Hbm Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Senior/Staff Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal/Snr/Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a key team member within the HIG HBM Product Engineering Advanced Data Analytics team, you will be spearhead and develop a high-performing team to drive initiatives that significantly enhance yield and quality through advanced data analysis, machine learning, and AI. Your responsibilities will include developing cutting-edge algorithms, creating robust product disposition solutions, and establishing a proactive deviation alert system for yield and quality, enhancing data infrastructure, mentor team members, and fostering innovation to maintain a competitive edge. You will also collaborate with cross-functional teams within and outside of HBM to achieve both strategic and tactical objectives, continually maximizing the effectiveness of the HIG HBM PE organization, focusing on critical KPIs such as quality, cos

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Member of Technical Staff, SoC Power and Physical Architect in the Next-generation HBM Architecture Team, you will drive SoC-level specification 3D-stacked, high-performance memories. Apply your knowledge to analyze SoC trade-offs in close collaboration with peer architecture and design teams. Drive power architecture, physical planning, and early SoC design activities, including definition of IP interfaces (e.g., signals, power delivery), clocking, power sequencing, design-for-test, floorplanning, and specification development. Responsibilities: Define clocking architectures, power sequencing, power delivery, and on-die signal interfaces. Define and analyze on-die power delivery networks (PDN) and full-chip thermal implications, including power hot-spot identification and mitigation. Define DFT architectures (e.g., scan chain topology) and set verification requirements. Define SoC floorplans in collaboration with physical designers. Compose and maintain clear SoC physical documentation. Preferred Qualifications: Experie

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Job Summary Reporting to the Memory Validation leadership team, the Senior Silicon DDR/HBM Validation Engineer will be responsible for the bring-up, validation, characterization and debug of advanced memory subsystems used in next-generation AI compute platforms. The role will focus on DDR and HBM technologies, working closely with silicon design, firmware, characterization, platform and systems teams to ensure robust memory subsystem functionality, performance and reliability. The successful candidate will take ownership of significant validation activities, contribute to debug and root-cause analysis efforts, and help improve validation methodologies, automation and infrastructure. The Team The Memory Validation team sits within the Validation organisation and is responsible for the bring-up, validation, characterization and debug of memory subsystems across Graphcore silicon and platform products. The team supports DDR and HBM validation activities throughout the product lifecycle, from first silicon through production readiness. Engineers work closely with architecture, RTL, firmware, characterization, systems and platform teams to ensure memory technologies meet functionality, performance, reliability and performance objectives. Responsibilities and Duties Execute validation and bring-up activities for DDR and HBM memory subsystems Verify memory bring-up software, firmware and scripts against defined project requirements Debug firmware, hardware and system-level issues and contribute to root-cause analysis activities Analyse system logs, validation data and characterization results to identify failures and performance issues Perform PHY characterization and analog-level analysis during stress testing and validation activities Develop and execute functional, stress, performance and corner-case validation tests Perform signal integrity, voltage, frequency and timing measurements using laboratory instrumentation Char

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the design and own critical HBM analog circuits, including: High‑speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes‑related analog blocks Biasing, reference, and calibration circuits Power delivery and regulation circuits (LDOs, regulators) Define and lead IP interfaces, power domains, clocking schemes, and reset strategies across subsystems Perform detailed pre‑layout and post‑layout simulations Conduct PVT, Monte Carlo, mismatch, and aging analyses Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance Review and sign off on analog layouts Drive layout‑aware build optimizations for advanced nodes <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Introduction: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you eager to be a pioneer in AI and semiconductor breakthroughs? At Micron, we invite a passionate Staff Engineer, Collateral Integration Engineer to join our upbeat group. This opportunity offers the chance to work on innovative technology within a team-orie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role Overview As a New Product Introduction (NPI) Product Lead within the Cloud Memory Business Unit (CMBU), you will lead end-to-end manufacturing and fulfillment execution for complex new-product sample demand across DDR, LPDDR, CXL-attached DRAM, GDDR and HBM-based memory products and solutions. This role operates across the build-to-ship portion of the NPI execution chain, where material availability, manufacturing progress, yield, holds, finished goods, order readiness and logistics dependencies must be actively managed. You will organize cross-functional teams, expose blockers early, drive recovery actions and maintain momentum across sites and time zones. The role remains grounded in NPI Operations: maintaining accurate demand and execution data, coordinating priorities, tracking builds against committed dates, managing exceptions and ensuring stakeholders receive a clear fact-based view of delivery risk and recovery. What You Will Solve · Supply shortages, material constraints, stuck lots and unclear ownership that prevent builds from progressing to committed dates. · Low yield, excursions, holds, rebuilds, test constraints and site-execution issues that require rapid cross-functional recovery. · Mismatch between approved demand, finished goods, order information and shipment requirements. · Pricing, sales-order, release, customs, logistics and waybill blocks that keep available product from reaching the destination. ·

