Job Details: Job Description: The Role and Impact Are you interested in GPU and AI accelerator hardware and want hands-on experience designing and bringing new technology to life? As a GPU & AI Accelerator Hardware Design Undergraduate Intern , you will work alongside experienced engineers developing next-generation GPU and AI accelerator platforms. You will gain practical experience across PCB and board design, power delivery, circuit design, simulation, board bring-up, validation, debugging, and automation. This internship provides an opportunity to apply concepts learned through coursework, labs, research, and technical projects to real-world hardware challenges while collaborating with Intel's cross-functional engineering teams. What You’ll Do Depending on project and team needs, you mayhave the key responsibilities will include but not limited to : Support GPU and AI accelerator board and power design from concept through bring-up and validation. Assist with PCB schematic design, layout, component selection, and Bill of Materials (BOM) development. Learn to troubleshoot challenges involving high-speed board, power, digital, and analog design. Use engineering and simulation tools such as Cadence, Sigrity, SIMetrix, Mathcad, MATLAB, PowerDC, or similar tools. Participate in board bring-up, characterization, validation, and hardware debug. Use laboratory equipment such as oscilloscopes and thermal measurement equipment and support soldering/rework activities. Assist with evaluating power requirements and power-delivery solutions for GPU and AI accelerator designs. Develop or improve test methods and use Python or other scripting languages to automate measurements and data collection. Gain exposure t
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We are seeking a highly skilled and visionary Staff Signal and Power Integrity (SI/PI) Engineer to join our advanced hardware engineering team. In this role, you will be the definitive technical expert responsible for ensuring the signal quality, timing, and power delivery robustness of our most complex, next-generation robotaxi electronic systems. As a technical pillar within the organization, you will define overarching SI/PI architectures, establish company-wide simulation methodologies, guide electrical design and layout teams, and own the end-to-end sign-off for cutting-edge high-speed interfaces. In This Role, You Will Lead the SI/PI architecture and define constraints for next-generation, high-complexity, high-density printed circuit boards (PCBs) and overall system design. Collaborate at an architectural level with hardware design, silicon vendors, PCB layout, and mechanical engineering teams to define layer stack-ups, routing strategies, component placement, and power delivery architectures. Analyze, optimize, and sign off on advanced high-speed serial links (PCIe, Ethernet, MIPI, GMSL) and memory interfaces (LPDDR). Provide expert-level design guidance and validation for automotive-specific communication and audio protocols (A2B). Architect and conduct comprehensive Power Delivery Network (PDN) analysis, including DC IR drop, AC impedance modeling, and transient response analysis to ensure stable power delivery across complex multi-board systems. Drive the development of advanced SI/PI routing rules, simulation methodologies, automation scripts, and sign-off processes for the hardware engineering department. Tackle the most complex, unprecedented signal and power integrity challenges, performing hands-on root-cause analysis, lab measurements, and correlating simulation models with real-world testing. Act as a technical mentor and subject matter expert, elevating the SI/PI capabiliti
Zoox is looking for a Senior Signal Integrity and EMC Engineer to ensure the electrical reliability, signal fidelity, and compliance of our complex autonomous vehicle systems. In this role, you will own the end-to-end strategy for vehicle-level signal integrity, RF/wireless performance, and EMC. You will work within a multi-disciplinary engineering team to set rigorous requirements and ensure best practices are implemented from concept to production. You will serve as the domain expert on a variety of high-speed digital and RF design topics that bring our hardware to life safely and reliably. In this role, you will: Lead the development, implementation, and validation of vehicle-level signal integrity, grounding, and shielding strategies. Maintain rigorous technical requirements and EMC specifications applied across all electrical and electronic systems on all vehicle platforms. Define and maintain vehicle-level RF performance requirements, establishing specifications for all transmitters, receivers, and antenna systems to mitigate the electromagnetic impacts of physical vehicle installation on wireless communication. Perform and/or oversee signal integrity and power integrity (SI/PI) simulations and analysis for critical high-speed interfaces and power distribution networks. Simulate RF performance of all antennas, transmitters, and receivers as installed in a vehicle during the vehicle design phase to drive integration alignment. Collaborate with cross-functional design teams to ensure best practices for signal integrity, RF design, and EMC are implemented. Lead design reviews to identify and remediate vulnerabilities early to meet project milestones. Develop and execute validation plans for vehicle-level signal integrity, RF/wireless performance, and EMC, including radiated and conducted emissions/immunity. Troubleshoot and resolve complex signal integrity, RF, and EMC issues discovered during design, validation, and
