Project Title Cumulative Error Variation Reduction in Staircase and Chop Etch Processes Project Description Analyze manufacturing process and measurement data to identify sources of cumulative error variation within advanced-technology staircase and chop etch processes. Develop…
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Location Singapore Department Product Engineering Project Title Machine Learning and Agentic AI Solutions for Semiconductor Product Engineering Project Description The Product Engineering Machine Learning and Agentic AI Intern will undertake an engineering project focused on…
Location Bendemeer, Singapore Department Assembly, Process and Equipment Engineering Project Title Assembly Output and Yield Optimization for Cost Improvement Project Description The Assembly Process and Equipment Engineering Intern will undertake an engineering project focused…
Location Micron Singapore Bendemeer (MSB), Singapore Department Storage Technology Product Group, Product Engineering Firmware Project Title AI-Enabled Manufacturing Firmware Development and SSD Failure Analysis Project Description The intern will undertake an engineering…
Project Scope The intern will be given the opportunity to: Understand Micron's particle contamination control strategy and cleanroom quality requirements. Learn the functionality and application of real-time particle monitoring systems. Coordinate with vendors, Facilities,…
Location Micron Singapore Bendemeer (MSB) Department Solid State Drive Manufacturing Operations Project Title Solid State Drive Manufacturing Productivity and Operational Improvement Project Description The Solid State Drive Manufacturing Intern will undertake a structured…
Location Singapore Department Test Engineering Project Title AI-Enabled Predictive Analytics for SSD Test Equipment Health Monitoring Project Description Objective of the Project Develop a data-driven equipment monitoring framework that leverages engineering data and AI-enabled…
Location Singapore Department NAND Product Engineering, Probe Product Engineering Project Title AI-Enabled Wafer Probe Test Optimization and Yield Analytics Project Description The NAND Probe Product Engineering Intern will undertake an engineering project focused on wafer probe…
Location Singapore Department Process Equipment Engineering (PEE) Project Title AI-Enabled CMP Equipment Health & Breakage Risk Prediction Dashboard Project Description Chemical Mechanical Planarization (CMP) tool performance directly influences wafer quality, equipment…
Location Micron Singapore Bendemeer (990 Bendemeer Road, SIngapore 339942) Department MSB Test Solutions Engineering Project Title NAND Component Test Flow Optimization Using AI-Enabled Data Analytics and Automation Project Description The intern will participate in a structured…
Project Title: AI-Enabled Quality Engineering Transformation for Semiconductor Manufacturing Project Description Develop quality engineering expertise in semiconductor manufacturing through analytical problem-solving, statistical analysis, quality systems, process…
Location F10NX Department Probe Project Title Move Table Optimizer: Applied Artificial Intelligence for Wafer Test Optimization Project Description Develop an applied Artificial Intelligence solution that automatically generates optimized wafer test movement configurations.…
Location F10N, 1 North Coast Drive, Singapore 757432 Department Non-Volatile Memory Test Engineering Project Title AI-Driven Test Engineering Automation and Analytics for NAND Products Project Description As an Intern Test Solutions Engineer in Non-Volatile Memory Test…
Location Singapore Department Photo Manufacturing Project Title Photo Train Size Optimization Through Advanced Data Analytics Project Description The Photo Manufacturing area plays a critical role in wafer fabrication, where train size directly influences tool utilization,…
Project Title Target Traveler Deployment for Enhanced Process Control in Semiconductor Probe Operations Project Description Develop and deploy a digital Target Traveler solution to standardize process control and improve execution consistency across Probe operations. The project…
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