Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,
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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Own package architecture and execution from feasibility through tape-out, qualification, and production readiness, ensuring design intent is translated into manufacturable, reliable, and scalable solutions. Serve as the technical authority for complex package issues, leading cross-functional reviews, trade-off decisions, and risk closure across product, silicon, technology, assembly, quality, supplier, and OSAT teams. Balance performance, reliability, manufacturability, cost, quality, and schedule to deliver production-ready solutions while mentoring engineers through difficult technical decisions. Advance design rules, methodologies, automation workflows, and technology roadmaps for future products. Represent the packaging team in Silicon–package–board co-design by integrating floorplan, interface, interconnect, power, signal, thermal, and mechanical requirements, and resolve cost and manufacturing trade-offs to achieve a balanced package solution. Ability to apply baseline digital fluency and role-approp
Job Details: Job Description: The Role and Impact We are seeking a Silicon Packaging Design Architect to join our team, where you will drive end-to-end package solutions for physical, electrical, and cost requirements. In this senior engineering role, you will collaborate with cross-functional teams to design, troubleshoot, and continuously improve packaging standards and processes, ensuring high-quality package output. Your contributions will directly impact the seamless transition of designs to production and enhance Intel's advanced packaging technologies. Business Group As part of Intel Corporation's dynamic and innovative ecosystem, this role resides within the Silicon Packaging Architecture team, focused on developing advanced packaging solutions that enable Intel's cutting-edge silicon technologies. The team plays a vital role in ensuring packaging, and 3D IC designs meet technical, mechanical, and reliability standards while supporting Intel's broader mission to drive world-changing advancements in technology. Key Responsibilities Translate product requirements into detailed package architecture specifications. Drive technology tradeoff decisions to ensure silicon packages conform to electrical, mechanical, thermal, and reliability standards. Collaborate with silicon, hardware, and package teams to deliver high-quality package solutions and overcome roadblocks. Oversee the end-to-end package development process, including design, procedures, and continuous improvements to quality standards. Troubleshoot packaging designs and resolve issues related to materials and processes, providing innovative and cost-effective solutions. Implement co-design strategies between silicon and board design teams to optimize product
About the Team DoorDash Labs, established in 2018, serves as the innovation hub for DoorDash, focusing on developing automation and robotics solutions to enhance last-mile logistics. The team's mission is to create technologies that support and augment human networks, aiming to improve efficiency for Dashers, merchants, and consumers alike. We’re ruthlessly focused on business impact. We are a highly senior team composed of former pioneers from a variety of different robotics industries. As of 2025, DoorDash has completed 10B lifetime deliveries. We’re focused on how to do the next 10B even better About the Role As a Hardware Engineer, Electronics Packaging & Vehicle Integration, you will lead the mechanical architecture, design, and delivery of electromechanical systems for DoorDash’s next-generation autonomous delivery vehicle. You will develop robust packaging solutions for compute, electrical, communications, and sensor-related hardware that operate reliably in demanding real-world fleet environments. This role sits at the intersection of mechanical engineering, vehicle integration, and product reliability. You will partner closely with electrical engineering, PCB design, industrial design, systems engineering, manufacturing, supplier partners, reliability, and operations teams to turn system requirements into durable, manufacturable, serviceable, and cost-effective product designs. You will own designs from concept through launch, including electronic enclosures, housings, mounting systems, seals, connector interfaces, and vehicle-level integration features. Success in this role requires strong mechanical design judgment, practical experience with production processes, and the ability to resolve cross-functional packaging tradeoffs. Responsibilities: Own the mechanical design and release of electronic packaging, housings, enclosures, and vehicle integration solutions in support of program timing and product launch. Design components
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an MTC Shift Equipment Technician, you will support the Mask Technology Center by monitoring, maintaining , troubleshooting, and enhancing advanced semiconductor manufacturing equipment. You will work closely with production teams, sustaining groups, engineers, and equipment vendors to improve tool performance, ensure product quality, and promote ongoing improvement. This role requires strong mechanical and electrical troubleshooting skills, a proactive problem-solving approach, and dedication to safety, quality, and operational excellence in a fast-paced manufacturing setting. Responsibilities: Monitor, maintain , and improve clean room manufacturing equipment sets to ensure maximum uptime, reliability, and manufacturing performance. Perform scheduled preventative maintenance, corrective maintenance, and equipment repairs while minimizing production impact. Troubleshoot mechanical, electrical, vacuum, software, and process-related equipment issues using data-driven problem-solving techniques. Collaborate with production, sus
