Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 メトロロジー プロセス開発エンジニアは、次世代DRAMおよびHBM技術を支える先端計測技術の開発・導入を担当します。 測定レシピ開発、データ解析、計測装置の評価・立上げに加え、装置サプライヤーと連携した新規計測装置の開発にも携わります。 半導体業界での経験は必須ではなく、製造業で培った分析力や問題解決力を活かしながら、世界中のエンジニアと協働し、最先端メモリ技術の開発に挑戦できるポジションです。 職務内容 先端DRAM/HBM技術向けの新規計測手法および測定レシピの開発・認定 測定結果の解析および測定精度改善に向けた問題解決活動 新規計測装置および測定技術の評価・導入 計測装置の開発業務（要求仕様の検討・策定、サプライヤーとの調整・開発推進、完成後の装置立ち上げ・導入までを一貫して担当） プロセス管理戦略の策定およびモニタリング計画の構築 実験データおよび量産データを活用したプロセス改善・歩留まり改善支援 プロセスインテグレーション、製造、歩留まり改善、装置エンジニアリング部門との協業 計測装置サプライヤーとの技術レビューおよび開発推進 設備投資計画（Capital Planning）、設備設置、立ち上げ、認定活動の支援 AIツールを活用した業務効率改善およびデータ活用の推進 必須条件 学士卒以上（電気・電子、材料、物理、化学、化学工学、機械工学などの理工系関連分野） 製造業または技術系職種における業務経験 論理的思考力および問題解決能力 データを基に課題を分析し、改善策を検討できる能力 日本語による円滑なコミュニケーション能力（目安：JLPT N2以上） 英語によるコミュニケーションに抵抗がないこと AIツール（Anthoropic Claude、Microsoft 365 Copilot等）を活用しながら業務効率向上や課題解決に取り組めること 歓迎条件 半導体業界における実務経験 自動車、化学、精密機械、電子部品等の製造業での経験 計測機器、分析装置、生産設備に関する知識または経験 XRD、SIMS、OCD、Scatterometry、CD-SEM、Film Metrology等に関する知識 統計解析や工程管理手法に関する経験 DRAM、HBM、NANDなど先端メモリ技術への興味・関心 海外メンバーとのプロジェクト経験 求める人物像 論理的に物事を整理し、課題解決に取り組める方 指示待ちではなく、自ら考え行動できる方 多様なバックグラウンドを持つメンバーと協働できる方 新しい技術やAIツールの活用に前向きな方 グローバルな環境で成長したい方 <li
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 メトロロジー プロセス開発エンジニアは、次世代DRAMおよびHBM技術を支える先端計測技術の開発・導入を担当します。 測定レシピ開発、データ解析、計測装置の評価・立上げに加え、装置サプライヤーと連携した新規計測装置の開発にも携わります。 半導体業界での経験は必須ではなく、製造業で培った分析力や問題解決力を活かしながら、世界中のエンジニアと協働し、最先端メモリ技術の開発に挑戦できるポジションです。 職務内容 先端DRAM/HBM技術向けの新規計測手法および測定レシピの開発・認定 測定結果の解析および測定精度改善に向けた問題解決活動 新規計測装置および測定技術の評価・導入 計測装置の開発業務（要求仕様の検討・策定、サプライヤーとの調整・開発推進、完成後の装置立ち上げ・導入までを一貫して担当） プロセス管理戦略の策定およびモニタリング計画の構築 実験データおよび量産データを活用したプロセス改善・歩留まり改善支援 プロセスインテグレーション、製造、歩留まり改善、装置エンジニアリング部門との協業 計測装置サプライヤーとの技術レビューおよび開発推進 設備投資計画（Capital Planning）、設備設置、立ち上げ、認定活動の支援 AIツールを活用した業務効率改善およびデータ活用の推進 必須条件 修士卒以上（電気・電子、材料、物理、化学、化学工学、機械工学などの理工系関連分野） 製造業または技術系職種における業務経験 論理的思考力および問題解決能力 データを基に課題を分析し、改善策を検討できる能力 日本語による円滑なコミュニケーション能力（目安：JLPT N2以上） 英語によるコミュニケーションに抵抗がないこと AIツール（Anthoropic Claude、Microsoft 365 Copilot等）を活用しながら業務効率向上や課題解決に取り組めること 歓迎条件 半導体業界における実務経験 自動車、化学、精密機械、電子部品等の製造業での経験 計測機器、分析装置、生産設備に関する知識または経験 XRD、SIMS、OCD、Scatterometry、CD-SEM、Film Metrology等に関する知識 統計解析や工程管理手法に関する経験 DRAM、HBM、NANDなど先端メモリ技術への興味・関心 海外メンバーとのプロジェクト経験 求める人物像 論理的に物事を整理し、課題解決に取り組める方 指示待ちではなく、自ら考え行動できる方 多様なバックグラウンドを持つメンバーと協働できる方 新しい技術やAIツールの活用に前向きな方 グローバルな環境で成長したい方 <li
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing . Location 1 North Coast Drive, Singapore Department Product Integration Engineering (PIE), Process Integration (PI ) Project Title Advanced Memory Process Integration Improvement Exploration and Device Reliability Study (NAND / DRAM / HBM) Project Description This internship provides a structured learning opportunity within the Process Integration Engineering team, focusing on advanced semiconductor memory manufacturing technologies, including NAND, DRAM, and HBM devices. The intern will gain exposure to reliability concepts, fail
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【募集職種/Position Title】 Senior / Staff / Principal Process Development Engineer 【日本語】 MicronのDRAM Technology Development Process Development Teamは、MicronのDRAMおよびHBM (High Bandwidth Memory) 製品向けのプロセス技術、装置ソリューションを開発する、世界最高水準のエンジニアと技術専門家で構成された組織です。 当チームでは、先端DRAM、HBM、およびCMOS技術の開発を推進しており、リソグラフィ、CVD、ドライエッチ、ウェットプロセス、メタライゼーション、拡散、イオン注入、CMP、先端材料開発など、幅広いプロセス分野で経験豊富な人材を募集しています。 本ポジションでは、ユニットプロセス技術の探索、開発、最適化を担当し、プロセスインテグレーション、デバイス、設計エンジニアと連携しながら、装置メーカーや材料サプライヤーと協働して、次世代のDRAMおよびHBM向けの高性能かつコスト競争力のある技術開発を推進していただきます。 本ポジションでは、半導体プロセス開発、デバイス物理、CMOS技術に関する高度な知識が求められます。また、データ解析能力や材料分析、表面解析技術への理解も重要です。チームワークと高いコミュニケーション能力は、本職務で成功するための重要な要素となります。 歓迎する技術経験 以下の技術分野における実務経験をお持ちの方を歓迎します。 ・成膜技術 (CVD、ALD、PVD) ・エピタキシャル成長技術 (Si、SiGe、選択成長など) ・ゲートスタックおよび誘電体技術 ・先端パターニングおよびドライエッチ技術 ・ウェット洗浄および表面処理技術 ・イオン注入および熱処理技術 ・コンタクト形成、配線メタライゼーション技術 ・化学機械研磨技術 (CMP) ・ストレスエンジニアリングおよび先端材料統合技術 ・先端トランジスタ開発を含むロジック技術開発 ・メモリCMOSおよび周辺回路向けプロセスインテグレーション技術 主な職務内容 以下を含みますが、これらに限定されません。 ・デバイス、プロセスインテグレーション、および製品要求事項の理解 ・技術目標およびコスト目標達成に向けたプロセス技術ロードマップおよびサプライヤー戦略の策定 ・開発環境および量産環境におけるプロセスレシピの開発、最適化 ・構造解析、材料分析、および電気特性評価データの解析 ・デバイス性能、歩留まり、信頼性、およびコスト競争力向上に向けた技術革新の推進 ・AI（人工知能）を活用した開発業務の効率化、高度化の推進 ・社内関係部門および外部パートナーとの連携による複雑な技術課題の解決 ・技術戦略および開発方針に関する経営層への提言 ・エンジニアの育成、指導を通じた組織能力の向上 ・高い倫理観、オーナーシップ、および他者への敬意を持った業務遂行 応募資格（必須） ・電気工学、物理学、化学工
