Mechanical Design Verification Engineer Jobs

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a New Graduate Electrical & Avionics Engineer to support the design, development, integration, and testing of electrical systems for next-generation autonomous defense platforms. In this role, you will work across circuit-board design, avionics, power distribution, communications, vehicle harnessing, and hardware testing to take systems from early prototypes through flight-ready production hardware. You will collaborate closely with mechanical, software, systems, manufacturing, and test engineers to rapidly build, troubleshoot, and validate reliable electrical systems. This role is ideal for a hands-on engineer who wants broad technical ownership, learns quickly, and is excited to build critical hardware in a fast-paced environment. Key Responsibilities Design and develop electrical and avionics systems for autonomous aircraft, missiles, propulsion systems, and related defense platforms. Support schematic capture, component selection, PCB layout, stack-up design, and board bring-up. Design circuits incorporating microcontrollers, high- and low-speed communication buses, analog and digital interfaces, sensors, power distribution, EMI protection, and ESD protection. Develop flight avionics, guidance and control elect

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a New Graduate Electrical & Avionics Engineer to support the design, development, integration, and testing of electrical systems for next-generation autonomous defense platforms. In this role, you will work across circuit-board design, avionics, power distribution, communications, vehicle harnessing, and hardware testing to take systems from early prototypes through flight-ready production hardware. You will collaborate closely with mechanical, software, systems, manufacturing, and test engineers to rapidly build, troubleshoot, and validate reliable electrical systems. This role is ideal for a hands-on engineer who wants broad technical ownership, learns quickly, and is excited to build critical hardware in a fast-paced environment. Key Responsibilities Design and develop electrical and avionics systems for autonomous aircraft, missiles, propulsion systems, and related defense platforms. Support schematic capture, component selection, PCB layout, stack-up design, and board bring-up. Design circuits incorporating microcontrollers, high- and low-speed communication buses, analog and digital interfaces, sensors, power distribution, EMI protection, and ESD protection. Develop flight avionics, guidance and control elect

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today, SpaceX is actively developing the technologies to make this possible, with the ultimate goal of making life multiplanetary and expanding consciousness to the stars. SpaceXSI is building Super Intelligence to help humanity understand the universe. Our teams are building the full Super Intelligence stack: from our Colossus supercomputers, to Grok models, to our suite of applications, including Grok Bot, Grok Build, Grok Imagine, Grok Voice, and X. We're creating a powerful flywheel where more compute trains better models, better models power more useful products, and what we learn from people using those products shapes what we build next. ABOUT THE ROLE: The Data Center Engineering team designs training and inference compute clusters from first principles, pushing thermal, electrical, and optical systems to the limit of physics. We operate as a highly cross disciplinary team comprised of mechanical, electrical, optical, and software engineers, all working to maximize the efficiency, reliability, and deployment speed of terrestrial compute to serve rapidly scaling demand. As a Network Connectivity Engineer, you will design, deploy, and qualify large scale fiber optic networks for hundreds of thousands of coherently connected GPUs. You’ll architect systems for maximum bandwidth and minimum latency, collaborating with optical, mechanical, and software engineers to translate your designs into the largest coherent computing networks in the world. RESPONSIBILITIES: Design and plan scalable, future-proof data center connectivity for clusters of hundreds of thousands of GPUs, including structured cabling plants that support evolving architectures and speeds beyond 800G. Procure fiber, copper, and other connectivity materials for new builds, expansions, and technology refreshes. Provide project management and construction

About the Team Industrial Compute is building the world's most advanced AI infrastructure. Working alongside our capital partners, engineering teams, and construction organizations, we design and deliver large-scale, mission-critical compute campuses that power the next generation of AI. Our Design organization brings together engineering, construction, and digital design to ensure facilities are coordinated, constructible, and optimized from the earliest planning phases through deployment. About the Role We are seeking a BIM Designer & Coordinator to support the planning and design of large-scale industrial and mission-critical facilities. In this role, you will develop, coordinate, and maintain multidisciplinary BIM models across Civil, Electrical, Mechanical, Architectural, and Structural disciplines, enabling early design validation, constructability reviews, equipment planning, and cross-functional coordination. You will partner closely with internal engineering teams, external design consultants, contractors, and project stakeholders to produce coordinated BIM deliverables that improve design quality, reduce project risk, and support efficient execution across Industrial Compute's global infrastructure portfolio. Key Responsibilities: Develop and maintain conceptual and schematic BIM models for large-scale industrial and MEP-intensive facilities. Coordinate BIM models across Civil, Electrical, Mechanical, Architectural, and Structural disciplines. Create and maintain federated models used for design reviews, spatial coordination, constructability analysis, and clash detection. Model major building systems including equipment layouts, utility corridors, electrical rooms, mechanical rooms, structural framing, site infrastructure, and architectural constraints. Coordinate equipment clearances, maintenance access, routing zones, shafts, risers, utility entrances, and major MEP pathways. Translate engineering sketches, basis-of-design documents, equipment lists