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary As an Equipment Technician at Micron, you will support the operation, maintenance, troubleshooting, and continuous improvement of advanced semiconductor manufacturing equipment. You will work alongside engineers and cross-functional teams to ensure equipment reliability, productivity, and product quality in a high-technology manufacturing environment. This role is ideal for recent Nitec, Higher Nitec, and Diploma graduates who enjoy hands-on technical work, problem-solving, and working with advanced equipment and automation systems. Main Responsibilities Perform preventive and corrective maintenance on manufacturing equipment. Diagnose and troubleshoot mechanical, electrical, pneumatic, and electro-mechanical issues. Monitor equipment performance and respond to equipment alarms and abnormalities. Support equipment recovery and restoration activities to minimize downtime. Execute equipment calibration and qualification activities. Complete maintenance records and documentation accurately. Participate in continuous improvement projects to improve equipment performance and reliability. Work closely with engineers, manufacturing teams, and vendors to support production operations. F
DR ASHWANI KUMAR VIJ : Has been retained to select 1 General Manager / Head - Sales and Marketing For a Growing and professionally managed Building Materials Organisation. Job description: -Responsible for ensuring achievement of monthly and annual sales target. -Increasing the domestic client base and expanding the reach geographically. -Ensuring that company gets listed on the the approved vendor list of the leading contractors, consultants and end clients. -Travel extensively to meet the existing and potential customers, generate new enquiries, participate in exhibitions to understand needs of the clients. -Monitor on - going and upcoming projects to target sales opportunities and identify new markets and new products for the company to venture in. -Monitor the performance of sales team and provide necessary guidance and support to ensure that their sales targets are achieved on monthly basis. -Develop and implement new sales initiatives/strategies for business growth and profitability Education/Qualifications/Experience Desired : 10 to 15 Years of relevant Industry/Product B.Tech / B.E. in Any Specialization, Mechanical Preferred. MBA from Premium Institute Preferred. Excellent Salary Package would be offered to the right candidate. Those who have applied earlier need not apply again. DR ASHWANI KUMAR VIJ : President : Sales Recruitment Email Complete/Structured CV, with Scanned copy of Visiting Card, Salary Drawn / Expected details at:
About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction
Job Summary The Supplier Quality Engineer II is a fully proficient professional individual contributor responsible for ensuring that purchased electronic, electrical, electromechanical, and mechanical components, materials, assemblies, and supplier-provided services meet company, customer, regulatory, and contractual quality requirements. Working with limited supervision, this position independently manages routine to moderately complex supplier-quality assignments across supplier qualification, risk assessment, auditing, performance monitoring, nonconformance investigation, corrective and preventive action, change management, and continuous improvement. The (Supplier Quality Engineer II) partners with suppliers and internal stakeholders in Strategic Purchasing, Procurement, Engineering, Manufacturing, Quality, Product Management, Logistics, and other functions to resolve quality issues, strengthen supplier capability, reduce risk, and improve product and process performance. The role applies broad working knowledge of quality engineering principles, electronics-component manufacturing processes, drawings and specifications, quality systems, structured problem-solving methods, and statistical analysis to identify root causes, evaluate containment and corrective actions, and recommend practical solutions. Consistent with a second-level professional contributor role, the Supplier Quality Engineer II independently handles varied assignments within established policies and professional standards, exercises judgment when selecting and adapting methods, manages multiple priorities, and escalates issues that involve significant technical, commercial, customer, or compliance risk. The position may lead to defined supplier-quality projects, facilitate cross-functional problem-solving activities, and provide technical guidance or knowledge sharing to less-experienced employees without formal people-management responsibility. This is the second level within the Supplier Qualit
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Develop and optimize HBM assembly and packaging processes to achieve manufacturing targets. Analyze process data and identify improvement opportunities using statistical and data-driven methodologies. Utilize AI-enabled tools and advanced analytics to improve troubleshooting efficiency and accelerate root cause identification. Drive yield improvement, defect reduction, and process capability enhancement initiatives. Support failure analysis activities and implement corrective and preventive actions. Collaborate with cross-functional teams to resolve technical challenges and support new product ramp. Apply digital and AI-assisted workflows to improve operational effectiveness and engineering productivity. Maintain process documentation and ensure compliance with manufacturing standards. Education Bachelor's or Master's degree in Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or related disciplines. Experience 0–2 years of experience for New College Graduates (NCG). Semiconductor manufacturing, packaging, or process engineering experience is a plus. Skills Strong analytical thinking and problem-solving capability. Ability to interpret and analyze large datasets to support engineering decisions. <
