンジニアと技術専門家で構成された組織です。 当チームでは、先端DRAM、HBM、およびCMOS技術の開発を推進しており、リソグラフィ、CVD、ドライエッチ、ウェットプロセス、メタライゼーション、拡散、イオン注入、CMP、先端材料開発など、幅広いプロセス分野で経験豊富な人材を募集しています。 本ポジションでは、ユニットプロセス技術の探索、開発、最適化を担当し、プロセスインテグレーション、デバイス、設計エンジニアと連携しながら、装置メーカーや材料サプライヤーと協働して、次世代のDRAMおよびHBM向けの高性能かつコスト競争力のある技術開発を推進していただきます。 本ポジションでは、半導体プロセス開発、デバイス物理、CMOS技術に関する高度な知識が求められます。また、データ解析能力や材料分析、表面解析技術への理解も重要です。チームワークと高いコミュニケーション能力は、本職務で成功するための重要な要素となります。 歓迎する技術経験 以下の技術分野における実務経験をお持ちの方を歓迎します。 ・成膜技術 (CVD、ALD、PVD) ・エピタキシャル成長技術 (Si、SiGe、選択成長など) ・ゲートスタックおよび誘電体技術 ・先端パターニングおよびドライエッチ技術 ・ウェット洗浄および表面処理技術 ・イオン注入および熱処理技術 ・コンタクト形成、配線メタライゼーション技術 ・化学機械研磨技術 (CMP) ・ストレスエンジニアリングおよび先端材料統合技術 ・先端トランジスタ開発を含むロジック技術開発 ・メモリCMOSおよび周辺回路向けプロセスインテグレーション技術 主な職務内容 以下を含みますが、これらに限定されません。 ・デバイス、プロセスインテグレーション、および製品要求事項の理解 ・技術目標およびコスト目標達成に向けたプロセス技術ロードマップおよびサプライヤー戦略の策定 ・開発環境および量産環境におけるプロセスレシピの開発、最適化 ・構造解析、材料分析、および電気特性評価データの解析 ・デバイス性能、歩留まり、信頼性、およびコスト競争力向上に向けた技術革新の推進 ・AI（人工知能）を活用した開発業務の効率化、高度化の推進 ・社内関係部門および外部パートナーとの連携による複雑な技術課題の解決 ・技術戦略および開発方針に関する経営層への提言 ・エンジニアの育成、指導を通じた組織能力の向上 ・高い倫理観、オーナーシップ、および他者への敬意を持った業務遂行 応募資格（必須） ・電気工学、物理学、化学工

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Integration Lead in the HIG HBM Product Development Team at Micron Technology, you will be responsible for integrating Micron's leading edge HBM products into end-system requirements. You will be the key representative driving HBM development swimlane requirements (SCD) to meet end-systems needs. With a deep understanding of both HBM and System capabilities, you will set Product Development priorities and manage new change initiative requests to meet rapidly evolving customer demands with agility. You will drive resolution of technical challenges in the development cycle, identifying opportunities to ensure HBM solutions are executed within the boundary of development schedule, risks and incremental development costs. Key Responsibilities include, but are not limited to: Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD). C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next generation High Bandwidth Memory (HBM) architectures and circuit blocks. The HBM DFT Design Engineer is responsible for defining, designing, and integrating Design for Test (DFT) architectures for next generation High Bandwidth Memory (HBM) products. This role ensures robust test coverage across wafer, die, stack, and system in package (SiP) test stages while balancing performance, power, area, and manufacturing cost. The engineer works in a multi-functional manner with HBM build, verification, product engineering, test enablement, packaging, and external partners to deliver manufacturable, high quality HBM solutions. Responsibilities will include, but are not limited to: Define and implement HBM DFT architectures, including scan, MBIST, JTAG, boundary scan, TSV test, redundancy test, and at‑speed test structures. Develop DFT solutions for both base die and DRAM die, considering stacked‑die and cube‑level test requirements. Design and integrate test access mechanisms to support wafer probe, cube test, and SiP/system test flows. Collaborate with Product Engineering and Test Enablement teams to align DFT features with manufacturing test flows and cost targets. Support yield learning, failure analysis, and debug by enabling observability and controllability in silicon. Work closely with logic, analog, layout, verification, and physical design teams to ensure DFT is

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Contribute to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop advanced capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. applying Artificial Intelligence Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5+ years of direct CAD or Design experience in mixed

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction The Central Process Integration Engineering (cPIE) Loop Integration team drives process optimization, defect reduction, structural performance improvement, and technology integration across Micron's advanced DRAM and HBM manufacturing network. We are ready for the future! The team serves as the technical owner of critical process loops including FEOL, MOL, CAP, BEOL, Uniformity, and Backside Engineering, partnering closely with Process Engineering, Yield Engineering, RDA, Manufacturing, and Technology Development teams to accelerate yield learning and qualification readiness! Position Overview As a Senior Process Integration Engineer, you will own process loop performance across one or more critical semiconductor manufacturing modules. You will identify process interactions, drive yield improvement, characterize failure mechanisms, and enable successful deployment of new technologies from development through high-volume manufacturing. This role provides opportunities to influence process architecture, conversion strategies, inline monitoring systems, and technology ramp execution while collaborating with global engineering teams across multiple sites. In support of Micron's AI transformation, you will be expected to harness Artificial Intelligence tools and advanced analytics to improve engineering productivity, accelerate problem solving, and enhance process understanding. Responsibilities Drive process loop performance and structural optimization for assigned

