High Speed Hardware Developer Jobs

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. In this role you will: As a Hardware Test Engineer, you will work on Machine Learning/AI hardware system projects to craft the solutions for current and future data center deployments. You will bring a strong understanding of hardware system testing, excellent project management skills, and the ability to collaborate across multiple teams to ensure efficient lab operations. You will be responsible for designing, implementing, and executing comprehensive test plans that ensure the reliability, performance, and scalability of our supercomputing hardware systems. You will develop detailed test plans and methodologies tailored to hardware components, including processors, memory modules, custom accelerators and interconnects. You will collaborate with hardware design, manufacturing, firmware teams and vendors to identify, analyze, and resolve issues affecting hardware, power, thermal and high-speed interconnects. You will perform in-depth debugging on the hardware system Excellent analytical skills to diagnose hardware issues, troubleshoot problems, and propose solutions. Ability to interpret complex test data, identify trends, and draw meaningful conclusions. High-speed links, with a focus on SerDes (Serializer/Deserializer) technology to assess signal integrity, error rates, and overall link performance. You will collaborate with the lab manager to maintain the equipment and hardware systems, including oscilloscopes, thermal test chambers, liquid cooling systems, and other mea

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

About the Team OpenAI’s Hardware organization develops custom silicon and systems for advanced AI workloads. Our first-party accelerator team works across chip architecture, design, software, and systems to build the computing platforms that power frontier models. We are a small, dynamic team that values technical breadth, hands-on engineering, and creative approaches to building complex hardware. About the Role We’re looking for a SoC Engineer to help architect, design, and integrate OpenAI’s first-party AI accelerators. You will build the processor, interconnect, I/O, and platform infrastructure that connects our accelerator designs into complete, functional systems. This role combines architectural judgment with hands-on implementation. You’ll work closely with design, architecture, verification, and software teams throughout development, from defining subsystem requirements and integrating IP to pre-silicon validation, silicon bring-up, and post-silicon debug. You should enjoy stretching across domains, rolling up your sleeves, and doing the work needed to make a complex system function end to end. In this role, you will: Define and implement SoC architectures spanning embedded processors, AMBA interconnects, peripheral subsystems, PCI Express, Ethernet and die-to-die interfaces. Develop the microarchitecture and RTL design of subsystems supporting I/O and SoC functionality. Integrate Arm Cortex-M and Cortex-A processors, AXI/APB fabrics, and third-party controller IP, including the RTL and glue logic needed to connect these components. Develop reset and boot architectures, working with firmware and software teams to define sequencing, initialization, and survivability behavior. Incorporate debug, test, and security requirements into the SoC architecture and implementation, partnering with other silicon designers to make the silicon observable, testable, and secure. Drive PCIe and other I/O integration, including controller and PHY interfaces, high-speed SerDes,

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for signal integrity (SI) system design engineers who have a deep expertise in the SI area, and hold strong system level design knowledge This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead system signal integrity (SI) design for AI supercomputer product in the data center application. Collaborate with chip, package, boards, rack and system engineers, design partners to drive system SI design and develop innovative interconnect and high-speed technologies Identify and evaluate new technologies and methodologies to improve signal and power integrity in product design, and contribute to the development of new products and technology by providing expertise in signal integrity Perform simulation and modeling to identify and troubleshoot signal integrity issues Lead system interconnect design, bring up and qualification As the scope of the role and team grows, understand and influence roadmaps for hardware partners for our datacenter networks, racks, and buildings. You might thrive in this role if you: Have at least 10 years of industry experience, including experience design hardware system and SerDes testing for data center applications Have a strong bias toward action, and won’t take no for an answer. Have experience and good knowledge of system design experience in the SI areas, from chip, SerDes, board, rack level Have ex

