Packaging Artwork Design Assistant Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department MSB Process Integration Engineering Project Title Semiconductor Manufacturing Reject Reduction Through Process Variability Analytics Project Description The intern will participate in a structured project focused on improving semiconductor manufacturing reject rates through process variability reduction. The project will provide practical exposure to semiconductor packaging, Assembly and Test processes, and manufacturing data analytics. Under appropriate guidance, the intern will analyze inline signals, process parameters, and test results to identify patterns and potential contributors to process variability and yield loss. The intern will also explore the responsible application of Artificial Intelligence and AI-Enabled analytical tools to improve the efficiency, quality, and effectiveness of project analysis. Objective of the Project The project aims to: Identify potential sources of process variability and yield loss. Improve the analysis of inline signals, process data, and test results. Determine relationships between process conditions and manufacturing rejects. Develop data-driven re

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping, micro‑cracks, subsurface damage,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build the Future of Memory and AI from India At Micron India , we are helping shape the next generation of memory and storage solutions that power Artificial Intelligence, cloud computing, mobile devices, automotive systems, and data centers worldwide. Join a team of innovators, engineers, and technology leaders working at the forefront of semiconductor design, verification, product development, advanced packaging, data analytics, and manufacturing technology. From pioneering High Bandwidth Memory (HBM) solutions for AI to developing next-generation DRAM and NAND technologies, Micron India plays a critical role in delivering innovations that enable the world's most demanding computing applications. As one of Micron's fastest-growing innovation hubs, our teams collaborate globally to solve complex engineering challenges, accelerate technology development, and transform breakthrough ideas into products used by billions of people around the world. Opportunities Across Micron India Engineering Teams DTPG (Design Technology & Product Group) Design and develop next-generation DRAM, NAND, and emerging memory technologies powering AI, high-performance computing, mobile, and cloud applications. Work across memory architecture, circuit design, layout, verification, characterization, and product engineering to bring cutting-edge semiconductor innovations to market. TD (Technology Development) Drive the future of memory technology

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Responsibilities Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools. Perform sample preparation, cross-sectioning, decapsulation, polishing, microscopy inspection, and other laboratory techniques as required for failure analysis investigations. Operate and maintain analytical equipment such as Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM, and other failure analysis tools. Write and document failure analysis findings, and FA reports in a timely manner. Ensure compliance with laboratory safety requirements, equipment operating procedures, quality management systems, and 6S housekeeping rules. Participate in continuous improvement initiatives to enhance laboratory efficiency, analytical capability, and turnaround time. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhanc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Engineering Operations Support Create, release, and track engineering lots within manufacturing systems. Monitor hold lots and support timely issue resolution. Execute authorized MES transactions, including lot creation, issue lot, undo process, and lot recovery activities. Support CQ lot start requests and engineering build execution. Support engineering and manufacturing operational meetings and follow-up actions. Material & Logistics Management Receive FOUPs from warehouse and verify material readiness. Perform FOUP/FOSB transfers to support engineering and qualification activities. Execute FOSB packaging and shipment preparation. Prepare shipment documentation and logistics records. Coordinate wafer and sample delivery for laboratory analysis activities. Support kit and re-kit activities for engineering lots. Inspection & Process Support Configure inspection-related recipes and operational setup activities. Modify and maintain Atlas maps to support engineering execution. Support transaction recovery activities, including system troubleshooting and data verification. Perform routine operational checks to ensure lot readiness and processing continuity. Troubleshooting & Continuous Improvement Investigate hold lot issues and support recovery actions. Escalate manufacturing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern for Assembly and Test (AT) Materials Category Supplier Management, you will support Micron’s Assembly and Test materials category team in managing critical semiconductor material suppliers, strengthening supply assurance, improving cost competitiveness, and enabling resilient global sourcing strategies. You will learn how category managers analyze market dynamics, supplier performance, cost drivers, risk exposure, and stakeholder requirements across key AT materials categories such as packaging substrates, molding compound, gold wire, die-attached film, solder-balls and other materials used in Assembly packaging. This internship offers hands-on exposure to strategic sourcing, supplier engagement, data analytics, benchmarking, and cross-functional business partnering in a fast-paced global semiconductor supply chain environment. Intern will take opportunity to use and apply AI tools including use of Agents, Agentic AI and Agentic solutions. Key Responsibilities AT Materials Cost, Market & Supplier Analysis Assist in developing cost, market, and supplier analysis for assigned AT materials categories, including price trend tracking, supply-demand outlook, cost drivers, and industry benchmarking. Support collection and synthesis of supplier intelligence, including capacity updates, technology roadmaps, commercial position, risk indicators, and regional supply considerations. Help maintain category dashboards, supplier scorecard

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality. This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations. Responsibilities Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards. Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, tim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Platform Architecture team defines the electrical, thermal, and power-delivery architectures that enable Micron's next-generation High Bandwidth Memory (HBM) solutions. Working closely with architecture, design, packaging, and technology teams, the organization drives innovation in signaling, power integrity, thermal management, and system optimization to support AI, high-performance computing, and data center applications. As an HBM Platform Architecture Intern, you will contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures for advanced memory systems. You will work alongside experienced architects to analyze design trade-offs, develop modeling tools, and investigate solutions that improve performance, power efficiency, reliability, and scalability for next-generation memory products. Responsibilities Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies. Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems. Analyze power delivery networks (PDNs), including IR-drop, electromigration (EM), power integrity, and power grid optimization for advanced HBM architectures. Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities. Collaborate with architecture, design, packaging, and technology teams to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an

About the Team The Pricing & Monetization team is responsible for how our products create and capture value. We partner closely with Product, GTM, Finance, and Systems teams to design pricing models, packaging, and commercial strategies that support adoption, growth, and long-term scaling of the business. To thrive in this team, you need to be a proactive problem-solver who excels at bringing structure to ambiguous challenges. Our work demands strategic thinking, cross-functional collaboration, and precision in execution. Team members succeed when they are analytical, detail-oriented, skilled at balancing multiple priorities, and passionate about driving high-stakes projects forward to deliver meaningful results. About the Role We are looking for a Pricing Operations Lead to help translate pricing and packaging decisions into clear, scalable execution. You will work closely with pricing leaders and cross-functional partners across Product, Engineering, Billing, Finance, and GTM to ensure pricing changes are implemented accurately, system requirements are well managed, and launch decisions move from strategy to reality with discipline. You should be comfortable operating at the intersection of business judgment, systems thinking, and program management. This role will help shape the operating backbone for pricing implementation, support teams developing billing and related monetization systems, and ensure the pricing team's needs are represented clearly in cross-functional planning and execution. In this role, you will: Lead the operational execution of pricing and packaging decisions from approval through implementation and launch Translate pricing strategy, policies, and launch decisions into clear business requirements for billing, quoting, revenue, and related systems teams Partner with Product, Engineering, Billing, Finance, and GTM teams to manage dependencies, scope tradeoffs, testing needs, and launch readiness Own pricing-related requirement intake and p

Creative Cloud is Adobe’s suite of creative tools including Photoshop, Illustrator, and Premiere Pro, which are used by millions of creatives worldwide. AI is transforming how people create. There’s an opportunity to simplify our plans and packaging so customers can easily find and understand the plan that’s right for them. We are seeking a strategic Group Product Marketing Manager to own how Creative Cloud is packaged, new AI products get monetized, and AI features launch across Creative Cloud products. You will lead a team responsible for this work and set the direction for how it comes together. This is a horizontal role: you’ll work across Product , Finance, and Marketing teams to give Creative Cloud a single point of view on packaging, monetization, and launches. The right candidate will be comfortable with ambiguity , energized by big cross-functional problems , and confident enough to build and defend a point of view . What You’ll Do Develop the Creative Cloud offering strategy: Use customer and market insights to define how plans are structured and priced across the portfolio, balancing customer value with business goals . Define and oversee a testing roadmap: Build