The Role We are seeking a highly skilled and hands-on SoC Floorplan Lead to own the physical foundation of our next-generation AI and Data Center SoCs. In this critical role, you will be the bridge between architecture, logic design, and physical design. You will work hand-in-hand with Chip Architects and RTL Leads to influence micro-architecture and ensure the physical implementation achieves best-in-class Power, Performance, and Area (PPA). If you love solving complex spatial puzzles on advanced technology nodes, integrating sensitive analog components, and driving execution in a high-energy start-up environment, this is the role for you. Key Responsibilities Top-Level Floorplanning: Own the SoC-level floorplan from concept to tape-out for high-performance, large-scale AI/Data Center chips on advanced process nodes (e.g., 5nm, 3nm or below). Architecture & RTL Collaboration: Partner closely with Architecture and RTL teams to provide early physical feasibility feedback. Drive block partitioning, shape optimization, and data-flow planning to achieve the absolute best PPA. Bump & Package Co-Design: Lead bump planning and IO ring definition. Work with packaging teams on flip-chip/advanced packaging constraints, ensuring optimal signal escape and power delivery. Custom & Analog Routing: Manage the placement and custom routing strategies for critical Analog/Mixed-Signal (AMS) IPs, high-speed SerDes (PCIe, Ethernet, Memory interfaces), PLLs, and sensitive clock distributions. Power Delivery Network (PDN): Design and analyze the top-level power grid, ensuring robust power delivery for high-current AI workloads while minimizing IR drop. Pin Assignment & Feedthroughs: Manage macro placement, block-level pin assignments, and top-level feedthrough planning to optimize global timing and routing congestion. Methodology Development: Build and maintain scalable Floorplanning workflows and
About the job Design the high-speed signal paths that let advanced AI compute systems perform at datacentre scale. As a Signal Integrity Engineer, you will shape the electrical performance of Graphcore hardware platforms. Your work will help 112Gbps and 224Gbps SERDES, DDR and processor interfaces operate within demanding system budgets. You will develop, extract and simulate PCB structures across production systems and test boards. You will define launches, via structures, transmission lines, stack-ups and low-loss materials for future designs. This role spans simulation, lab validation and practical design influence. You will work from concept through prototype bring-up, debug, validation and support for manufacture. The team and culture You will join the Hardware Engineering team, working closely with PCB, package substrate, system architecture and supplier teams. Work moves through simulation, design review, lab evidence and practical trade-offs. You will be expected to own signal integrity decisions across complex board and package interfaces. The team values careful analysis, pace and clear communication when problems need action. Decisions are made close to the engineering detail. You will challenge designs, guide constraints and help teams reach the best performance possible. What we’re looking for · Strong experience in high-speed digital circuit development, with deep signal and power integrity knowledge · Experience with high-frequency SERDES design and validation, including tens of GHz operation · Expertise using tools such as ANSYS SIWave, HFSS, Mentor HyperLynx or similar · Ability to design BGA and connector launches, via structures and transmission lines for GHz signals · Hands-on lab experience using VNAs, high-speed oscilloscopes and signal generators · Rigorous approach to design, debug and validation, with strong ownership and communication skills While we have outlined a set of requirements, we value transferable skills and diverse experiences.
About the job Design the high-speed signal paths that let advanced AI compute systems perform at datacentre scale. As a Signal Integrity Engineer, you will shape the electrical performance of Graphcore hardware platforms. Your work will help 112Gbps and 224Gbps SERDES, DDR and processor interfaces operate within demanding system budgets. You will develop, extract and simulate PCB structures across production systems and test boards. You will define launches, via structures, transmission lines, stack-ups and low-loss materials for future designs. This role spans simulation, lab validation and practical design influence. You will work from concept through prototype bring-up, debug, validation and support for manufacture. The team and culture You will join the Hardware Engineering team, working closely with PCB, package substrate, system architecture and supplier teams. Work moves through simulation, design review, lab evidence and practical trade-offs. You will be expected to own signal integrity decisions across complex board and package interfaces. The team values careful analysis, pace and clear communication when problems need action. Decisions are made close to the engineering detail. You will challenge designs, guide constraints and help teams reach the best performance possible. What we’re looking for · Strong experience in high-speed digital circuit development, with deep signal and power integrity knowledge · Experience with high-frequency SERDES design and validation, including tens of GHz operation · Expertise using tools such as ANSYS SIWave, HFSS, Mentor HyperLynx or similar · Ability to design BGA and connector launches, via structures and transmission lines for GHz signals · Hands-on lab experience using VNAs, high-speed oscilloscopes and signal generators · Rigorous approach to design, debug and validation, with strong ownership and communication skills While we have outlined a set of requirements, we value transferable skills and diverse experiences.