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab-technology co-optimization , and advance Micron's leadership in data-driven semiconductor memory innovation. Qualifications: Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Solid experience with Plasma, FPM, HAR etching, and MC modeling Experience with Wet Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HBM Design Architecture — Principal Engineer Role Overview We are seeking a highly motivated HBM Design Architecture Engineer (Principal Engineer) to drive exploration and definition of next‑generation AI memory and system environments. In this role, you will analyze emerging infrastructure trends, build performance models, and develop/extend tooling that informs HBM architecture decisions and system‑level trade‑offs. You will work closely with architects and senior engineers across DTPCO, Design, and Product/System teams to translate AI workload requirements into actionable memory subsystem and architectural intercept strategies. Key Responsibilities You will own and contribute to projects such as: Research and synthesize emerging trends in compute, networking, and storage infrastructure to anticipate how future AI systems will evolve. Lead HBM architecture analysis by defining bandwidth/latency targets, identifying constraints, and translating workload and system data into actionable memory requirements. Develop and maintain simulation frameworks to model AI cluster performance and memory subsystem behavior; validate models against internal and external benchmarks. Build and apply first‑order performance models spanning HBM bandwidth/latency, GPU/CPU interactions, and memory hierarchy trade‑offs to guide architectural decisions. Create and curate trend dashboards using CSP benchmar

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Department Overview: DRAM Engineering (DRAM Memory) focuses on designing and developing Micron’s industry leading dynamic random access memory products. The team drives process R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. We work across architecture, engineering, and business teams to evaluate innovative memory solutions and influence product direction. If you’re excited about solving complex challenges in DDR and emerging memory technologies, you’ll find strong impact and collaboration here! We are seeking an experienced Distinguished Member of Technical Staff (DMTS) Design Engineer to join the DRAM System team. This role is at the center of memory innovation. You will analyze current and next-generation memory technologies, identify performance and design gaps, and guide teams on future memory direction. Your work will directly influence architecture, product strategy, and competitive positioning, making it both highly visible and technically rewarding. This position is intended to be part of the Technical Leadership Program at Micron. This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Location: Boise, ID or San Jose, CA Responsibilities:

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. At Micron, we believe in encouraging a culture of innovation and excellence. The PDE Process Integration (PI) Senior Manager role offers an outstanding chance to lead a distributed team in defining, standardizing, and driving High Bandwidth Memory (HBM) New Product Introduction (NPI) success across several locations. This position blends strategic leadership, scaling of operations, and coordination across sites. It aims to ensure consistent PI readiness, faster yield ramp, and strong risk management from development through High Volume Manufacturing (HVM). Job Responsibilities Define and drive PI strategy, standards, and guidelines across HBM programs. Coordinate PI execution across multiple HBM NPI programs, ensuring delivery against network-level achievements and ramp targets. Ensure robust risk identification, early detection mechanisms, and mitigation strategies. Serve as the central PI leader collaborating with various engineering and manufacturing organizations. Champion the adoption of AI-enabled tools for yield analysis and risk prediction. Organizational Leadership & Talent Strategy Guide and grow a group of PI managers and senior engineers spanning several locations or departments.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information into intelligence through industry-leading memory and storage solutions. The Process Development Engineering team drives innovation for future DRAM and HBM technologies by developing and optimizing semiconductor manufacturing processes that enable next-generation memory products. Our engineers work at the intersection of advanced research and high-volume manufacturing to solve complex technical challenges and accelerate technology advancement. As a Process Development Engineering Intern, you will gain hands-on experience in semiconductor process development while working on a dedicated technical project within a fast-paced research and development environment. Under the mentorship of experienced engineers, you will collaborate across process and equipment teams to develop innovative solutions that meet demanding product requirements. The internship concludes with a formal presentation of your project results to technical and leadership audiences. Responsibilities Develop and optimize semiconductor processes that meet physical and electrical performance requirements for current and future memory products. Partner with multi-functional process and equipment engineering teams to identify and implement process improvements. Perform root-cause analysis and failure-mode analysis to identify process limitations and develop corrective actions. Conduct fundamental research to support next-generation memory technologies and process innov

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Process, Metals, CVD, Diffusion, and CMP. You will work on state of the art and best in class </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout. · Interpret product specifications and design circuits to meet the required functionality. · Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators , DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory ( HBM ) products · Integration of modules with Power delivery network and propose design solution for optimum performance · Deep understanding of Array and its peripheral circuits. · Driving innovation into the future Memory generations within a dynamic work environment · Validate & optimize design for reliability (Device stress, Aging effect) · EM/IR simulation, optimize layout to achieve best circuit performance ·