Hbm Mtb Ai Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and cov

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Senior/Staff Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal/Snr/Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a key team member within the HIG HBM Product Engineering Advanced Data Analytics team, you will be spearhead and develop a high-performing team to drive initiatives that significantly enhance yield and quality through advanced data analysis, machine learning, and AI. Your responsibilities will include developing cutting-edge algorithms, creating robust product disposition solutions, and establishing a proactive deviation alert system for yield and quality, enhancing data infrastructure, mentor team members, and fostering innovation to maintain a competitive edge. You will also collaborate with cross-functional teams within and outside of HBM to achieve both strategic and tactical objectives, continually maximizing the effectiveness of the HIG HBM PE organization, focusing on critical KPIs such as quality, cos

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Member of Technical Staff, SoC Power and Physical Architect in the Next-generation HBM Architecture Team, you will drive SoC-level specification 3D-stacked, high-performance memories. Apply your knowledge to analyze SoC trade-offs in close collaboration with peer architecture and design teams. Drive power architecture, physical planning, and early SoC design activities, including definition of IP interfaces (e.g., signals, power delivery), clocking, power sequencing, design-for-test, floorplanning, and specification development. Responsibilities: Define clocking architectures, power sequencing, power delivery, and on-die signal interfaces. Define and analyze on-die power delivery networks (PDN) and full-chip thermal implications, including power hot-spot identification and mitigation. Define DFT architectures (e.g., scan chain topology) and set verification requirements. Define SoC floorplans in collaboration with physical designers. Compose and maintain clear SoC physical documentation. Preferred Qualifications: Experie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the HIG HBM Product and System Engineering organization, you will be leading a team of engineers building the predictive models that determine how HBM is screened, dispositioned, and tested in high-volume manufacturing. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. You will collaborate with cross-functional teams across Product and System Engineering, Design Engineering, Test Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that improve quality, cost, cycle time, and engineering efficiency. Also, you will need to be experienced as people leader and manager and able to lead, manage and coach a group of engineers. Key Responsibilities Mentorship and Development: Actively mentor and develop tea

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Job Summary Reporting to the Memory Validation leadership team, the Senior Silicon DDR/HBM Validation Engineer will be responsible for the bring-up, validation, characterization and debug of advanced memory subsystems used in next-generation AI compute platforms. The role will focus on DDR and HBM technologies, working closely with silicon design, firmware, characterization, platform and systems teams to ensure robust memory subsystem functionality, performance and reliability. The successful candidate will take ownership of significant validation activities, contribute to debug and root-cause analysis efforts, and help improve validation methodologies, automation and infrastructure. The Team The Memory Validation team sits within the Validation organisation and is responsible for the bring-up, validation, characterization and debug of memory subsystems across Graphcore silicon and platform products. The team supports DDR and HBM validation activities throughout the product lifecycle, from first silicon through production readiness. Engineers work closely with architecture, RTL, firmware, characterization, systems and platform teams to ensure memory technologies meet functionality, performance, reliability and performance objectives. Responsibilities and Duties Execute validation and bring-up activities for DDR and HBM memory subsystems Verify memory bring-up software, firmware and scripts against defined project requirements Debug firmware, hardware and system-level issues and contribute to root-cause analysis activities Analyse system logs, validation data and characterization results to identify failures and performance issues Perform PHY characterization and analog-level analysis during stress testing and validation activities Develop and execute functional, stress, performance and corner-case validation tests Perform signal integrity, voltage, frequency and timing measurements using laboratory instrumentation Char

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 メトロロジー プロセス開発エンジニアは、次世代DRAMおよびHBM技術を支える先端計測技術の開発・導入を担当します。 測定レシピ開発、データ解析、計測装置の評価・立上げに加え、装置サプライヤーと連携した新規計測装置の開発にも携わります。 半導体業界での経験は必須ではなく、製造業で培った分析力や問題解決力を活かしながら、世界中のエンジニアと協働し、最先端メモリ技術の開発に挑戦できるポジションです。 職務内容 先端DRAM/HBM技術向けの新規計測手法および測定レシピの開発・認定 測定結果の解析および測定精度改善に向けた問題解決活動 新規計測装置および測定技術の評価・導入 計測装置の開発業務&#xff08;要求仕様の検討・策定、サプライヤーとの調整・開発推進、完成後の装置立ち上げ・導入までを一貫して担当&#xff09; プロセス管理戦略の策定およびモニタリング計画の構築 実験データおよび量産データを活用したプロセス改善・歩留まり改善支援 プロセスインテグレーション、製造、歩留まり改善、装置エンジニアリング部門との協業 計測装置サプライヤーとの技術レビューおよび開発推進 設備投資計画&#xff08;Capital Planning&#xff09;、設備設置、立ち上げ、認定活動の支援 AIツールを活用した業務効率改善およびデータ活用の推進 必須条件 学士卒以上&#xff08;電気・電子、材料、物理、化学、化学工学、機械工学などの理工系関連分野&#xff09; 製造業または技術系職種における業務経験 論理的思考力および問題解決能力 データを基に課題を分析し、改善策を検討できる能力 日本語による円滑なコミュニケーション能力&#xff08;目安&#xff1a;JLPT N2以上&#xff09; 英語によるコミュニケーションに抵抗がないこと AIツール&#xff08;Anthoropic Claude、Microsoft 365 Copilot等&#xff09;を活用しながら業務効率向上や課題解決に取り組めること 歓迎条件 半導体業界における実務経験 自動車、化学、精密機械、電子部品等の製造業での経験 計測機器、分析装置、生産設備に関する知識または経験 XRD、SIMS、OCD、Scatterometry、CD-SEM、Film Metrology等に関する知識 統計解析や工程管理手法に関する経験 DRAM、HBM、NANDなど先端メモリ技術への興味・関心 海外メンバーとのプロジェクト経験 求める人物像 論理的に物事を整理し、課題解決に取り組める方 指示待ちではなく、自ら考え行動できる方 多様なバックグラウンドを持つメンバーと協働できる方 新しい技術やAIツールの活用に前向きな方 グローバルな環境で成長したい方 <li