About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach is seeking a highly skilled Prototype Machinist to support the development of next-generation hardware through precision machining and rapid iteration. In this role, you will work closely with engineering teams to transform early-stage designs into functional prototypes, helping accelerate product development from concept to reality. You will own the complete machining process, from setup and programming adjustments to inspection and troubleshooting, while operating in a fast-paced, high-accountability environment where speed, quality, and innovation are critical. Key Responsibilities Machine complex prototype and low-volume production components using CNC mills, lathes, and multi-axis machining centers. Interpret engineering drawings, CAD models, and GD&T requirements to determine optimal machining strategies. Set up, operate, and troubleshoot CNC equipment with minimal supervision. Collaborate directly with design and manufacturing engineers to improve part manufacturability and reduce iteration cycles. Program, edit, and optimize CNC programs and toolpaths to meet aggressive development timelines. Select tooling, workholding, and machining parameters appropriate for a wide range of materials and geometries. Perform first-article and
About the Team DoorDash Labs is a team within DoorDash building autonomous delivery robots and other autonomy solutions from the ground up for DoorDash's core delivery platform. If you have a passion for applying autonomy and robotics in a service used by millions of people daily, then we want to talk to you! About the Role We are seeking a hands-on Electrical Engineer to review the design, drawings, and schematics of the electrical systems for our 4-wheeled autonomous delivery robot. This role is responsible for delivering robust, production-ready hardware across high-speed digital design, PCBAs, RF integration, harnessing, and board-level packaging. This is a deeply technical position for someone who can move seamlessly between system-level thinking and detailed circuit execution. You're excited about this opportunity because... Develop electrical systems for a complex mobile robotic platform from concept through production. Lead high-speed digital design efforts (PCIe, MIPI, Ethernet, DDR, multi-gigabit SERDES, etc.). Own PCBA development including schematic capture, stack-up definition, layout guidance, impedance control, and design-for-manufacture. Drive RF integration (Wi-Fi, LTE/5G, GNSS, Bluetooth, RADAR, and LiDAR), antenna placement, layout constraints, and signal integrity. Develop and review cable harness designs, connector selection, grounding strategy, and environmental robustness. Collaborate closely with mechanical engineering on board packaging, thermal management, vibration resistance, and environmental sealing. Define and implement power distribution architecture, battery interfaces, protection circuits, and system monitoring. Ensure compliance with EMI/EMC and regulatory requirements (FCC/CE) (CISPR-25 and FCC Part 15 Class A). Support prototype builds and bring-up, debug hardware/firmware interface issues, root-cause failures, and drive corrective actions quickly. Establish design standards and perform detailed design reviews across the EE team.
1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation
About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Senior Conceptual Design Engineer, Advanced Concepts to lead conceptual design of hypersonic and high-speed atmospheric vehicles from mission requirements through preliminary design. You will drive vehicle architecture recommendations, develop configuration baselines, perform first-order sizing, and guide multidisciplinary trades where aerodynamic heating, thermal protection, and propulsion integration fundamentally shape the design space. You will work closely with Aerodynamics and Aerothermal engineers, who own the detailed CFD and aerothermal analysis, and decide how their results reshape the concept. You will also define requirements and validation needs for conceptual sizing and MDAO models in partnership with the MDAO team. This is a new capability at Mach Industries; you will guide early technical direction and shape how the company approaches advanced concept development from first sketch through hardware. This role is part of Conceptual Design within Mach's Vehicle Design and Performance organization, alongside MDAO and Operational Performance. Conceptual Design creates, MDAO enables, and Operational Performance assesses. You will interact with every relevant engineering department across the organization, a
About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Energetics is seeking a Propulsion Test Engineer to support the planning, execution, and analysis of next-generation propulsion and energetic systems for advanced defense applications. In this role, you will work directly on propulsion hardware, test infrastructure, and data-driven test campaigns that enable rapid development, validation, and deployment of mission-critical systems. You will serve as the bridge between design and flight, ensuring propulsion systems perform reliably under extreme operating conditions. Key Responsibilities Test Design & Setup: Design and maintain propulsion test stands and ground support systems used to secure engines during static fire and development testing. Execution: Lead and support test campaigns ranging from component-level testing (valves, regulators, feed systems) to full-scale integrated rocket engine hot-fire operations. Data Analysis: Use high-speed sensors and instrumentation to collect and analyze pressure, temperature, and thrust data to validate performance against specifications. Safety & Operations: Execute and oversee hazardous operations involving high-pressure systems and cryogenic propellants such as liquid oxygen (LOX), ensuring strict safety compliance and operational disciplin
