Hbm Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities Responsible for Design and development of critical Design and Co-optimization objectives, mixed-signal, custom digital block and full chip level integration support. Build and tapeout PWF Reticles Design Engage with Scribe Design team to capture Advanced Packaging requirements and Review TSV design engagement with HIG-HBM DTPCO teams (electrical , thermal and mechanical performance) Creation and Maintenance of DFMEA related to advanced packaging process steps like PWF, die stacking etc Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. At Micron, we believe in encouraging a culture of innovation and excellence. The PDE Process Integration (PI) Senior Manager role offers an outstanding chance to lead a distributed team in defining, standardizing, and driving High Bandwidth Memory (HBM) New Product Introduction (NPI) success across several locations. This position blends strategic leadership, scaling of operations, and coordination across sites. It aims to ensure consistent PI readiness, faster yield ramp, and strong risk management from development through High Volume Manufacturing (HVM). Job Responsibilities Define and drive PI strategy, standards, and guidelines across HBM programs. Coordinate PI execution across multiple HBM NPI programs, ensuring delivery against network-level achievements and ramp targets. Ensure robust risk identification, early detection mechanisms, and mitigation strategies. Serve as the central PI leader collaborating with various engineering and manufacturing organizations. Champion the adoption of AI-enabled tools for yield analysis and risk prediction. Organizational Leadership & Talent Strategy Guide and grow a group of PI managers and senior engineers spanning several locations or departments.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: Micron's DRAM organization focuses on designing and developing industry leading dynamic random access memory products. These teams drive R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. Our Process Integration team is at the center of advancing next‑generation memory technology. We work closely across engineering, manufacturing, and change management to turn data into action and keep programs moving forward. If you enjoy solving complex problems and seeing your impact on real products, you’ll find a home here! We’re hiring a Senior Process Integration Technician to partner with Module Engineers and help drive day-to-day execution. This role is essential to keeping experiments, conversions, and production priorities on track through strong coordination and clear communication. You’ll play a hands‑on role in data analysis, issue resolutions, and cross‑functional alignment to support key technology milestones. Responsibilities Collaborate with cross-functional teams to interpret and complete conversions for assigned PI Engineering Module. Serve as the primary point of contact for experiment coordination, conversion activities, and lot movement logistics. Partner with PI Module Owners, Process Area Owners, PI Conversion Coordinators, and Change Management teams to ensure alignment and execution of module support tasks

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Department Overview: DRAM Engineering (DRAM Memory) focuses on designing and developing Micron’s industry leading dynamic random access memory products. The team drives process R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. We work across architecture, engineering, and business teams to evaluate innovative memory solutions and influence product direction. If you’re excited about solving complex challenges in DDR and emerging memory technologies, you’ll find strong impact and collaboration here! We are seeking an experienced Distinguished Member of Technical Staff (DMTS) Design Engineer to join the DRAM System team. This role is at the center of memory innovation. You will analyze current and next-generation memory technologies, identify performance and design gaps, and guide teams on future memory direction. Your work will directly influence architecture, product strategy, and competitive positioning, making it both highly visible and technically rewarding. This position is intended to be part of the Technical Leadership Program at Micron. This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Location: Boise, ID or San Jose, CA Responsibilities:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is hiring an experienced MTS - Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams . Key Responsibilities Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration. Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions. Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures. Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior. Assess material prop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will connect various engineering groups and specialties. You will combine diverse expertise to develop new and improved test strategies, features, and technologies. This role offers an outstanding opportunity to work with the newest technology, helping to build the future of memory and storage solutions. You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Collaborate with Design Engineering (DE) to conduct pre-silicon simulations to validate test strategies and circuits for Test. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE). Support pre-silicon checklist tasks and collaborate with TE to identify vital tester resources. Collaborate with TE and PE to adjust test programs for particular product needs to guarantee that silicon performance aligns with expectations. Support TE by aiding in test program debug, data analysis, and test development using AI assistants. Assist fabrication sites and process integration with test creation to improve effective process feedback. Debug and i