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build the Future of Memory and AI from India At Micron India , we are helping shape the next generation of memory and storage solutions that power Artificial Intelligence, cloud computing, mobile devices, automotive systems, and data centers worldwide. Join a team of innovators, engineers, and technology leaders working at the forefront of semiconductor design, verification, product development, advanced packaging, data analytics, and manufacturing technology. From pioneering High Bandwidth Memory (HBM) solutions for AI to developing next-generation DRAM and NAND technologies, Micron India plays a critical role in delivering innovations that enable the world's most demanding computing applications. As one of Micron's fastest-growing innovation hubs, our teams collaborate globally to solve complex engineering challenges, accelerate technology development, and transform breakthrough ideas into products used by billions of people around the world. Opportunities Across Micron India Engineering Teams DTPG (Design Technology & Product Group) Design and develop next-generation DRAM, NAND, and emerging memory technologies powering AI, high-performance computing, mobile, and cloud applications. Work across memory architecture, circuit design, layout, verification, characterization, and product engineering to bring cutting-edge semiconductor innovations to market. TD (Technology Development) Drive the future of memory technology

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design and CAD Enablement Own the development, deployment, and support of scalable CAD tools, automation frameworks, design flows, and methodologies for NAND, DRAM, HBM, SoC, mixed-signal, and other advanced semiconductor products. Develop, improve, and maintain infrastructure for circuit build capture, layout, simulation, characterization, implementation, physical verification, and signoff workflows. Create robust software and scripts using Python, Tcl, SKILL, Shell, Perl, C/C&#43;&#43;, Java, Lisp, or related languages to automate engineering workflows, analytics, and quality checks. Evaluate and integrate advanced EDA technologies, AI-assisted engineering solutions, and emerging methodologies to improve productivity, scalability, and silicon quality. Validated ability to demonstrate AI‑assisted (vibe) coding techniques to improve efficiency or automate design and analysis methodologies Leverage AI tools to automate the tools and workflow Applying Artificial Intelligence in workflows to improve build efficiency undefined undefined Lead implementation and signoff activities across physical design, static timing analysis, and design for test for complex digital, memory, SoC, or mixed-signal products. Drive floor planning, power planning, placement, clock tree synthesis, routing, optimization, timing closure, and physical verification to meet power, performance, area, reliability, and sche

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to ESD Architecture Leadership & Strategy Define and own ESD architecture and protection strategy for high-speed I/O portfolios including: HBM (High Bandwidth Memory) / DDR / LPDDR PHY I/Os PCIe, USB, Ethernet, MIPI, and proprietary interfaces Lead ESD–I/O co‑design trade‑off decisions, balancing: Aggressive ESD targets (HBM / CDM / MM).Ultra‑low capacitance and leakage requirements Eye margin , jitter , bandwidth , return loss, and impedance matching Drive architectural choices for: Snapback clamps, rail clamps, diode steering networks. Triggered and advanced ESD devices (technology‑dependent). Domain isolation and sequencing protection for sophisticated SoCs Advanced Circuit Design, Modeling & Signoff : Perform and guide ESD circuit design and analysis at block and full‑chip level. Establish simulation methodologies for: Transient ESD stress (TLP‑equivalent behavior). Dynamic clamp triggering and current handling. I/O performance impact (cap loading, ringing, overshoot/undershoot. Own ESD modeling correlation: Work with device/modeling teams on compact models (dynamic R, triggering, CV behavior). Drive correlation between SPICE simulations, TLP/VF‑TLP, and silicon results. Act as the final technical authority for ESD Design reviews and signoff. Silicon Debug, Reliability & Qualification Ownership : Lead silicon-l