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job responsibilities: Technical Expertise : Should possess very strong PCB technical knowledge on high-speed layouts with HDI technology and have very good experience with DDR4/DDR5, PCIe4/5/6, ONFI4.0/ONFI5.0, SMBus and I2C interfaces placement and routing consideration. Strong design experience of power delivery network routing using PMIC devices. Design and Development: Lead the design and development of, SSD's drive PCB layouts, EDSFF (E3.S, E1.L, E3.L) and U.2 form factors, daughter cards, Evaluation and Test PCB layouts. Quality Assurance: Ensure all designs comply with industry standards (IPC) and regulatory requirements (UL, IEC). Problem Solving: Troubleshoot and resolve issues related to PCB design and manufacturing. Documentation: Maintain detailed documentation of PCB designs, modifications, and testing procedures. Collaboration: Work closely with other engineering teams, including hardware, simulation (SI/PI), and mechanical engineers, to integrate PCBs into larger systems. Continuous improvement: Participate in internal technical, DFM/DFA, Continuous Improvement, Industry st
Toradex is a global company strongly focused on engineering & technology. We’re powered by a diverse & uniquely gifted workforce. We pursue the best people to propel our innovative vision of embedded computing and IoT. If you’re interested in being a driving force at an agile technology company, engineering clever computing solutions & helping other companies bring their products to life, we should talk. ABOUT US Toradex Solutions Inc. is a premier provider of high-tech electronics design, and full cycle product development and manufacture in the heart of Toronto. Our first class in-house services have helped a diverse group of customers across North America and Europe develop innovative products. We are seeking an individual who is ready to give their best to join us as we pursue new and exciting technologies. We are seeking an individual who is ready to give their best to join us as we pursue new and exciting technologies. JOB DESCRIPTION We are looking for an Embedded Electronics Designer to join our team at the Mississauga facility. As an Electronics Designer you will work with our highly talented team to develop state-of-the-art, innovative products for our customers. RESPONSIBILITIES Design of carrier boards for system-on-module’s and microcontroller based devices Analog and digital circuit design Mixed-signal and high speed digital PCB design Debugging, testing and fixing existing hardware, firmware & software. Design PCB’s that are high quality, innovative, and meet the customers cost, time, and visual requirements Support product certification Working closely with our on-site manufacturing team to support prototype build and volume manufacturing Follow through with projects from concept to production, and customer support. Consistently staying well-versed in the electronics field, layout, assembly processes, and tooling. PREFERRED QUALIFICATIONS This position will be compensated according to qualifications Post-secondary education in E
Graphcore is a globally recognized leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialized processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. We are opening a new AI Engineering Campus in Austin, which will play a central role in Graphcore's work building the future of AI computing. RESPONSIBILITIES Responsible for the maintaining all the network fabrics and network topologies operating at peak performance on Graphcore Data centers housing AI server platforms. Collaborate closely with our Network architecture team through all phases of the design and development lifecycle — from concept to deployment — ensuring timely, high-quality, and stable high-speed network fabrics. Primary support of deployed internal fabrics in our AI Datacenters. Direct escalation for Hardware, Link and, Performance issues on network fabrics. Escalation support for customer network fabrics (aligned to reference arch.) Triage day-to-day network topologies (scale-up, scale-out, and front-end networks) issues of Fabrics deployed in Graphcore Datacenters. REQUIREMENTS Bachelor’s, master’s degree or equivalent experience in Network Engineering/Security, Information Technology, Computer Science, Computer engineering, or a related field. 9+ years of hands-on experience in network engineering and 3+ years supporting networking on AI or Hyperscale Datacenters. Knowledge of Remote Direct Memory Access (RDMA) and its implementations, specifically ROCEv2 or InfiniBand Knowledge of Lossless network – Experience with congestion control and lossless Ethernet technologies including PDF, ECN and DCQCN. Versed in High-Bandwidth networ
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