Hbm Production Operator Jobs

Engineer - HIG HBM - PE Design Validation — Fab 10A, Singapore. Apply via Workday.

NPO Product Manager (HBM) — Fab 10A, Singapore. Apply via Workday.

PRINCIPAL ENGINEER HBM LAYOUT — Jalisco, Mexico. Apply via Workday.

Senior Engineer - HBM Design for Test (DFT) — Richardson, TX. Apply via Workday.

Staff/Principal Engineer - HBM Design for Test (DFT) — Richardson, TX. Apply via Workday.

Senior Advanced Packaging Material Category Supplier Manager (HBM) — Taichung - MTB, Taiwan. Apply via Workday.

Member Of Technical Staff TLP - HBM Verification — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Principal HIG ESD and Latch-up Engineer- HBM - TPG — 2 Locations. Apply via Workday.

Circuit / Memory Design Engineer | HBM - TPG — Richardson, TX. Apply via Workday.

Design Engineer- (Standard and Custom Cell Characterization) -HBM — Richardson, TX. Apply via Workday.

Member of Technical Staff (MTS) – HIG HBM Component Validation — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: HBM development Improve Probe testing coverage, quality and on HBM products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating HBM features and commands Use high-speed tester hardware to perform validation of new HBM devices Analysis of failures generated from the evaluations Automation of program development and work processes using scripting Product Yield Enhancement Identify causes of low yield through systematic analysis Work closely with various engineering groups in resolving process/defects related issues Perform electri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit