Hbm Mtb Ai Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the HIG HBM Product Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. You will collaborate with cross-functional teams across Product Engineering, Design Engineering , System Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that imp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. High-bandwidth memory (HBM) is an innovative memory solution that uses 3D stacking of DRAM for fast speeds, expansive bandwidth and low power per transaction. HBM is primary solution for AI applications. As a Micron Global Quality FE Central (Senior) QE Product Engineer, you will be a member of the worldwide quality team, responsible for driving quality and reliability initiatives into FE MFG network for high bandwidth memory (HBM) product for critical customer AI applications. You will work closely with PE/GQ QRA/FE fab teams and Central PIE to establish BKMs, set up program with line of sight metric, develop a strategy and closely work on execution to achieve program milestones for customer field DPM excellence. You will also work with smart manufacturing AI team for automation and AI solution development and deployment to continue helping HBM quality management with AI transformation. Responsibilities and Tasks: <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. DRAM ASIC Architecture Role Overview Micron is seeking an experienced architect to drive the definition of next-generation DRAM products incorporating advanced CMOS-based logic die technologies. This role will help define how future DRAM products leverage advanced CMOS logic die technologies to enable higher levels of integration, observability, reliability, power efficiency, security, and system differentiation beyond what is achievable in conventional DRAM-only implementations. The architect will define architectures that leverage advanced logic die capabilities to complement and enhance DRAM functionality across LPDDR, DDR, HBM and future heterogeneous memory solutions. The successful candidate will architect I/O, reliability, manageability, interface, test and system-enhancement functions. The role requires strong collaboration across DRAM design, ASIC architecture, packaging, process technology, product engineering, validation, firmware, and system architecture teams. Key Responsibilities Define next-generation DRAM &#43; logic-die architectures, including functional partitioning between DRAM arrays, peripheral circuitry, and advanced CMOS logic die platforms – to optimize performance, power, cost, reliability, and product differentiation. Identify and evaluate system, interface, reliability, test, management, and control functions that may benefit from advanced logic-die implementations; perform architectural tradeoff analysis coverin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Dry Etch Lead Principal Engineer at Micron Technology, Inc. Micron is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM, and other memory-based systems. As the only memory fab in the western hemisphere, Micron is in the industry for over forty-five years and continues to stay as the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and still growing. Responsibilities: Develop dry etch processes to meet physical and electrical product requirements Optimize processes to reduce cost, variability, and improve capability Collaborate with integration and process teams to develop innovative solutions Perform root cause and failure mode analysis and drive vendor improvements Support pilot line operations and transfer processes to production sites Minimum Qualifications: Bachelor’s degree in Engineering, Physics, or related field 3&#43; years of relevant experience including internships Strong analytical and creative problem‑solving skills Working knowledge of statistics and statistical process control Ability to manage multiple projects and work independently Preferred Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding Perform root‑cause and failure‑mode analysis a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description The MSH PDE Process Integration (PI) Manager leads a team of Process Integration engineers responsible for the successful execution of High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing (HVM) . This role combines people leadership, technical oversight, and cross‑functional execution , ensuring PI readiness, yield ramp, and risk mitigation across wafer fabrication, assembly, and test. The manager is accountable for delivering NPI commitments while developing a strong, scalable PI organization. Job Responsibilities People Leadership & Talent Development Lead, coach, and develop a team of MSH PDE PI engineers across multiple experience levels Set clear expectations, goals, and priorities aligned to NPI and business objectives Provide regular feedback, performance evaluations, and career development guidance Build organizational capability through hiring, onboarding, mentoring, and succession planning Foster a culture of accountability, collaboration, and technical excellence HBM NPI Execution & Delivery Own PI execution for HBM NPI programs, en