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for developing and optimizing wet chemical clean and etch processes in a high-volume semiconductor manufacturing environment. Lead efforts to improve product quality, reliability, and yield, while driving cost reduction and productivity improvements. Resolve manufacturing line issues, qualifying new processes and materials, and collaborate with suppliers and multi-functional teams to meet quality and risk management objectives. Apply structured problem-solving methodologies such as failure analysis, FMEA, 8D, and SPC to support continuous improvement and technology development. Develop and optimize wet chemical clean and etch processes to improve yield, quality, and cost. Identify and resolve process-related issues using structured problem-solving tools. Lead process, equipment, and material evaluations and implement changes at the process step. Support new process baseline qualifications and ensure alignment with sister fabs. Collaborate with suppliers to meet quality, cost, and risk management goals. Maintain detailed documentation of process findings, characterizations, and risk assessments. Participate in yield improvement and cost reduction initiatives. Work closely with manufacturing teams to resolve line issues and improve process control. Employer will accept a Master's degree in Manufacturing Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2 years of experience in the job offered or related occupation. Position requires: 1. Statistical data and
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1.HBM_TNR process yield maintain(machine alarm, SPACE alarm,product defect analysis) 2.Following PM spec to perform the machine PM 3. Perform the machine trouble shooting and draft the passdown 4. Maintain equipment area 6S 5. Submit the improvement ideas of equipment PM or troubleshooting 6. Reporting the abnormals or findings during daily work 7.Utilize AI-enabled tools to support troubleshooting, equipment maintenance, technical documentation, data review, and continuous improvement activities. Demonstrate the ability to effectively incorporate AI into daily work processes while ensuring accuracy, safety, and compliance. 8.Associate's or Bachelor's degree in Electronics, Electrical, Mechanical Engineering, or a related discipline. 9.New graduates and experienced candidates are encouraged to apply. Prior experience in the electronics or semiconductor industry is a plus. 10.Proficiency in basic English communication skills (listening, speaking, reading, and writing). About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memo
Work Flexibility: Onsite It's Time to Join Stryker! Stryker is seeking a Staff Systems Engineer, Robotics to lead systems engineering activities for critical electromechanical components within a complex robotic medical platform. In this role, you will serve as a systems engineering owner for robotic end effectors , including powered surgical tools and future attachments that interface directly with the robotic system. You will help translate user and clinical needs into system architecture and requirements, define interfaces across electrical, mechanical, and software disciplines, and guide the product from requirements development through integration and verification. This role requires a highly collaborative engineer who can bring together input from multiple technical disciplines and maintain a system-level view throughout development. What You Will Do Systems Engineering Own systems engineering activities for robotic end effectors and related electromechanical subsystems. Translate user, clinical, and product needs into clear, verifiable system requirements and design inputs. Develop and refine system architectures, interfaces, and functional requirements across electrical, mechanical, software, and controls disciplines. Allocate and decompose system requirements to appropriate subsystems and engineering disciplines. Lead technical trade studies, design assessments, performance analyses, and other systems engineering activities used to guide design decisions. Support concept development and architecture definition for new end effectors, features, and product capabilities. Requirements, Integration, and Verification Establish and maintain requirements traceability throughout the product development lifec
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Bachelor's degree or above in Engineering disciplines, such as Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, Industrial Engineering, Physics, or related fields. • Fresh graduates or candidates with less than one year of working experience are welcome to apply. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits • Work methods that include AI capabilities or are empowered by AI, Using Artificial Intelligence, Applying Artificial Intelligence and Leveraging Artificial Intelligence. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leader
About the Team The Consumer Products team at OpenAI builds the hardware that brings advanced AI technology directly into people’s hands. We design, engineer, and manufacture next-generation consumer devices that combine elegant design, robust engineering, and cutting-edge AI. Our team spans mechanical, electrical, and systems engineering — partnering closely with industrial design, operations, and software to create seamless, high-quality experiences that make AI more accessible and useful. About the Role As a Hardware Engineer on the Consumer Products team, you’ll contribute to the design, development, and integration of complex hardware systems for new AI-driven devices. You’ll work across disciplines to translate early product concepts into reliable, scalable, and beautifully crafted products ready for mass production. This role is based in Singapore. We follow a hybrid model (four days per week in the office) and offer relocation support for new employees. Occasional travel to manufacturing partners may be required. In this role, you will: Design, prototype, and validate mechanical and electrical subsystems from early development through mass production. Collaborate closely with design, operations, and manufacturing teams to ensure quality, reliability, and scalability. Drive DFM/DFA reviews, design iterations, and bring-up of prototype and pilot builds. Debug complex system-level issues and lead root-cause investigations and resolutions. Partner with global suppliers and cross-functional teams to ensure flawless execution from concept to launch. You might thrive in this role if you: Have 6+ years of experience in consumer hardware, consumer electronics, or advanced product development. Bring deep technical fluency in mechanical, electrical, or systems engineering (cross-disciplinary experience a plus). Have taken at least one consumer product from concept to mass production. Are energized by hands-on problem solving, iteration, and building in fast-paced enviro
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