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information into intelligence through industry-leading memory and storage solutions. The Process Development Engineering team drives innovation for future DRAM and HBM technologies by developing and optimizing semiconductor manufacturing processes that enable next-generation memory products. Our engineers work at the intersection of advanced research and high-volume manufacturing to solve complex technical challenges and accelerate technology advancement. As a Process Development Engineering Intern, you will gain hands-on experience in semiconductor process development while working on a dedicated technical project within a fast-paced research and development environment. Under the mentorship of experienced engineers, you will collaborate across process and equipment teams to develop innovative solutions that meet demanding product requirements. The internship concludes with a formal presentation of your project results to technical and leadership audiences. Responsibilities Develop and optimize semiconductor processes that meet physical and electrical performance requirements for current and future memory products. Partner with multi-functional process and equipment engineering teams to identify and implement process improvements. Perform root-cause analysis and failure-mode analysis to identify process limitations and develop corrective actions. Conduct fundamental research to support next-generation memory technologies and process innov
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Process, Metals, CVD, Diffusion, and CMP. You will work on state of the art and best in class </sp
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The PDE API Process Integration (PI) Engineer is responsible for driving process integration excellence for Advanced Packaging products, including High Bandwidth Memory (HBM) products across sites during New Product Introduction (NPI) . This role ensures robust process readiness, yield ramp, and cross‑module integration across Front-end to Assembly interactions , PWF, Assembly, and Test , enabling successful execution of HBM technology roadmaps. The PI Engineer works cross‑functionally with different cross-functional teams including Fab, Assembly, Test, Yield, Quality, and central engineering teams to identify risks early, resolve complex integration issues, and deliver NPI milestones on time. Job Responsibilities Technical Leadership Serve as the Process Integration Subject Matter Expert, owning end‑to‑end integration across PWF, assembly, and test from NPI through sustained HVM Define PI technical direction, integration frameworks, and success criteria for HBM programs Lead process characterization strategy, window definition, and systemic yield improvement Resolve complex yield, reliability, and performance issues through deep technical analysis and integration expertise Drive resolution of high‑impact, ambiguous, cross‑site integration challenges affecting ramp, quality, or business commitments Anticipate risks early and define mitigation strategies across programs and sites
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department HVM Engineering Process and Equipment Engineering Project Title Superior Copper Sputter Enablement on HBM Metallization Project Description With increasingly advanced technology scaling and higher performance requirements, the metallization process requires continuous innovation to meet stringent electrical, reliability, and manufacturability targets. To support future product roadmaps and capacity expansion, there is a need to enable advanced copper deposition capability as an improved manufacturing platform for metallization. This effort requires comprehensive process development, hardware qualification, integration assessment, and defectivity optimization to achieve process equivalency while maintaining yield, reliability, and cost competitiveness. The project will leverage Artificial Intelligence (AI), Micron manufacturing systems, and advanced data analytics to perform extensive characterization, validation, and predictive insights across process conditions. The intern will work closely with engineering teams to evaluate process performance, identify optimization opportunities, and develop data-driven solutions that improve manufacturing robustness and readiness for h