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Director, Package Quality & Reliability Engineering Job Summary The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM). This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC. Working closely with Package Development Engineering (PDE), front-end fabrication, manufacturing, and quality teams, the role drives Design for Reliability (DFR), qualification rigor, and structured problem-solving at the chip-to-package interface, while building strong team capability and operational excellence. Main Responsibilities Package Quality & Reliability Engineering Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo-mechanical str

About Us: Samara Aerospace is revolutionizing satellite design by addressing the challenges of deploying and managing large satellite constellations. Our innovative Hummingbird spacecraft bus offers a modular and scalable platform that streamlines satellite production and deployment, significantly reducing launch costs. Hummingbird's compact architecture maximizes launch capacity, making it the most efficient and agile spacecraft in the industry. At the core of our technology is the patented Multifunctional Structures for Attitude Control (MSAC) system. Unlike traditional wheel-based pointing control systems, MSAC utilizes actuators embedded in the hinges of deployable solar panels to provide 3-axis attitude control and active jitter cancellation. This design eliminates the need for spinning wheels, reducing mass and potential points of failure, while enhancing pointing precision. Role: The Electrical Engineering team at Samara is seeking an Electrical Engineer to lead the design, layout, and testing of printed circuit boards for spacecraft electronics at our headquarters in San Francisco. This is a startup environment where you will own designs end-to-end, from early concept through production. A strong problem-solving background, hands-on testing skills, and experience with high-density PCB design and electronics integration. You'll work closely with experienced electrical, mechanical, and embedded software engineers to ensure the Hummingbird satellite's electronics are robust, manufacturable, and ready for the space environment. Responsibilities: Own PCB Design from circuit design, schematic capture, and PCB layout through bring up testing. Conduct trade studies that balance electrical performance, signal integrity, thermal management, manufacturability, cost, and schedule. Collaborate with embedded software engineers during board bring-up, debugging, and hardware-software integration. Support spacecraft and board-level integration, including hands-on assi

About Us: Samara Aerospace is revolutionizing satellite design by addressing the challenges of deploying and managing large satellite constellations. Our innovative Hummingbird spacecraft bus offers a modular and scalable platform that streamlines satellite production and deployment, significantly reducing launch costs. Hummingbird's compact architecture maximizes launch capacity, making it the most efficient and agile spacecraft in the industry. At the core of our technology is the patented Multifunctional Structures for Attitude Control (MSAC) system. Unlike traditional wheel-based pointing control systems, MSAC utilizes actuators embedded in the hinges of deployable solar panels to provide 3-axis attitude control and active jitter cancellation. This design eliminates the need for spinning wheels, reducing mass and potential points of failure, while enhancing pointing precision. Role: Samara Aerospace is seeking a Senior RF Engineer to join our growing engineering team. In this role, you will own the full lifecycle of RF systems development—from requirements definition and architectural trade studies through design, fabrication, test, and qualification. You will collaborate closely with electrical, mechanical, thermal, software, and systems engineering teams to develop high-performance RF solutions in a fast-paced, mission-driven environment. Responsibilities: Lead architectural R&D efforts for new RF communications and payload subsystems by conducting trade studies and establishing requirements Develop and maintain RF system models and simulations, perform end-to-end link budget analysis, noise and linearity cascades, and interference/co-existence assessments to validate system performance margins across operating conditions. Drive the full hardware development cycle from bench prototype through design validation and qualification testing. Defining test plans, executing characterization campaigns, and documenting results to demonstrate compliance with

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Role Summary We are looking for a Camera Hardware Engineer who will take ownership of camera system design, validation, and optimization for UI’s product lines. This role involves designing high-speed, high-reliability hardware, performing bring-up and debugging, and collaborating with global cross-functional teams to ensure the best product quality and performance. You will have the opportunity to work on cutting-edge SoC and image sensor platforms, contribute to the next generation of IP and wireless cameras, and be part of a team that values innovation, simplicity, and impact. Responsibilities Design and develop camera hardware systems, including schematic design, component selection, and PCB layout review. Perform high-speed signal design and analysis, ensuring proper impedance control and EMI/ESD compliance. Conduct hardware bring-up, debugging, and system validation using lab instruments (oscilloscope, logic analyzer, TDR, network analyzer, etc.). Collaborate with firmware, mechanical, and manufacturing teams on system integration, tuning, and production readiness. Drive DFM/DFT improvements and support prototype builds, EVT/DVT validation, and root-cause analysis. Evaluate new image sensors, ISPs, and SoC platforms for upcoming product designs. Maintain detailed hardware documentation, BOMs, test reports, and validation re

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Package Development & Engineering Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments. Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems. Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness. Analyze engineering data, identify risks, document findings, and recommend technically sound actions. Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives . Design, CAD & EDA Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables. Use CAD/EDA tools

