Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leverage AI-enabled tools and data-driven insights to improve operational efficiency, accelerate problem-solving, and support continuous improvement initiatives. Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses info
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leverage AI-enabled tools and data-driven insights to improve operational efficiency, accelerate problem-solving, and support continuous improvement initiatives. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers <s
HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.
HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.
HBM製程輪班工程師 HBM Shift Process Engineer — Taichung - MTB, Taiwan. Apply via Workday.
SR. HBM Stacking Process Engineer — Taichung - MTB, Taiwan. Apply via Workday.
HBM MRDA SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Mechanical Engineering, Materials Science, or related technical field. Hands-on experience in one or more areas: product development, sys
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve equipment condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify equipment management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leverage AI-enabled tools and data-driven insights to improve operational efficiency, accelerate problem-solving, and support continuous improvement initiatives. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement: • Preferred to have over 3-year of working experiences in production line. • Must have process maintain experience. • Bachelor degree or
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Accountable and sustain for Bond process. Backup for Debond area process basic maintenance. Establish and improve process condition and technology. Upgrade tool capability and improve product quality. Establish and modify process management projects. Set up process parameters for a variety of semiconductor equipment. Evaluation, promotion and planning of new equipment / materials. Abnormal analysis and improvement. Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement: • Preferred to have over 3-year of working experiences in production line. •
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits - Using AI tool for process improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audit, also using AI tool for process improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers <br
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Overview｜職缺概述 Micron Taiwan is building a long‑term HBM talent pool to support the expansion of advanced memory manufacturing in Taichung. This evergreen posting is intended to attract talents across Engineering, Manufacturing, Quality, Automation, Facilities, and Operations Leadership functions. Micron 台灣持續擴展 HBM（High Bandwidth Memory）製造與營運團隊 ，此 evergreen 職缺用於建立長期人才庫，將依業務需求媒合合適職務。 Potential Roles｜涵蓋職務方向（不限於） Manufacturing / Process 製造／製程工程師 Automation & Manufacturing Systems Engineer 自動化與製造系統工程師 Industrial Engineer 工業工程師 Product Quality Assurance / Quality Engineering (PQA / PQE) 產品品質保證／品質工程 HBM Manufacturing / Test Production Supervisor HBM 製造／測試產線主任 Assembly Equipment Engineer / Process Engineer 設備／製程工程師 Facilities Engineer 廠務工程師(水處理/HVAC/氣體系統/擴建工程專案/二次配) What You Will Do｜工作內容摘要 Depending on role alignment, responsibilities may include: Support and improve HBM manufacturing, assembly, test, automation, or facility systems 支援並優化 HBM 製造、封裝、測試、自動化或廠務系統 Drive process optimization and yield improvement, enhance product quality, and support new product introduction and production ramp 負責分析與優化
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