Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer
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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions Key Responsibilities Package Health Metrics & Monitoring Define quantitative package health metrics Develop detection mechanisms and monitoring dashboards for continuous health assessment. Perform electrical and mechanical characterization of packages. Inline Defect Characterization Implement real-time defect detection and classification (critical vs. non-critical). Conduct next-level characterization for critical defects and integrate findings into predictive models. Advanced Analytics & Knowledge Base Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes. End-to-End Traceability </
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary The Material Engineer is responsible for driving packaging material qualification, material improvements, and supplier quality management to support manufacturing cost, quality, delivery, and risk objectives. This role collaborates closely with Key Material Group (KMG) teams, manufacturing sites, quality, suppliers, and partner organizations to execute material qualification, manage material changes, and ensure laboratory, equipment, and compliance readiness. Key Responsibilities Responsibilities include, but are not limited to: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Collaborate with KMG teams and site stakeholders to develop and implement material improvements that reduce cost and improve quality and delivery performance. Execute packaging material qualification for trays, carrier tapes, formed end caps, moisture barrier bags (MBB), desiccants, and humidity indicator cards. <li
Job Details: Job Description: About the Group Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Intel Foundry will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IP's. Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. Come join us and do something wonderful. The Aerospace, Defense, Government (ADG) - The Senior DFT Logic Design Engineer provides technical support to Intel Foundry Services customers on our PDKs, DFT/DFM insertion, ATPG validation methodology and flows. The successful candidate will: Collaborate with internal teams across Intel and external stakeholders such as foundry customers' design teams, IP providers, and EDA vendors on issue resolution. Create content, application notes and deliver technical training/presentations. Drive quality of ASIC DFT/DFM and ATPG validation methodology, capability/flow and documentation for block level and SOC level. Support and provide Tool/Flow/Methodology on customer issues and challenges for successful c
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. P
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global Defense Line (DL) matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment for DL signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. <
About Atomic Industries Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, most physical goods begin life in a mold or are shaped by a manufacturing tool. Producing these tools has always been slow, manual, and dependent on scarce expertise, taking weeks or months. We’re changing that. At our Detroit headquarters, we combine the industrial DNA of America’s manufacturing heartland with the speed, intelligence, and precision of Silicon Valley. Our AI-driven platform tackles the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days and soon, minutes. We don’t just build software; we run a fully operational factory where our technology produces production-grade tooling every week, enabling tight feedback loops and rapid iteration. Backed by top-tier investors, we’re restoring speed, flexibility, and capability to the American industrial base. Our mission is to make manufacturing as agile and scalable as the digital world, and in doing so, rebuild the infrastructure of the physical economy. Position Overview We are seeking a dependable and motivated Entry-Level Injection Molding Machine Operator to join our new injection molding facility in Shelby Township, Michigan. This role is ideal for candidates with at least one year of experience in a manufacturing or production environment who are eager to grow their skills in injection molding operations. The operator will perform visual inspections of molded parts, light assembly, packaging, housekeeping duties, and support safe and efficient production processes. Key Responsibilities Machine Operation & Production - Operate injection molding machines under supervision following established procedures. - Monitor production to ensure consistent production output. - Notify supervisors of machine issues, quality concerns, or material shortages. Quality Control - Perform visual
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience or know-how in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modellin
About the Role Rubrik is seeking an innovative and strategic Services Engineering Leader to lead the lifecycle development of new Professional Services offerings. In this key leadership role, you will be responsible for creating, packaging, and launching high-value services that accelerate our customers' time-to-value for the entire Rubrik product portfolio. As a core member of the Global Professional Services Leadership Team , you will bridge the gap between product strategy and field execution. You will work extensively across Product Management, Product Engineering, Global Practice Leaders, Consulting Leadership, and PS Delivery teams to ensure our services offerings evolve in lockstep with our technology roadmap. Reports To: Vice President, Global Professional Services Key Responsibilities 1. Service Productization & Portfolio Strategy Design & Launch Offerings: Lead the end-to-end development of standardized, scalable Professional Services offerings, playbooks, and delivery methodologies that drive rapid customer adoption and time-to-value. Product & Engineering Alignment: Partner closely with Product Management and Product Engineering teams during early-stage product releases to build corresponding service packages, deployment frameworks, and best practices. Service Lifecycle Management: Continuously evaluate, refresh, and optimize the existing PS portfolio based on field feedback, customer outcomes, utilization data, and emerging market trends. 2. Strategic Leadership & Cross-Functional Collaboration PS Leadership Contribution: Serve as an active member of the Global PS Leadership Team, contributing to overall services strategy, operational strategy, and long-term business growth. Practice & Delivery Enablement: Collaborate with Global Practice Leaders and Field Delivery teams to ensure new services are operationally viable, efficiently packaged, and backed by robust delivery artifacts. Go-To-Market (GTM) Integration: Work alongside