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Advanced Package/Product Integration Drive package product integration for next-generation advanced packaging technologies. Identify integration risks and implement corrective actions during development. Support design rule development and package architecture optimization. Hiring Need: Current workload exceeds available engineering bandwidth, increasing program delay and technical risk exposure. 2. Cross-Functional Technical Leadership Act as primary interface among product engineering, process engineering, manufacturing, suppliers, and customers. Drive alignment on technical decisions and risk mitigation plans. Lead failure analysis and corrective action activities. Hiring Need: Growing project complexity requires additional senior technical leadership to avoid bottlenecks and improve execution efficiency. 3. Customer Support and Technical Engagement Support customer technical reviews and package feasibility assessments. Provide technical recommendations for package implementation and risk reduction. Address customer escalations related to package performance and reliability. Hiring Need: Increased customer interaction volume requires dedicated engineering support to maintain responsiveness and customer satisfaction. 4. Reliability Improvement Drive root-cause investigations for package failures. Improve package yield, reliability, and manufacturing robustness. Develop long-term corrective and preventive actions. Hiring Nee

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Technology Development Manufacturing Development Engineering (MDE) Senior Manager , you will lead the MDE organization supporting DLT, MRDA, and WLT process development execution within APTD. The APTD MDE organization serves as the execution engine of technology development by enabling rapid learning cycles, maximizing development velocity, and providing scalable 24/7 execution support across advanced packaging technology development programs. In this role, you will provide organizational leadership, strategic direction, operational governance, and technical oversight to accelerate technology learning and ensure safe, predictable, and efficient development execution. You will establish and continuously improve the MDE operating model, workforce strategy, organizational capability, and execution systems required to support future technology roadmaps. In support of Micron's AI transformation strategy, this role is expected to champion AI-enabled ways of working, promote responsible adoption of AI and automation technologies, and build organizational capability in leveraging AI, data analytics, and digital solutions to improve decision quality, operational effectiveness, workforce productivity, and technology development execution. You will work closely with Technology Development, Manufacturing, Product Engineering, Equipment Development, Quality, and other cross-functional organizations to accelerate technology readiness and achieve business objectives.

Location: Hybrid - SF Employment: Full-time Develop and qualify Volantis’s testing procedures for custom lasers and scale for mass production. You will own development and implementation of testing and reliability procedures for our first- and second-generation custom laser designs, and their integration with the wafer-scale interposer. Responsibilities Partnering with the laser design team to define test plans, specifications and pass/fail criteria for new individually addressable VCSEL array designs. Characterizing prototype devices (LIV, spectral, far-field/beam profile, polarization, thermal and high-speed modulation) and delivering timely analysis that feeds back into design iterations. Managing test data, including databases, wafer maps, yield analysis and SPC, to track device performance and process variation in conjunction with the designers. Designing, building and maintaining wafer- and die-level prober systems, test fixtures and automated test software. Owning qualification and ramp-up of VCSEL array product testing systems, scaling from R&D characterization to high-volume production test. Working with the laser design, packaging and wafer-scale interposer teams to prove out reliability of the VCSEL itself and the overall system. Requirements Deep hands-on experience with semiconductor laser (preferably VCSEL) testing, characterization, validation, reliability and qualification. Experience designing prober systems, test fixtures and related software automation Proficiency with optical and electrical test equipment such as SMUs, optical spectrum analyzers, power meters, VNAs, and beam profilers Ability to work independently as well as in cross-functional teams including quality and packaging Nice to have Experience qualifying and using contract manufacturers for large volume production test of VCSELs Experience testing high-density VCSEL arrays, both top and bottom side emitting. High speed direct modulation laser diode test experience Understanding of