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role We are looking for a passionate and innovative ATE Test Engineer to design and deliver cutting-edge test solutions for HBM-DRAM devices using modern advanced ATE platforms. In this role, you will lead the development and implementation of test plans, ATE test programs, silicon validation, and test methodologies, while driving multi-site hardware design and development, product characterization, and high-volume production support. Success in this position requires a forward-thinking mindset and the ability to apply the right technologies to meet evolving challenges. Key Responsibilities Develop and implement robust test strategies, plans, and ATE programs for HBM-DRAM devices. Drive silicon validation, characterization, and yield improvement initiatives. Design and debug test hardware, including schematic capture and PCB layout. Collaborate cross-functionally to ensure seamless integration of test solutions into production. Support high-volume manufacturing and troubleshoot complex test issues. Qualifications & Skills Education: Bachelor’s or Master’s degree in Electrical, Electronics or Computer Engineering. Experience: A

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will act as a key interface between a variety of engineering groups and specialties, improving a diverse range of expertise to innovate new and improved test strategies, features, and technologies! You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering (DE) to run simulations pre-silicon to validate test strategies and Design for Test circuits. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE) Assist in pre-silicon checklist items and work with TE to define required tester resources Work with TE and PE to modify test programs for specific product requirements to ensure that silicon performance meets expectations Support TE by aiding in test program debug, data analysis, and test development Support fabrication sites and process integration through test development to increase effective process feedback Debug and identifying root causes for failures using test and experimental data, and elec

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a Senior/Staff Product Quality and Reliability Assurance Engineer (PQRA), you will support reliability qualification and quality monitoring of High Bandwidth Memory products (HBM), help develop product reliability methodologies, and respond to product deviations as they pertain to quality and reliability. You will establish and implement requirements, specifications and metrics such as Defects per Million (DPM), Failure in Time (FIT), and Lifetime. In this role, you will work with multi-functional Engineering teams to ensure product reliability methods are established and followed, perform risk assessments, and provide support for manufacturing teams regarding reliability issues. In this dynamic role, you will have opportunities to gain new product knowledge on an ongoing basis! You will: Conduct New Product Qualifications Define High Bandwidth Memory (HBM) qualification requirements Comprehend failures and failure rate within the scope of the qualification Perform risk assessment at all decision points within the qualification cycle Review qualification data and sign off that qualification requirements have been met Issue internal product release notifications for Qualification <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a Senior/Staff Product Quality and Reliability Assurance Engineer (PQRA), you will support reliability qualification and quality monitoring of High Bandwidth Memory products (HBM), help develop product reliability methodologies, and respond to product deviations as they pertain to quality and reliability. You will establish and implement requirements, specifications and metrics such as Defects per Million (DPM), Failure in Time (FIT), and Lifetime. In this role, you will work with multi-functional Engineering teams to ensure product reliability methods are established and followed, perform risk assessments, and provide support for manufacturing teams regarding reliability issues. In this dynamic role, you will have opportunities to gain new product knowledge on an ongoing basis! You will: Conduct New Product Qualifications Define High Bandwidth Memory (HBM) qualification requirements Comprehend failures and failure rate within the scope of the qualification Perform risk assessment at all decision points within the qualification cycle Review qualification data and sign off that qualification requirements have been met Issue internal product release notifications for Qualification <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The TSE Technician – HBM Probe supports Test Solutions Engineering (TSE) activities for High Bandwidth Memory (HBM) products at wafer probe. The role executes operational, data, and system‑level tasks that enable efficient HBM probe evaluations, production releases, and yield/debug activities , working closely with TSE engineers across NPI and high‑volume manufacturing phases. This position is critical in supporting fast‑paced HBM development cycles where tight execution, data discipline, and cross‑functional coordination are essential. Key Responsibilities Support HBM probe activities by executing requests from TSE engineers, including: Evaluation and production lot assignment, tracking, and coordination Lot handling, status monitoring, and execution follow‑up Attribute tagging, traveler setup, and hold / release execution Support experiments and investigations related to: Yield improvement Test time optimization Test errors and probe‑related issues Perform data mining and generate reports with basic analysis to support: Engineering debug and root‑cause investigations NPI learning cycles and ramp readiness Production