As a Product Marketing Manager for NVIDIA NIM, you will play a pivotal role in helping enterprises deploy AI. NVIDIA NIM is revolutionizing AI from experimentation to production, packaging optimized, production-ready models for rapid deployment. Our product marketing team operates at the intersection of developer tooling and enterprise go-to-market, ensuring that our narrative resonates with ML engineers and CTOs alike. If you relish diving into technical depth and translating it into compelling stories, this is the perfect opportunity! What you will be doing: Launching products: You'll build and manage launch plans for high-visibility NIM releases, coordinating assets, timelines, keynote slides, demos, and press materials while driving cross-functional execution with product management, engineering, technical marketing, and PR or equivalent experience. You'll align the team on messaging and positioning for NIM across developer and enterprise audiences. You will develop messaging docs, sales enablement materials, customer presentations, solution overviews, and web content. Driving awareness: You'll identify target audiences and content gaps, then build the assets that fill them — blogs, webinars, demos, solution briefs, and more. Crafting the ecosystem story: You'll drive co-marketing engagements with NVIDIA's model providers, cloud partners, and ISV ecosystem to showcase the full range of possibilities with NIM. Collaborating with PR: You'll work with PR on press launches to ensure the NIM story is accurate, compelling, and consistent across every channel. What we need to see: Excellent written and verbal communication skills, with a proven track record of articulating technical value to both developer and executive audiences. College degree or equivalent experience. More t
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Job Summary The Package Health Test Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on en
TaylorMade Golf is seeking a highly creative Graphic Designer to visualize original graphic design work across golf accessories, packaging, and soft and hard goods products, then execute the technical files needed for vendor development. This role demands a high level of detail and technical precision, delivered in a fast-paced environment. Essential Functions and Key Responsibilities: Visualize and design original graphic concepts for golf accessories, packaging, and soft and hard goods products. Design and develop original logos, brand marks, and identity guidelines. Concept and create graphic designs for golf ball packaging. Execute detailed, production-ready technical files and tech packs for vendor development. Partner with hard goods, soft goods, and accessories teams to ensure design intent translates accurately to manufacturing. Research and ideate creative concepts for Ecommerce and accessories projects. Performs other related duties and assignments as required. Knowledge and Skills Requirements: Advanced skills in Adobe Illustrator, Photoshop, InDesign, and Acrobat, with the ability to learn new industry-standard software. Strong illustrative ability with a keen sense of color, visual layout, and typography. Ability to translate creative concepts into precise, production-ready technical files and tech packs. Understanding of materials, fabrics, and textures as they apply to soft goods execution. Clear communicator who collaborates effectively with peers and cross-functional teams, and is receptive to constructive feedback. Highly organized with strong attention to detail and a consistent ability to meet deadlines. Comfortable managing multiple projects at once in a fast-paced, global environment. Passion for and knowledge of golf pr
Location: Remote - SF / Boston / Austin Employment: Full-time Level: — Design our custom lasers and their integration with the wafer-scale interposer. You will contribute to our first- and second-generation custom laser designs, and to their integration with the wafer-scale interposer. Responsibilities Owning aspects of qualification and ramp up of VCSEL array product line from design and epitaxy through fabrication, testing and packaging at contract manufacturers. Working with epitaxial wafer vendors and contract manufacturers to ensure epitaxy and mask/fabrication designs can be successfully implemented and repeatably produced. Working with the electronics, packaging and wafer-scale interposer teams to improve the VCSEL design for the integrated interposer product, balancing density, yield and manufacturability tradeoffs in a novel architecture. Working with laser team to set technical direction/road map based on integrated interposer needs. Driving design reviews of VCSEL with other teams Requirements Deep understanding of VCSEL epitaxy design, fabrication design and process, validation, and qualification Experience taping out VCSEL epitaxy and mask/fabrication processes Hands-on experience contributing to an industry-first laser design Ability to work independently as well as in cross-functional teams including electronics, packaging Nice to have Experience using outsourced contract manufacturers for large volume production of VCSELs Experience with high-density VCSEL arrays and VCSEL polarization stabilization High speed direct modulation laser diode design/test experience Understanding of sources of process variation and statistical process control for yield improvement Laser packaging and/or reliability experience
About Atomic Industries Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, nearly every physical good begins life in a mold or is shaped by a manufacturing tool. Building those tools has always been slow, manual, and dependent on a shrinking pool of master craftsmen, taking weeks or months per part. We are changing that. From our Detroit headquarters, we pair the industrial DNA of America’s manufacturing heartland with the speed and precision of frontier AI. Our platform attacks the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days, and soon to minutes. We don’t just write software: we run a real, fully operational factory that ships production-grade tooling every week, giving us tight feedback loops most companies only dream about. Backed by top-tier investors, we are here to restore speed, flexibility, and capability to the American industrial base and to make manufacturing as agile and scalable as the digital world. Reindustrialization is the mission. The talent we hire is how we win. The Role This is our first dedicated recruiting hire, and it is one of the most important bets we will make this year. You will own how Atomic finds, courts, and closes exceptional people, and you will build the talent function from the ground up: the pipelines, the playbooks, the tooling, and eventually the team around you. We are looking for a tech-enabled, terminally online operator. You live where great talent actually spends its time—on X, in Discords and group chats, in niche Slacks and subreddits, at demo days and hackathons—and you know how to turn a cold DM into a signed offer. You treat sourcing like an engineering problem: instrumented, automated, and relentlessly optimized. You have extremely high agency and need almost no direction to go from “we need to hire this” to “they start Monday.” If you want to be one recruiter of
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