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description The MSH PDE Process Integration (PI) Manager leads a team of Process Integration engineers responsible for the successful execution of High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing (HVM) . This role combines people leadership, technical oversight, and cross‑functional execution , ensuring PI readiness, yield ramp, and risk mitigation across wafer fabrication, assembly, and test. The manager is accountable for delivering NPI commitments while developing a strong, scalable PI organization. Job Responsibilities People Leadership & Talent Development Lead, coach, and develop a team of MSH PDE PI engineers across multiple experience levels Set clear expectations, goals, and priorities aligned to NPI and business objectives Provide regular feedback, performance evaluations, and career development guidance Build organizational capability through hiring, onboarding, mentoring, and succession planning Foster a culture of accountability, collaboration, and technical excellence HBM NPI Execution & Delivery Own PI execution for HBM NPI programs, en
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The PDE Process Integration (PI) Engineer is responsible for driving process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI) . This role ensures robust process readiness, yield ramp, and cross‑module integration across Post Wafer Finishing PWF, assembly, and test , enabling successful execution of HBM technology roadmaps. The PI Engineer works cross‑functionally with Fab, Assembly, Test, Yield, Quality, and central engineering teams to identify risks early, resolve complex integration issues, and deliver NPI milestones on time. Job Responsibilities Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. NPI Execution & Support Execute assigned HBM NPI PI tasks following defined procedures and phase‑gate requirements Support NPI builds through lot tracking, data collection, and
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI-enabled and AI-assisted work methods, including Microsoft Copilot, Generative AI, and advanced analytics tools, to improve equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency. • Utilize AI-powered data analysis to identify equipment performance gaps, predict equipment failures, optimize preventive maintenance strategies, and reduce unplanned downtime. • Apply AI-assisted troubleshooting techniques to accelerate root cause analysis of equipment alarms, process excursions, and yield loss mechanisms. • Familiar with TCB/DB process and possesses a minimum of 5 years of semiconductor equipment engineering experience. • Identify, diagnose, and resolve assembly equipment related issues utilizing data-driven and AI-supported methodologies. • Coordinate and execute process, equipment, and material evaluations, leveraging AI insights to optimize manufacturing performance and quality. • Lead and participate in utilization improvement, yield enhancement, cost reduction, and smart manufacturing initiatives through automation and AI technologies. • Validate and qualify new processes, equipment, materials, and manufacturing technologies for NPI deployment. • Support FDC/RMS/APC/SPC systems and utilize AI-driven analytics to identify trends, abnormalities, and improvement opportunities. • Drive site-to-site best practice transfer and digital transformation initiatives. • Manage supplier quality and risk
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment. Maintain Equipment knowledge as it relates to the process. Improve utilization/capacity/cost by machine upgrade, procedure optimization, or material selection. Optimize and identify equipment variables. Understand DOE/FMEA/OCAP/8D/SPC/Repair/PM (preventive) techniques Perform containment/prevention actions of process and equipment deviations Prepare and update equipment operation manuals, maintenance logs, and incident reports. Support the introduction of new equipment and technologies, including validation and evaluation. Design equipment components (Improve equipment capability by exploring new ideas/concepts and implement on equipment) Coordinate with vendors for equipment upgrades, repairs, and technical support. Conduct regular equipment performance analysis and propose improvements by using and applying AI. Locate and research technical information on equipment, materials, and/or processes in journals, literature, web, etc. Requirements Bachelor’s degree or above in Electrical, Mechanical, Materials, Electronics Engineering, or related fields. Familiarity with semiconductor equipment operation and maintenance procedures and work experience: 3 years above Strong analytical and problem-solving skills. Good teamwork and communicatio