About Graphcore Graphcore is a leading innovator in artificial intelligence computing. We develop hardware, software, and data center infrastructure that provide the specialized processing and systems capabilities needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore works alongside companies developing advanced technologies. Our teams bring together AI researchers, silicon designers, hardware and software engineers, and systems architects to solve complex technical problems across the computing stack. The Opportunity As Principal Storage Architect, you will define the high-performance storage architecture for Graphcore's AI computing and data center infrastructures. You will lead the design of local and distributed storage tiers that provide the throughput, availability, and predictable tail latency required for large-scale training and inference. Working within Advanced Architecture, you will address storage requirements for saving model states, offloading key-value caches, large datasets, and high-speed data-loading pipelines. You will combine hands-on performance engineering with Principal-level technical leadership across hardware, software, networking, systems engineering, automation, supply chain, and external technology partners. What You Will Do Define the end-to-end architecture and technology roadmap for local, disaggregated, and distributed storage across Graphcore AI server and data center platforms. Design storage topologies that optimize PCIe lane allocation, network-domain placement, and data paths among CPUs, AI accelerators, memory, and storage systems. Lead the architecture of storage control-plane and data-plane solutions, evaluating commercial and open technologies against performance, resilience, manageability, and lifecycle requirements. Profile and tune the Linux storage stack, block layer, I/O schedulers, direct I/O paths, file systems, and drivers to imp

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity We are looking for a recent graduate or early-career engineer to join the Hardware Platform Development team as a Graduate Systems Engineer. You will contribute to the design, integration, validation, and performance analysis of advanced AI compute platforms. You will work with experienced hardware, firmware, software, mechanical, thermal, and systems engineers throughout the development lifecycle. The role combines subsystem engineering, hands-on laboratory work, test automation, data analysis, troubleshooting, and clear technical documentation. Start: September, 2027 Location: Austin, Texas, USA What You Will Do Contribute to the design, integration, and testing of CPU and high-speed input and output subsystems for advanced compute platforms. Take ownership of defined engineering tasks from requirements and test planning through execution, analysis, and technical review. Develop system-level validation plans, procedures, scripts, and tools that improve test coverage, repeatability, data collection, and analysis. Evaluate platform performance, power, signal behavior, reliability, and interoperability using laboratory measurements and system data. Investigate emerging input and output technologies, including PCIe 6.0 and 800G Ethernet, and assess their use in advanced computing systems. Support platform power, cooling, and energy-efficiency investigations, including liquid-cooling systems for high-performance processor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: HBM development Improve Probe testing coverage, quality and on HBM products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating HBM features and commands Use high-speed tester hardware to perform validation of new HBM devices Analysis of failures generated from the evaluations Automation of program development and work processes using scripting Product Yield Enhancement Identify causes of low yield through systematic analysis Work closely with various engineering groups in resolving process/defects related issues Perform electri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but not limited to: Develop and enable alternate test platforms to improve test coverage, apply sophisticated customer use cases test sequences (including deterministic and random usage case ) and improve test cost Develop and maintain characterization and qualification test program based on datasheet and customer specification Design novel test algorithms and develop test programs for validating NAND features and commands Performing functional and design validation of new NAND on high-speed tester hardware. Explore continual improvement in characterization and validation methodology aligned with the growth in customer requirement and higher data rate supported. Monitor NAND performance during Assured Quality Level (AQL) testing during product development and qualification Perform Electrical Failure Analysis during the evaluations, and investigate root causes of reported device

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: AI Technologies Basic understanding of AI concepts and emerging technologies. Familiarity with generative AI tools (e.g., Copilot) is a plus. Interest in leveraging AI to improve productivity, automation, and decision-making. NAND Probe/ Back End Testing Improve Probe testing coverage, quality and on NAND products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating NAND features and commands Use high-speed tester hardware to perform validation of new NAND devices Analysis of failures generated from the evaluations Automation of

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can tackle, and that matter to the world. This is our life’s work, to amplify human imagination and intelligence. Make the choice to join us today. We are now looking for a Senior High-Speed IO (HSIO) Validation Engineer! What you will be doing: Own HSIO (PCIe/NVLink) validation of products from start to finish including test plan development, automation, design for validation requirements, resource planning, coverage metrics, test execution, bug resolution, and release to production. Coordinate with internal and external logic design, circuit design, board design, Simulation, diagnostics, firmware, driver, and marketing teams in different time zones, to ensure our products HSIO subsystem is specification compliant and tuned for optimal workload performance, and to drive the system into production. Assist in the bring-up of new hardware and solving tough system and board level issues with a focus on HSIO at a system level. Participate in reviewing board schematics, PCB layouts, and making design and component suggestions. Ensure interoperability with connected devices and system components in sophisticated interconnect topologies. Solve complex hardware and software HSIO issues at the system level on GPU accelerated computing platforms. Provide engineering support for manufacturing in both NPI and MP stages of production. What We Need to See: Ability to work on site in hardwar

