Module Planning Manager Jobs

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

Job Details: Job Description: The Role and Impact Join Intel as a Module Engineer, where you will play a pivotal role in enhancing the production of advanced integrated circuits. In this position, you will own and optimize high-volume manufacturing equipment and processes, ensuring precision and minimizing defects. Your contributions will directly impact manufacturing efficiency, quality, and scalability, enabling Intel to maintain its leadership in semiconductor innovation. Business Group The role is part of Intel's Assembly Test Manufacturing (ATM) division, which serves as the backbone of Intel's back-end manufacturing operations. ATM supports Intel's diverse portfolio of products across key business segments, including client, server, automotive, and connectivity. The group focuses on advanced packaging and manufacturing technologies to deliver competitive solutions, aligning with Intel's IDM 2.0 strategy to drive innovation and global leadership. Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost goals. Conduct tests and measurements to control critical dimensions and minimize defectivity in production lines. Recommend and implement modifications to improve operational efficiencies, manufacturing techniques, and output performance. Expand high-volume manufacturing capacity to demonstrate technology capabilities and ensure seamless transfer to global manufacturing sites. Execute equipment maintenance, repair activities, and continuous improvement initiatives aligned with safety, quality, productivity, and yield metrics. Develop systems for excursion prevention and identify discrepant material or activities within equipment and processes. Manage equipm

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

The NetSuite Developer – FSM is responsible for the configuration, development, and support of NetSuite solutions with a strong focus on the Field Service Management module. The ideal candidate will build, test, and maintain FSM workflows and integrations while partnering with functional consultants and clients to translate business requirements into technical solutions. Responsibilities Design, develop, and implement customized NetSuite solutions including scripts, workflows, and FSM configurations Configure and optimize FSM functionality — dispatch, scheduling, work orders, resource management Create custom scripts using SuiteScript 2.0/2.1 Communicate efficiently with functional consultants, project managers, and end-users Develop integrations with 3rd party systems via their APIs Troubleshoot and resolve issues within existing NetSuite/FSM implementations Perform release preview testing to ensure compatibility ahead of NetSuite upgrades Basic Qualifications Previous experience working with NetSuite ERP is mandatory 3+ years of experience creating custom scripts with SuiteScript 1.0/2.0/2.1 Direct hands-on experience with Field Service Management (FSM) required Experience using a GIT repository NetSuite SuiteCloud Developer Certification is a plus Desired Qualifications Hands-on cloud integration experience with NetSuite Integration Platform (NSIP), Celigo, or Boomi Experience in HTML, CSS3, JavaScript, jQuery Data management experience (SQL, XML, JSON) Web services experience (REST, SOAP) Active familiarity with utilizing AI tools (e.g., Claude Code, Codex) on a day-to-day basis to enhance development workflows College or University degree in Computer Science How You’ll Embody Our Core Values At Plative, our core values shape how we work, collaborate, and grow. As part of the team, you will: Put People First: Build trusted relationships with clients and mentor teammates. Grow Together, Win Together: Share knowledge, celebrate wins, and elevate others. Bring Your

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Product Quality Engineer, you are responsible for ensuring the stability and reliability of semiconductor manufacturing processes. This role involves defining standard operating procedures, applying statistical tools, and supporting audits to maintain high product quality standards. Additionally, the Principal Product Quality Engineer is a strategic leader responsible for architecting and driving global quality frameworks across multiple manufacturing sites. This role uses advanced engineering expertise, data analytics, and multi-functional collaboration to ensure process stability, product reliability, and continuous improvement at scale. You will influence global strategy and drive innovation. Responsibilities: Lead multi-functional and cross-site teams to resolve complex quality issues, driving global alignment and continuous improvement. Develop and implement global quality management systems in partnership with other Micron manufacturing facilities. Support the NPI qualification, PG/PTS yield improvement, Burn and module dpm reduction, defense line 4 enhancement and shift-left improvement Cover critical SWRs and RAR risk assessment, Fab Excursion-affected materials and RMA management. Monitor and report on critical quality metrics, including DPM, yield variation, and reliability performance. Supervise Wafer Level Reliability (WLR) and Wafer Level Burn In (WLBI)

Job Details: Job Description: The Role and Impact As a Module Engineer, you will play a pivotal role in enabling Intel's cutting-edge manufacturing processes by ensuring the seamless operation and optimization of critical high-volume equipment. Your day-to-day responsibilities will focus on conducting tests, measurements, and maintenance activities to ensure the equipment meets stringent safety, quality, and efficiency standards. By driving process improvements and collaborating with global teams, you will contribute to the successful production of advanced integrated circuits and help shape technological innovation in the semiconductor industry. Business Group You will be part of Intel's Manufacturing and Operations organization, which is central to Intel's mission of creating world-changing technology. The group specializes in scaling advanced manufacturing techniques, ensuring high product quality, and delivering cost-effective solutions that support Intel's growth. Through its close collaboration with global teams, this organization fosters technological innovation and operational excellence across Intel's manufacturing sites worldwide. Key Responsibilities - Conduct equipment tests and measurements to ensure control over critical dimensions, registration and defectivity of the production line. - Recommend and implement modifications to improve production efficiency, manufacturing techniques, and output quality. - Own and execute maintenance and repair activities for manufacturing equipment, ensuring minimal downtime. - Lead continuous improvement initiatives for safety, quality, cost, productivity, defects, and yield metrics. - Collaborate with equipment suppliers to enhance manufacturing tools and processes. - Develop and optimize systems for preventing excursions and detecting process or equipment discrepancies. - Participate in technology transfers t