About the Team The Consumer Products team at OpenAI builds the hardware that brings advanced AI technology directly into people’s hands. We design, engineer, and manufacture next-generation consumer devices that combine elegant design, robust engineering, and cutting-edge AI. Our team spans mechanical, electrical, and systems engineering — partnering closely with industrial design, operations, and software to create seamless, high-quality experiences that make AI more accessible and useful. About the Role As a Hardware Engineer on the Consumer Products team, you’ll contribute to the design, development, and integration of complex hardware systems for new AI-driven devices. You’ll work across disciplines to translate early product concepts into reliable, scalable, and beautifully crafted products ready for mass production. This role is based in Singapore. We follow a hybrid model (four days per week in the office) and offer relocation support for new employees. Occasional travel to manufacturing partners may be required. In this role, you will: Design, prototype, and validate mechanical and electrical subsystems from early development through mass production. Collaborate closely with design, operations, and manufacturing teams to ensure quality, reliability, and scalability. Drive DFM/DFA reviews, design iterations, and bring-up of prototype and pilot builds. Debug complex system-level issues and lead root-cause investigations and resolutions. Partner with global suppliers and cross-functional teams to ensure flawless execution from concept to launch. You might thrive in this role if you: Have 6+ years of experience in consumer hardware, consumer electronics, or advanced product development. Bring deep technical fluency in mechanical, electrical, or systems engineering (cross-disciplinary experience a plus). Have taken at least one consumer product from concept to mass production. Are energized by hands-on problem solving, iteration, and building in fast-paced enviro

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Senior Manufacturing Engineer, Jet Engine to lead the development and industrialization of jet engine assembly and test systems. You will own manufacturing line design and develop the assembly, balancing, inspection, and end-of-line test processes required to build engines safely, repeatedly, and at production rate. This is a hands-on engineering role. You will work directly with engine hardware to develop manufacturing processes, tooling, fixtures, inspection methods, balancing processes, and test systems, then translate those processes into scalable production equipment. Key Responsibilities Lead manufacturing line design for jet engine subassembly, final assembly, inspection, balancing, and end-of-line testing. Translate product requirements and production targets into process flows, assembly sequences, equipment requirements, cycle times, line layouts, and capacity models. Develop robust assembly processes for turbomachinery and precision mechanical assemblies, including controlled fastening, joining, bearing installation, fits, clearances, alignment, concentricity, runout, and tolerance stack-up. Develop tooling, fixtures, gauges, error-proofing, and process controls to reduce assembly variation and operator dep

About the Team The Consumer Products team at OpenAI builds the hardware that brings advanced AI technology directly into people’s hands. We design, engineer, and manufacture next-generation consumer devices that combine elegant design, robust engineering, and cutting-edge AI. Our team spans mechanical, electrical, and systems engineering — partnering closely with industrial design, operations, and software to create seamless, high-quality experiences that make AI more accessible and useful. About the Role As a Hardware Engineer on the Consumer Products team, you’ll contribute to the design, development, and integration of complex hardware systems for new AI-driven devices. You’ll work across disciplines to translate early product concepts into reliable, scalable, and beautifully crafted products ready for mass production. This role is based in Singapore. We follow a hybrid model (four days per week in the office) and offer relocation support for new employees. Occasional travel to manufacturing partners may be required. In this role, you will: Design, prototype, and validate mechanical and electrical subsystems from early development through mass production. Collaborate closely with design, operations, and manufacturing teams to ensure quality, reliability, and scalability. Drive DFM/DFA reviews, design iterations, and bring-up of prototype and pilot builds. Debug complex system-level issues and lead root-cause investigations and resolutions. Partner with global suppliers and cross-functional teams to ensure flawless execution from concept to launch. You might thrive in this role if you: Have 6+ years of experience in consumer hardware, consumer electronics, or advanced product development. Bring deep technical fluency in mechanical, electrical, or systems engineering (cross-disciplinary experience a plus). Have taken at least one consumer product from concept to mass production. Are energized by hands-on problem solving, iteration, and building in fast-paced enviro

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities: Develop and optimize flip chip attach processes including bump formation, placement, reflow, and underfill for high-performance semiconductor packages. Define and manage bump metallurgy stacks (e.g., Cu pillar, SnAg, micro-bumps) and substrate pad finishes for robust interconnect performance. Drive package integration from die to substrate, ensuring alignment, coplanarity, and yield optimization. Evaluate and mitigate assembly risks including warpage, non-wet opens, voiding, head-in-pillow, and interconnect defects. Collaborate with substrate vendors, OSATs, and internal teams to define design rules (pad pitch, bump pitch, keep-outs, stack-ups). Lead process development for reflow profiles, flux selection, cleaning, and underfill dispense/cure. Perform root cause analysis of assembly and reliability failures using cross- sectioning, SEM, CSAM, and other failure analysis techniques. Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling. Work cross-functionally with design, reliability, thermal, and manufacturing teams to ensure robust package performance from concept through high-volume production. Required Technical Skills: Strong experience in flip chip packaging and assembly processes for semiconductor devices. Deep understanding of bumping technologies (solder bumps, Cu pillar, micro- bumps) and UBM/metallization systems. Experience with underfill materials, dispense techniques, flow behavior, and cure processes. Understanding of thermo-mechanical behavior in flip chip assemblies (CTE mismatch, warpage, solder