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today, SpaceX is actively developing the technologies to make this possible, with the ultimate goal of making life multiplanetary and expanding consciousness to the stars. SpaceXSI is building Super Intelligence to help humanity understand the universe. Our teams are building the full Super Intelligence stack: from our Colossus supercomputers, to Grok models, to our suite of applications, including Grok Bot, Grok Build, Grok Imagine, Grok Voice, and X. We're creating a powerful flywheel where more compute trains better models, better models power more useful products, and what we learn from people using those products shapes what we build next. ABOUT THE ROLE: SpaceXSI is building at a furious pace with the latest compute and switching hardware to help people understand the universe. We are looking for exceptional ML Infrastructure Engineers with deep expertise in high-speed interconnect technologies to design, build, and optimize the network fabric that powers large-scale AI training and inference clusters. This strategic role will drive innovation in high-bandwidth, low-latency, power-efficient interconnects critical for AI/ML clusters based on advanced computing platforms. You will have the opportunity to work on all modalities of interconnects connecting GPUs and switches both inside and between data centers, including our primary front and backend networks that train Grok and that customers use for inference. Engineers will own all aspects from design and development to build and operations. You will be expected to define and improve team processes and to contribute to scaling and maintenance efforts. You will focus on the physical layer and system-level integration of copper (ACC, AEC, CPC) and optical (FRO, LRO/TRO, LPO, AOC, CPO) interconnects that directly determine the performance, power efficienc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Seeking a self-motivated, team-oriented board design & validation engineer to develop Micron’s next generation Solid State Drive (SSD) products. This position requires experience in hardware design, signal integrity and power supply design and characterization. This would include modeling and simulation for high speed signaling implementations and power supply design including power distribution network (PDN) simulations. Job responsibilities: Technical Expertise : Candidate should have in depth knowledge on PCIe interface Gen5 & Gen6, PCIe Base and CEM specs, LPDDR4/5, NAND memories, ONFI interface (preferred) Strong knowledge on DC-DC converters, Buck and Boost, PMIC, Power Loss Protection (PLP), LDO, Load Switch devices A thorough understanding of Signal Integrity (SI), Power Integrity (PI), and Electromagnetic Compatibility (EMC) requirements is very much important. Hands on experience in performing measurements using low- and high-end Oscilloscopes, Power Analyzers, Logic Analyzers, PCIe analyzers Document and communicate results with cross functional counterparts. Simulate and analyze design proposals, review results and provide recommendations on optimal design practices to other design engineers. Experience in Hardware design, worst-case analysis, simulations, capture schematic, de-rating and assumes complete ownership of the SSD hardware through the product lifecycle. Hands on experience in hardware valid

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

InnoPhase Inc., DBA GreenWave Radios™, is at the forefront of innovation in Open RAN digital radios. Our cutting-edge solutions, powered by the Hermes64 RF SoC, are designed to enhance network energy efficiency while dramatically reducing operational expenses, with purpose-built silicon that is the heart of ORAN-based active antenna arrays. Headquartered in San Diego, California, GreenWave Radios™ has established itself as a pioneer in delivering power-efficient digital-to-RF solutions. The company is supported by a talented team of over 100 engineers spread across four global R&D facilities. With an extensive portfolio of more than 120 global patents, GreenWave Radios™ continues to push the boundaries of radio technology and innovation. To learn more about GreenWave Radios™ and hear what our employees have to say, visit the GreenWave™ certification profile at GreatPlacetoWork.com or explore our Home - GreenWave Radios website. About the Role We're looking for an experienced Principal Hardware Design Engineer/Manager to lead PCB design and development for next-generation, high-performance cellular base stations. You'll architect the board-level circuitry that complements our custom silicon — spanning digital processing, high-speed SerDes, power management, and RF transmission/reception — to deliver a solution that's both high-reliability and low-cost/power. This opportunity is a high-visibility technical leadership role based in San Diego, CA: you'll own PCB system architecture from concept through qualification, working shoulder-to-shoulder with various domain experts to ensure everything comes together. What You'll Do Own PCB development end-to-end, from concept through production Design and implement RF, analog, digital, and power circuits for high-performance base station products Partner with experts on floor planning and PCB constraints for seamless integration Lead and review schematic capture and PCB layout Optimize PCB stack-up for per