Gross salary will be 15932 k bonus on monthly basis Address: SURVEY NO 180/P & OTHERS VILLAGE TUNDA TALUKA MUNDRA KUTCH 370435 GUJARAT Facility: CELL & MODULE (MUNDRA SOLAR ENERGY) - FM Qualification: 8th Experience: 1 - 2 years Source: Sodexo India | Job Code: IJP564880

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Module Ownership: Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits. Specification Definition: Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and establish a continual improvement plan. Proactive Issue Resolution: Identify potential structure, electrical, and reliability issues early and address them with process control. Solve problems using a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control. Optimize manufacturability assessments. Material Innovation: Analyze materials physically and electrically. Collaborate with process groups to select new materials for development and transition them from research to production. Build Experiments: Build and complete device and process experiments. Extract, analyze, report, and draw conclusions on experiments and clarify the statistical significance of the data. Team Leadership: Assemble and coordinate a development team, including process engineers, to drive module development. Decision-Making & Goa

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Senior Manager, Assembly Operations is responsible for Core, Module, and Harness Assembly at the Cedar Park, Texas facility as KARNO production moves from development builds to repeatable production. Hyliion designs and builds the KARNO Power Module, a fuel-agnostic linear generator for data center, commercial and industrial, and defense applications, combining additive manufacturing with precision electromechanical assembly. The position runs the shop floor through Safety, Quality, Delivery, Cost, and People (SQDCP) performance, builds the standard work and discipline that make production predictable, and develops supervisors into front-line leaders. Designs are maturing, work instructions are evolving, and some assemblies are still being productionized, so the position brings structure to that environment without slowing the build. Continuous improvement is part of the daily work of the role. Leadership is exercised on the production floor by listening to the people doing the work and solving problems alongside them, with high standards and accountability delivered with respect. AI at Hyliion At Hyliion, AI is core to how we work. We equip every team member with leading AI tools and count on you to use them — to move faster, solve harder problems, and help us realize the full potential of KARNO technology for the world. Duties and Responsibilities Own Safety, Quality, Delivery, Cost, and People (SQDCP) performance across Core, Module, and Harness Assembly, with defined metrics, visual management, and daily tiered accountability. Build a safety-first culture in an environment that includes high-voltage systems, pressuri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Analyze inline/param/probe/DOE data to identify yield detractors and drive continuous improvement. Apply semiconductor device physics, process knowledge, and statistical tools to troubleshoot yield issues. Collaborate with module engineering teams to diagnose process/tool‑related yield variation and ensure timely resolution. Lead or participate in cross‑functional task forces to solve complex yield, defect, or process integration challenges. Perform root‑cause analysis using FMEA, 8D, SPC, and other structured methodologies. Publish clear Pareto analyses and maintain dashboards for assigned product lines. Support new technology transfer, process baseline setup, and qualification activities. Partner with equipment engineering, shift engineering, and quality teams to address long‑term defect or excursion issues. Conduct material, process, and equipment evaluations and recommend optimization strategies with AI assisted tool. Ensure product performance meets design and reliability requirements and propose corrective actions when gaps exist. Required Qualifications Minimum 2 years of experience in semiconductor manufacturing, yield engineering, process engineering, or related electronics industries. Bachelor’s or Master’s degree in Physics, Optoelectronics, Electrical Engineeri

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Main Responsibilities Strategy, Roadmap & Technical Direction Define and implement technical strategy for cell film process development aligned to business and technology objectives. Identify emerging trends/risks/opportunities and recommend future investments/initiatives. End-to-End Module Development & Scaling Lead multi-functional development, integration, and scaling of thin film processes tailored for advanced NAND devices; ensure manufacturability/scalability/readiness for integration. Drive technology transfer and ramp-up activities to ensure seamless transition from R&D to high-volume manufacturing. Complex Problem Solving & Business Outcomes Resolve complex technical challenges (including RCA/mitigation of process/device failures). Lead cost reduction, yield improvement, and reliability enhancement programs via innovative process/material utilization. Leadership & External Representation Mentor senior engineers and influence technical direction across the organization; represent the function in technical forums and strategic collaborations (consortia, conferences, joint dev

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Your responsibilities will include, but are not limited to, the following: Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility Assist in the transfer of new technology from R&D to manufacturing Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Yield Analysis Module Lead, you will leverage advanced data analytics and deep process knowledge to identify, characterize, and quantify key yield limiters within assigned fab modules. You will lead rigorous investigative efforts to determine root causes of yield excursions, develop and publish actionable yield paretos, and translate complex data into clear technical direction for improvement. Working closely with the YA PTO team, Process Integration, and Process Engineering, you will provide accurate, data-driven guidance to the fab, influence corrective action strategies, and drive sustainable yield improvements. This role offers direct ownership of yield performance and a critical opportunity to impact continuous improvement across the manufacturing line. Lead and maintain an effective training and development program, providing coaching and mentorship to elevate team proficiency and support growth of direct reports. Proficient in Module based Data Analysis, Part Type Ownership Analysis and new part setup activities Track probe yield performance and trends to identify, characterize, and explain gaps between target and actual yields. Perform advanced data analysis to quantify yield issues and generate accurate yield paretos that guide fab priorities and improvement efforts. Apply statistical and data‑mining techniques to identify root causes and uncover opportunities for sustainable yield improvement. Collaborate closely with PI, Probe, PE, EFA, and PFA tea