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The HBM Physical Design team is responsible for implementing advanced High Bandwidth Memory (HBM) SoC and base die designs that enable next-generation AI, high-performance computing, and data center solutions. The team collaborates across architecture, RTL, verification, DFT,…

The DRAM Technology Node Development team is responsible for bringing next-generation DRAM products from concept to production by improving yield, validating new features, and driving product quality. The team collaborates across design, process integration, manufacturing, and…

Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep…

The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via)…

As a Process and Equipment Engineering Manager at Micron Technology, you will lead top process and equipment groups to expand manufacturing capacity in the newest Memory Fab in the United States. Your primary responsibility over the next 1-2 years will be leading the hiring of…

RESPONSIBILITIES AND TASKS: Develop new tests and test algorithms for products, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times Develop test programs for products using primarily Python and C coding…

工作職責（RESPONSIBILITIES） 開發、優化及維護晶圓製造製程，以提升良率、品質、成本效益 與 生 產 效率 。 推動單站點（Process Step）製程改善與評估。 主導 產 線持續改善專案 。 運用 結構 系統 化方法（ FMEA 、 8D 、 SPC 、 FDC ） 分析良率與缺陷問題。 診斷根本原因，並將生 產停機時間降至最低。 運用資料分析預防問題反覆發生。 運用 SPC 、 FDC 與 APC 追蹤製程表現並偵測製程 </s

Responsibilities: Lead DRAM technology transfer efforts between development and manufacturing locations. Coordinate transfer achievements, qualification plans, and execution readiness reviews. Drive issue resolution during transfer ramp and production transition. Analyze process…

工作職責（ RESPONSIBILITIES ） 透過發掘問題、推動矯正措施及生命 週期 改善策略，對設備效能與可靠性負起責任 運用結構化的問題解決方法診斷技術問題，促成機台快速復機，並預防潛在問題發生 推動設備升級／改造專案，導入硬體解決方案，並與供應商合作解決問題 跨部門協作（製程、製造、廠務、品質、維護團隊），共同解決問題 向利害關係人溝通分析結果與建議事項 建立並維護標準作業程序（ SOP ）與問題排除指南，並推動知識分享 確保符合安全、品質與製造相關標準  Own and continuously improve equipment…

Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing solutions that…

Micron Idaho Semiconductor Manufacturing (Triton) LLC Responsible for connecting many parts of the business to drive the execution of manufacturing, which includes collaboration with Supply Chain, Engineering, Production, and TD. Fluent in the weekly wafer starts and outs…

Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation,…

職務内容 Tool Install Engineerは、Micron広島工場における半導体製造装置の新規導入、増設、移設、改造および撤去プロジェクトを担当します。設備オーナー、プロセスエンジニア、Facilities各部署、建設業者および装置メーカーと連携し、Tool InstallationおよびHookup工事を安全・高品質・納期遵守で実行します。…

Tool Install Engineer at Micron in Hiroshima, Fab 15, Japan.

Responsibilities include, but not limited to: Develop strategies and execute to improve Equipment maturity for First of a Kind (FOAK) hardware. Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to…