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Layout Engineer Jobs

237 active opportunities Β· Updated for October 2026

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U
9 days ago

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms. Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies. Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis. Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability. Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production. Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle. Q ualifications Bachelor’s degree or above in Electrical Engineering or a related discipline. 5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment. Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules. Practical experience with complex power d

O
OpenAI
πŸ“ San Franciscoβ€’ Full-timeβ€’ Remote
1mo ago

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams. This role is based in San Francisco and requires in-person presence four days per week. In this role, you will: Own PCB layout, component placement, routing, and fabrication release for complex robotic systems. Collaborate with SI/PI engineers to refine layouts based on simulation results. Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements. Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release. Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes. Inspect newly received PCBAs and participate in board-level manufacturing failure analysis. Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models. You might thrive in this role if you: Have 6+ years of experience designing complex, multilayer PCBs. Are fluent in Cadence Allegro PCB Designer and Constraint Manager. Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

REMOTEawsrestai
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