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務說明 As a HBM Equipment Engineer, you will be responsible for evaluating and improving manufacturing processes, coordinate equipment/material procurement and qualify and implement new process. Requirements: · Ability to handle the thinning or dicing tool -steal dicing, laser groove, NCF lamination · Understand the tool installation, setup and buyoff · Work experience: 2 years · Understand the tool signal is prefer, such as SVID, CEID, ECID...etc · Understand to handle the FDC analysis and improve is prefer · English: ability to communicate for discussion with supplier and global team · Leverage AI-enabled tools, automation, and data analytics to enhance productivity, decision-making, and operational excellence Responsibilities and Tasks: Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment · Maintain General process knowledge · Maintain Equipment knowledge as it relates to the process · Maintain Materials knowledge as it relates to the process · Optimize process, equipment variables · Identify all process variables · Understand DOE/FMEA/OCAP/8D/SPC/Repair/PM (preventive) techniques · Perform containment of process and equipment deviations · Determine root cause · Implement corrective action · Design equipment components (Improve equipment capability by exploring new ideas/concepts and implement on equipment) · Maintain knowledge of equipment and materials and how t
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment. Maintain Equipment knowledge as it relates to the process. Improve utilization/capacity/cost by machine upgrade, procedure optimization, or material selection. Optimize and identify equipment variables. Understand DOE/FMEA/OCAP/8D/SPC/Repair/PM (preventive) techniques Perform containment/prevention actions of process and equipment deviations Prepare and update equipment operation manuals, maintenance logs, and incident reports. Support the introduction of new equipment and technologies, including validation and evaluation. Design equipment components (Improve equipment capability by exploring new ideas/concepts and implement on equipment) Coordinate with vendors for equipment upgrades, repairs, and technical support. Conduct regular equipment performance analysis and propose improvements by using and applyin
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務說明 As a HBM Equipment Engineer, you will be responsible for evaluating and improving manufacturing processes, coordinate equipment/material procurement and qualify and implement new process. Requirements: · Ability to handle the thinning or dicing tool -steal dicing, laser groove, NCF lamination · Understand the tool installation, setup and buyoff · Work experience: 2 years · Understand the tool signal is prefer, such as SVID, CEID, ECID...etc · Understand to handle the FDC analysis and improve is prefer · English: ability to communicate for discussion with supplier and global team · Leverage AI-enabled tools, automation, and data analytics to enhance productivity, decision-making, and operational excellence Responsibilities and Tasks: Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment · Maintain General process knowledge · Maintain Equipment knowledge as it relates to the process · Maintain Materials knowledge as it relates to the process · Optimize process, equipment variables · Identify all process variables · Understand DOE/FMEA/OCAP/8D/SPC/Repair/PM (preventive) techniques · Perform containment of process and equipment deviations · Determine root cause · Implement corrective action · Design equipment components (Improve equipment capability by exploring new ideas/concepts and implement on equipment) · Maintain knowledge of equipment and materials and how t
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