Packaging Engineer Flip Chip Jobs

MTS Design Engineer, Bonding and Packaging — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of ground breaking memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. Position Overview: We are seeking an experienced Process Engineer with expertise in depositing thin films who will thrive in a fast paced and results oriented environment! Our goal is to employ robust solutions to thin film challenges that meet the detailed physical and electrical requirements for Micron’s industry-leading memory products. In this role, you will develop and optimize novel solutions to film deposition challenges for the next generations of Micron’s memory systems. You will to take ideas from conception through development and implementation in manufacturing. Best-qualified candidates will have deep subject matter expertise in Thin Films in semiconductor Advanced Packaging R&D roles. We offer a highly collaborative and innovative atmosphere, allowing you to interact with various groups including process integration, electrical failure analysis, yield enhancement, manufacturing, and various semiconductor equipment manufacturers. You will have the opportunity to drive and define Micron’s thin film technology roadmaps, generating intellectual property which will have a direct influence on our global industry leadership. Job Responsibilities: <ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and AI-enabled technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is molding the future of technology! Position Overview: As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing.</

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. By collaborating closely with our global R&D teams, materials suppliers, and manufacturing teams, we ensure the efficient development, transfer, and implementation of new technology nodes to maintain Micron's leadership in the industry. As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management. You will also be required to resolve assembly process-related problems by applying failure analysis, FMEA, 8D, or SPC/FDC methodology. Additional responsibilities include leading and participating in yield improvement and cost reduction activities and handling new process baseline qualifications. You may conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes. We are seeking experienced engineers for Principal and MTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications. Role Responsibilities: Identify, diagnose, and resolve assembly p

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal Wet Process Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department overview The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting‑edge memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Job summary As a Principal Engineer within APTD, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased revenue, long‑term strategic success, and the development of leading‑edge packaging technologies. Responsibilities Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure seamless technology integ

Role Overview We are seeking a Senior Micro-Optics/Microlens Array Engineer to design, model, and validate microlens-array and wafer-level micro-optical components for high-density photonic packages. You will translate system-level optical requirements into manufacturable designs, build tolerance budgets, work with fabrication and packaging partners, and close the loop with measured data. Candidate note: We do not expect one person to match every item below. Strong candidates from micro-optics, optical packaging, semiconductor photonics, lithography/process integration, precision optics, or FDTD-Zemax co-design backgrounds are encouraged. What You Will Do Own micro-optical design: design microlens arrays and compact micro-optical components, including lens pitch, aperture, focal length, numerical aperture, sag, surface form, fill factor, array uniformity, substrate, material, and coating choices. Build connected optical models: use tools such as Zemax OpticStudio, Code V, FRED, LightTools, VirtualLab, Ansys/Lumerical, COMSOL, or equivalent; combine ray, physical-optics, diffraction, and statistical methods where appropriate. Bridge EM-scale and package-scale design: where useful, connect FDTD, FEM, EME, RCWA, or similar electromagnetic simulations to Zemax/Code V/physical-optics models so local optical-interface behavior is represented in system-level trade studies. Drive tolerancing and yield: develop sensitivity studies and tolerance budgets across fabrication, placement, package stack-up, adhesive, thermal, refractive-index, coating, and surface-form variation; use Monte Carlo and DOE methods to connect design choices to expected yield. Bring semiconductor process awareness: partner with process and supplier teams across lithography, grayscale/direct-write patterning, imprint, etch transfer, deposition, thin-film coatings, wafer-level metrology, design rules, and process-window trade-offs. Translate design intent: create vendor-ready specifications, optica

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure. Drive yield breakthroughs by understanding the end‑to‑end test flow , product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements. Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs . Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification . Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner. Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency. Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams . Communicate project status, risks, an

About Atomic Industries Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, most physical goods begin life in a mold or are shaped by a manufacturing tool. Producing these tools has always been slow, manual, and dependent on scarce expertise, taking weeks or months. We’re changing that. At our Detroit headquarters, we combine the industrial DNA of America’s manufacturing heartland with the speed, intelligence, and precision of Silicon Valley. Our AI-driven platform tackles the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days and soon, minutes. We don’t just build software; we run a fully operational factory where our technology produces production-grade tooling every week, enabling tight feedback loops and rapid iteration. Backed by top-tier investors, we’re restoring speed, flexibility, and capability to the American industrial base. Our mission is to make manufacturing as agile and scalable as the digital world, and in doing so, rebuild the infrastructure of the physical economy. About the Role As an Automation Engineer at Atomic, you’ll build the systems that connect our physical factory to our software platform. You’ll work across sensors, electronics, industrial controls, robotics, machine interfaces, data infrastructure, and simulation to make our equipment observable, programmable, and increasingly autonomous. This is not a traditional plant controls role focused on maintaining an installed base of PLCs. You’ll help define the architecture, standards, and tools through which Atomic’s machines, molds, robots, and production workflows operate as one integrated system. This role is ideal for a software-capable automation generalist who enjoys building real hardware, commissioning it on the factory floor, and owning systems from first prototype through reliable production use. What You’ll Do Design, build, and commission a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. P

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global Defense Line (DL) matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment for DL signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit