Hvm Production Supervisor Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Strategic Manufacturing & Supplier Leadership ​ Develop and drive long-term manufacturing and equipment capability roadmaps to support future technology requirements, capacity expansion, and factory competitiveness. ​ Partner with strategic equipment suppliers to define and influence next-generation hardware, software, automation, and process capability improvements. ​ Translate Micron manufacturing challenges and future business needs into supplier development priorities and technology roadmaps. ​ Establish strategic partnerships with suppliers to accelerate deployment of innovative solutions that improve productivity, reliability, sustainability, and cost of ownership. ​ Evaluate emerging manufacturing technologies and assess their applicability to future Micron manufacturing needs. ​ ​ ​ Global Manufacturing Strategy ​ Influence manufacturing strategy across Micron&#39

SR MANAGER , OCT FE CPEE HVM DIFFUSION — Fab 10N/X, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. RAM RDA Description Summary: The primary focus of the RAM Applications team within High Volume Manufacturing (HVM) is to prevent process excursions and reduce defectivity in order to achieve Key Performance Indicator (KPI) targets. This objective is shared across the broader RAM organization. The Applications teams are responsible for developing inspection recipes used as line monitors and for driving Statistical Wafer Review (SWR) process improvements. By leveraging collected data, the team monitors process stability and reduces defectivity, leading to improved yield performance. Effective cross-functional communication is essential across the RAM organization, including coordination with equipment engineering, recipe development, process monitoring, and continuous improvement efforts. To support these objectives, equipment selection is critical for generating transfer parts and enabling future technology development. This may require selecting tools that do not exactly match those in the sending FAB, resulting in additional development work across multiple tools and process steps. RDA Description: In this entry level position, you will join Micron as an RDA Applications Engineer stationed in Taiwan remotely supporting our newest advanced manufacturing Fab in Idaho. You will work with state-of-the-art inline RDA inspection tools to monitor and maintain HVM line health. As an RDA Applications Engineer supporting Micron’s newest Fab, you will develop expertise in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Realtime Defect Analysis (RDA) and Metrology team plays a critical role in enabling world-class semiconductor manufacturing through advanced defect detection, process monitoring, and quality systems. We partner closely with manufacturing, process integration, process development, yield engineering, data science, and global high-volume manufacturing (HVM) sites to ensure process stability, defect visibility, and continuous improvement. Our team is passionate about innovation, collaboration, and delivering data-driven solutions that help prevent excursions and improve factory performance. As an ID1 RAM Quality Engineer, you will help define and maintain quality standards, monitoring systems, and best-known methods that support defect detection and metrology operations. You will analyze quality performance metrics, drive excursion mitigation, improve sampling strategies, and collaborate across global teams to identify and resolve process anomalies. This is an exciting opportunity to make a global impact through technical leadership, data analysis, and continuous improvement initiatives. Responsibilities: Develop and maintain quality control systems, sampling strategies, SPC compliance, and Wafer at Risk (WaR) processes for RDA and Metrology Analyze defect and process data to identify anomalies, drive excursion mitigation, and improve defect detection effectiveness Conduct audits, FMEA activities, and quality assessments while recommending and implementing process improvements

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion TIQ Program Manager , you will own key projects within the US Expansion Tool Install and Qual (TIQ) Program for our new US based High-Volume Manufacturing (HVM) sites. Your areas of ownership will include multiple of the following: Fab Support (FS) and Main Tool Auxiliary (MTA) enablement. Root Cause Analysis, Corrective and Preventative Actions, and Schedule execution; enable systems and processes to drive delays to zero (D2Z). Resource Leveling, Modeling, and Validation. Support TIQ Change Control Board (CCB): Management of a high-volume of change requests, mitigate cost and schedule impacts. Risk-Build and Disruptive change avoidance and management. Process Qualification for Tool Releases to enable capacity scale and speed. Construction, Facilities, and Layout engagement. Tool Install SPMO champion support for multiple Fab Process Areas. The ideal candidate must be willing to work as a TIQ Program Manager on site in Boise, Idaho to initially support the ID1/ID2 Fab Startup for approximately 18 months before permanently transitioning to the New York SPMO organization at the Clay, New York US Expansion HVM Site. Responsibilities: Own assigned projects and programs, drive execution to plan, and enable successful outcomes. TIQ business process execution, project tracking that includes driving Performance-to-Plan (P2P), and reporting Key Performance Indicator (KPI) metric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. Join a dynamic team today! This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownership, Process efficiency, Quality defense line and Yield improvement initiatives. Partner with suppliers to develop the process and equipment roadmap to meet Micron’s technology roadmap. Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Expertly lead the NPI BP team, facilitating collaboration among representatives from ADT, HVM, Manufacturing, and PI. Ensure all Global BP processes are strictly implemented and all evidence is meticulously recorded, highlighting and mitigating risks. Assess provided evidence to determine if it meets BP requirements. Coordinate the accurate signing off and recording of transfer documents. Own NPI BP benchmarks, preparing 4-UP if benchmarks fall below targets. Adjust NPI plans in Fab based on product introduction schedules and Qual progress. Collaborate with NPI BP owners to improve current BP and deploy BP in Fab16. Represent NPI BP in audits and support sample shipments for customers, internal qualifications, and engineering. Understand product quality requirements and demand through communication with PEP. Manage CMOS corner samples, following corner BP due to longer cycle times. Attend PDT meetings to update NPI progress and engage in initial NPI planning through Network build meetings. Develop yield curves for each NPI DID, l everaging AI to build models. Minimum Qualifications: Bachelor’s degree in Engineering or a related area, or equivalent practical experience. Proven experience in NPI BP and technology development. Strong leadership and collaboration skills. Ability to assess and mitigate risks effectively. Excellent communication an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process and Equipment Engineering Manager at Micron Technology, you will lead top process and equipment groups to expand manufacturing capacity in the newest Memory Fab in the United States. Your primary responsibility over the next 1-2 years will be leading the hiring of the process teams for the Dry Etch area, developing and managing the training plans for these new engineers, and partnering closely with our global DRAM manufacturing teams to startup the new high volume manufacturing (HVM) facility in Boise, ID (ID1). This position requires collaborating with the ID1 Leadership Team, University Relations, Global HVMs, TD, Procurement, Facilities as well as interaction with equipment and materials suppliers to drive area manufacturing alignment. Responsibilities: Complete all required safety training and ensure adherence to Micron safety policies while encouraging a positive work environment Develop the strategic vision for establishing the ID1 Process and Equipment Engineering Dry Etch Process team Set and communicate ambitious performance targets and line-of-sight goals to team members Partner with Manufacturing Engineering (ME) and Industrial Engineering (IE) teams to validate capacity planning and achieve required wafer output Support department business processes for process qualification on new tools Serve as a key resource for technical support, working with global counterparts to identify and implement best-known methods

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data ‑ driven root ‑ cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Probe Operation Engineer at Micron Technology, Inc., you will play a pivotal role in maximizing Probe output and ensuring on-time customer delivery commitments. Our mission is to optimize probe operations by expanding line driving and implementing a proactive, shift-left capacity plan that balance within HVM/NPI and TD requirements. We are committed to continuously improving KPIs (including CT and probe out precise control until PSPT levels) and reducing cycle time, ensuring an efficient and reliable probe process that maximizes overall output. This position requires strong analytical skills to identify issues, outs projections, and implement strategies that unlock capacity and accelerate throughput. You will collaborate closely with SIC planning and probe equipment team, Supply Chain, MCT, Manufacturing, and Engineering teams to align on the weekly outs commitment and mitigate risks impacting delivery timelines. Additional responsibilities include leading initiatives for cycle time reduction, yield improvement, and cost optimization, as well as supporting technology transitions and process diversification such as Probe project, Probe offload, Metallization and W2W handling. You will also develop automation tools to enhance planning accuracy, monitor KPIs (pace, cycle time, delivery adherence), and drive continuous improvement projects that directly impact customer satisfaction and Fab performance. Effective communication and global coordination are essential to achieve maximum output and flawless deliver

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo yield, quality, productivity, and cost improvement initiatives Resolve complex photo process issues (overlay, CDU, EPE, MMM, destack, RWC, yield matching) through data ‑ driven root ‑ cause analysis Define and deploy Photo Process Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex lithography customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT Photo in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo process engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability to act as a t

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description: As a QEM PQE Electrical Failure Analysis (EFA) Engineer, you will be responsible for driving deep technical understanding and resolution of yield, quality, and reliability challenges for advanced NAND memory products manufactured in Fab10. You will support both new product introduction (NPI) and high-volume manufacturing (HVM) by performing die-level electrical analysis, failure mode construction, and innovative characterization to enable robust product qualification and continuous yield improvement. Leveraging strong knowledge in device physics, probe testing, and wafer fabrication processes, you will identify root causes of electrical failures and translate insights into actionable test, process, and design improvements to enhance product performance and outgoing quality. Job Responsibility: Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description The F16N PEE Manager is accountable for establishing and continuously improving the performance of the Section critical metrics to achieve Best-In-Class performance. This includes to achieve HVM performances in Safety, TTMCY, Maxout, CT and Cost. Your responsibilities also include establish collaboration between OMT and differnece divison and areas. As Section Leader, you will also partake in the selection, development and sustainability of a high value workforce, as well as technical and leadership development. The PEE Section Manager is also responsible for working with Technology deep learning, Operation efficiency and especial focus on big rock as Max Out, cost down, TTMCY and quality mindset. Responsibilities and Tasks Department Management Drive for efficiency in all work processes Identify manage and monitor key performance indicators (important metrics) for the section Establish a dedicated quality control culture within the section (SPC/FDC/defense line, etc.) Ensure effective change system management is maintained (SWR, GCP, GeRM, etc.) Formulate and drive fixes for main yield issues and IDL detractors across all products Drive process simplification projects and support RPT reductions to improve Fab efficiency and costs Strategic Coordination</b

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Global Planning Strategic Program Engineer, you will be handling program to drive FrontEnd Planning Transformative Initiative and Business Process Improvement. You will be collaborating with various stakeholders from Global and FrontEnd HVM team in Asia and USA. Responsibilities include but are not limited to: Understand the planning system and associated application used within Micron and ensure successful implementation through the network Understand the current business process and generate improvement proposal Identifying opportunities for automation and systemizing Ensuring standardization of best practice and implementation of Planning systems (e.g. Fazer, Tools List Web, PDM) Establishing planning input data governance across Planning network (Loading, Capacity Model) Collaborate with business partners and other teams (e.g SMAI, Global and Sites Planning, Layout, etc) to ensure successful deployment of system and business process established Job Requirements Bachelor’s degree with minimum 4 years of experience Fab Planning knowledge Proven Project Management skills in handling various project to meet objectives and timeline Excellent knowledge of Planning systems, applicat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3&#43; months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, exp