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As a DLT Shift Engineer within Advanced Packaging Technology Development Manufacturing Development Engineering (APTD MDE), you will provide shift-based execution support for Die Level Technology development activities in Taiwan. You will sustain development lot movement, respond to process and equipment abnormalities, support issue containment and escalation, and help maintain safe, efficient development execution across rotating day and night shifts. You will collaborate with Process Development, Process Integration, Manufacturing, Equipment Engineering, and other cross-functional teams to support HBM technology development. This role provides hands-on experience in advanced packaging processes, new equipment and material evaluations, Statistical Process Control (SPC), redundancy tool deployment, structured problem solving, and data-driven execution improvement. Key Responsibilities Shift-Based Development Execution l Support DLT technology development in a rotating day- and night-shift environment, including development lot execution, abnormal lot response, and shift-to-shift communication. l Monitor assigned development devices and DLT process levels, execute approved process activities, and maintain accurate records in accordance with established procedures. l Provide clear and timely shift handoffs, including current lot status, process risks, open issues, containment actions, and required follow-up. l Support continuous developmen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High Bandwidth Memory Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. We bring architecture and physical implementation together to shape products that are efficient, manufacturable, and ready for demanding applications! As a Custom Layout Architecture Engineer , you will use physical layout expertise to inform HBM architecture and implementation decisions from concept through tapeout. You will work with design, architecture, process, verification, and product engineering teams to balance performance, power, area, routability, and manufacturability. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Assess HBM architecture choices through layout feasibility, floorplanning, and performance, power, and area analysis Lead custom layout and full-chip integration for analog, mixed-signal, digital, and memory blocks Resolve antenna, latch-up, ESD, electromigration, IR drop, routability, and power-delivery constraints Complete DRC/LVS, parasitic extraction, post-layout validation, and tapeout support using industry-standard EDA tools Build scripts and automation that improve layout quality, verification, and design-cycle time Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field 4+ years of semiconductor physical layout experience with a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product & System Engineering Media Health team, you will work together with a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will work within the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enable rapid learning and effective technology transfer across the organization through deep involvement in defect detection equipment applications and advanced data analysis. Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams across process integration, process development, data science, and yield analysis to deliver solutions with global impact. Drive defect reduction and yield improvement efforts across multiple projects on Micron’s DRAM roadmap, including High Bandwidth Memory (HBM) and advanced DRAM technologies. Develop a comprehensive understanding of process flows, potential failure and defect modes through FMEA, and associated detection strategies for inline yield characterization. Define die loss paretos upon issue detection and partner with process and integration teams to design, execute, and analyze experiments and DOEs to resolve yield limitations. Monitor baseline inline yield health for owned process modules using SPC techniques to quickly identify excursions, process drift, and emerging risks. Protect line yield by proactively escalating issues and coordinating corrective actions. Apply advanced data science and data interpretation skills to analyze complex datasets, draw actionable conclusions, and communicate results effectively. Present findings and recommendations to internal teams and customers using analytical tools such as JMP and Python. Employer will accept a Master’s degree in Material Engineering, Chemical Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout . • Interpret product specifications and design circuits to meet the required functionality. • Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators, DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory (HBM) products • Integration of modules with Power delivery network and propose design solution for optimum performance • Deep understanding of Array and its peripheral circuits. • Driving innovation into the future Memory generations within a dynamic work environment • Validate & optimize design for reliability (Device stress, Aging effect) • EM/IR simulation, optimize layout to achieve best circuit performance • Custom digital circuit design & validation • Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions • Overseeing and managing the layout process including floor-planning, placement, and routing • Performing verification processes with modeling and simulation using industry standard simulators • Contributing to cross group communication to work towards standardization and group success • Working wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Probe Integration Engineer at Micron Technology, Inc. within Test Solutions Engineering Department Key Equipment Group (KEG); you will have responsibilities for developing, deploying, and supporting Wafer Probe Equipment and Processes used in our manufacturing global locations with an emphasis on HBM (High Bandwidth Memory). The successful candidate will spend much of their time working on company-wide initiatives promoting greater quality, efficiency, and standardization of Probe operations together with enabling Probe roadmap technologies. A typical day in this position allows candidates to be creative and innovative in the deployment of first-of-a-kind solutions that solve complex problems. Responsibilities and Tasks: Responsibilities for this role will include, but are not limited to, the following: Deploy first-of-a-kind equipment and process capabilities through evaluations of Wafer Probers, Testers & Probe Cards Collaborate with global teams to establish and implement the best-known method probe processes globally. Engage equipment suppliers & vendors to address issues of quality, performance, and change management. Establish manufacturing metrics to drive continuous improvement of equip

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will act as a key interface between a variety of engineering groups and specialties, improving a diverse range of expertise to innovate new and improved test strategies, features, and technologies! You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering (DE) to run simulations pre-silicon to validate test strategies and Design for Test circuits. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE) Assist in pre-silicon checklist items and work with TE to define required tester resources Work with TE and PE to modify test programs for specific product requirements to ensure that silicon performance meets expectations Support TE by aiding in test program debug, data analysis, and test development Support fabrication sites and process integration through test development to increase effective process feedback Debug and identifying root causes for failures using test and experimental data, and elec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DLT Shift Engineer within Advanced Packaging Technology Development Manufacturing Development Engineering (APTD MDE), you will provide shift-based execution support for Die Level Technology development activities in Taiwan. You will sustain development lot movement, respond to process and equipment abnormalities, support issue containment and escalation, and help maintain safe, efficient development execution across rotating day and night shifts. You will collaborate with Process Development, Process Integration, Manufacturing, Equipment Engineering, and other cross-functional teams to support HBM technology development. This role provides hands-on experience in advanced packaging processes, new equipment and material evaluations, Statistical Process Control (SPC), redundancy tool deployment, structured problem solving, and data-driven execution improvement. Key Responsibilities Shift-Based Development Execution Support DLT technology development in a rotating day- and night-shift environment, including development lot execution, abnormal lot response, and shift-to-shift communication. Monitor assigned development devices and DL