Packaging Artwork Design Assistant Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Quality Metro Real-time Defect Analysis (RDA) Engineer, you will be responsible for enabling robust quality monitoring, early detection, and rapid containment of quality risks across advanced packaging and NPI manufacturing environments. You will focus on leveraging RDA platforms, Statistical Process Control/ Fault Detection & Classification (SPC)/ (FDC) systems, automation, and data analytics to prevent escapes, accelerate learning, and improve product and process robustness, particularly during N ew Product Introduction (NPI) , pilot, and early ramp phases. This role acts as a critical bridge between Quality, RDA, Process, Equipment, and NPI teams, ensuring quality requirements are embedded into monitoring strategies and operational execution. You will work closely with Site and Global Quality, Process Integration, Equipment Engineering, and Automation teams to drive quality-focused diagnostics, excursion management, and continuous improvement in a high-change, high-learning environment. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational stan

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Metro Real-time Defect Analysis (RDA) Process & Equipment Engineer, you will be responsible for developing, deploying, and sustaining RDA capabilities that enable robust process control and equipment performance across advanced packaging and New Product Introduction (NPI) manufacturing environments. You will focus on integrating process knowledge, equipment behavior, and automation intelligence to improve tool stability, detect early signals of risk, and accelerate learning during NPI, pilot, and ramp phases. This role serves as a critical link between Process Engineering, Equipment Engineering, NPI teams, and RDA, ensuring monitoring strategies are technically sound, actionable, and scalable to high-volume manufacturing (HVM). You will work closely with Site and Global RDA, Process, Equipment, Automation, and IT teams to drive continuous improvement in equipment capability, process robustness, and manufacturing readiness. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As Product Development Engineering Key Equipment Group (PDE KEG) engineer, you will be primarily responsible for identifying, selecting, and evaluating new equipment (highly automated and computerized) / new technology to support current and future requirement for advantage packaging technology. You will also be responsible for installation and qualification of new equipment platform and handover to production group (Equipment Maturity Index, EMI). In addition, tasks include maintaining a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platforms, collaborating with production groups on upgrades of existing production equipment through continuous improvement projects Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work." Support the evaluation and qualification of new equipment plaforms Define, development and establish new equipment design/ capability requirements aligned to Process a

Content Platform is responsible for ingesting, processing, storing, and delivering every piece of content on Spotify — from music and podcasts to audiobooks. Within Content Platform, the Media domain owns the end-to-end media pipeline, from the moment content arrives through to seamless playback for listeners around the world. We're looking for a Staff Engineer to provide architectural leadership across this media platform. You’ll help shape and drive the technical direction from ingestion through transcoding, packaging, storage, delivery, and playback. This is a role for someone who thinks in systems, understands the trade-offs between codec choices and infrastructure costs, and can drive technical strategy across multiple teams at scale. What You'll Do Define and drive the long-term architectural direction for Spotify's media pipeline across Content Platform. Lead large-scale technical initiatives that span multiple squads and organizations, including projects such as media delivery, codec rollouts, and future playback capabilities. Partner closely with engineering managers, product managers, and senior engineers to align technical strategy with product priorities, reliability goals, and cost efficiency, acting as a key technical counterpart for media architecture. Guide architectural decisions across media ingestion, transcoding, packaging, storage, content delivery, and playback. Author and review RFCs, architecture decision records, and technical design documents that guide engineering teams and leadership. Mentor senior engineers across the organization, helping raise technical quality, architectural thinking, and engineering excellence. Bring a cost-aware engineering mindset by understanding how media architecture decisions impact compute, storage, CDN utilization, and long-term platform sustainability. Who You Are You have deep expertise building large-scale media plat

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in s

Reolink , a leader in intelligent visual technology for homes and businesses, was founded in 2009 by a group of engineers with a strong commitment to and passion for smarter security solutions. Our products are now trusted by millions of users across more than 110 countries and regions worldwide. Building on this trust, we continue expanding our presence and bringing our innovations to more markets around the globe. Reolink remains committed to delivering advanced, reliable, and user‑centric solutions that empower people to protect what matters most. Position Title: Graphic Designer Location: Los Angeles, CA Job type: Full-time Report to: Head of Marketing Company: Reolink, an innovative leader in intelligent visual technology, is committed to transforming home security through advanced, reliable, and user-centric solutions. Visit reolink.com to learn more. Job Summary: We're looking for a talented Graphic Designer to help bring Reolink's security cameras and smart home solutions to life through striking visual design. This role will focus on producing polished graphics across digital and print channels that highlight product features like 4K clarity, color night vision, AI-powered detection, solar power, and weatherproof durability while building trust, reassurance, and aspiration around home and business protection. You'll work hand-in-hand with the Content Production Manager, Head of Marketing, Copywriter, marketing team, and HQ to create bold, brand-forward visuals for digital campaigns, social media, website assets, product launches, retail displays, email marketing, and packaging. The ideal candidate combines strong design craft and typographic sensibility with a sharp storytelling instinct, able to make security tech feel approachable, modern, and empowering for everyday homeowners and small business owners. Key Responsibilities: ● Design on-brand graphics for social media, digital ads, website hero content, email marketing, and product launches. ● Create sta

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify , diagnose, and propose y

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Interconnect Modeling — Generating an

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is building high-performance AI systems and the supply chain required to deliver them at scale. We are looking for a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment. This role is hybrid based out of Taiwan, with regular travel. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor’s degree in Supply Chain, Engineering, or a related discipline. Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners. Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues. Are a clear, direct, and trusted communicator who can work effectively across global teams, suppliers, and North American and Asia-Pacific time zones; Mandarin fluency is a plus. Are a structured, data-driven operator with experience using ERP sys

Why Sony Interactive Entertainment? Sony Interactive Entertainment isn’t just the Best Place to Play — it’s also the Best Place to Work. Sony Interactive Entertainment (SIE) is the company behind the PlayStation brand. As a subsidiary of Sony Group Corporation, we’re part of a proud legacy of innovation and excellence. SIE is a dynamic technology company, delivering cutting-edge hardware and network services to more than 100 million people and an entertainment leader, home to some of the most beloved and recognizable intellectual properties (IP) in the world. Our role at SIE is to create and nurture the experiences under the PlayStation brand, a name synonymous with entertainment excellence and creativity. Why PlayStation? Why San Diego Studio? We are the team behind MLB The Show, a critically acclaimed AAA sports franchise developed for PlayStation, Xbox, and Nintendo platforms. Our focus is on delivering innovative, high-quality gaming experiences – and we’re looking for a Sr Programmer to help build, package, and ship the game on every platform we support. The ideal candidate possesses strong problem-solving abilities, sharp attention to detail, and thrives both independently and in collaborative, cross-functional teams. They are a versatile generalist who is as comfortable owning a build and data-packaging pipeline as they are bringing the engine up on new hardware or diving into low-level systems to track down a crash or reclaim memory. They enjoy the planning side of the work: scoping infrastructure changes, sequencing a platform or SDK migration so the team is never blocked, and modernizing tools and systems that have grown over many years. Not only does this person have a strong understanding of how large codebases are built, shipped, and maintained, they are also comfortable with the system-level aspects of the target hardware they’re working on when transitioning to new platforms. Key Responsibilities: • Develop, optimize, and maintain the cr

The Laboratory Waste Technician is an entry-level position within the Environmental Health and Safety (EHS) department, responsible for the safe collection, handling, and management of laboratory waste streams in compliance with all applicable federal, state, and local regulations. This role supports day-to-day waste management operations across laboratory and research spaces, ensuring proper accumulation, labeling, packaging, and disposition of chemical, biological, and mixed waste. Reporting directly to the EHS Supervisor, you will work collaboratively with laboratory staff to maintain compliant and organized waste accumulation areas. You will own hazardous waste operations on the floor, gaining immediate, hands-on experience driving compliance with RCRA and DOT regulations in a fast-paced lab environment. Core Responsibilities Collect, segregate, label, and transport chemical, biological, and mixed waste from laboratory accumulation areas in accordance with RCRA satellite and central accumulation area requirements. Monitor waste accumulation start dates, container integrity, and labeling compliance throughout laboratory and research spaces to ensure regulatory deadlines are met. Move and manage biohazardous waste, including regulated medical waste and sharps, in compliance with applicable biosafety and institutional guidelines. Support hazardous waste shipment preparation in accordance with DOT regulations, including proper packaging, labeling, and marking of waste containers prior to off-site pickup. Keep lab operations moving quickly and without disruption by anticipating supply needs and executing waste pickups flawlessly. Partner with the EHS Supervisor to drive regulatory compliance, taking active ownership of recordkeeping, waste manifests, and lab inspections. Step in to resolve operational bottlenecks as they arise. Qualifications High school diploma or GED required; Associate’s degree or coursework in Environmental Science, Biology, Chemistry, or

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead/contribute new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. Having understanding of Frontend Process is a plus, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, Si characterization, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Qualify new process/technology/equipment/materials Technical capability Identify path finding opportunities for Micron's technology leadership with BIC t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further! This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end to end memory system architectures, to guide long term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron. Responsibilities: Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance. Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach Drive long‑term memory technology packaging strategy and influence industry standards Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an SoC Physical Design Senior Manager, HBM in the Heterogeneous Integration Group (HIG), you will lead a team of physical design and physical verification engineers responsible for implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tapeout. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Recruit, develop, and mentor a team of physical design engineers delivering HBM base die products. Plan project resourcing requirements and timelines. Prioritize resources across projects and individual assignments to meet aggressive product delivery schedules. Drive physical implementation for SoC blocks and/or top-level including floorplanning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Collaborate with design and integration teams to ensure clean implementation of clocking/reset strategy, power architecture, and SoC integration requirements. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust