Packaging Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Summary As an APTD MTS (Member of Technical Staff) based in Taiwan, you will lead and develop the IoT engineering team delivering Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will set technical direction and priorities, drive execution from proof-of-concept through deployment, and build scalable, secure solutions that improve quality, productivity, and early risk detection. You will partner cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while building a culture of safety, accountability, and continuous learning. Key Responsibilities Lead, coach, and develop the IoT engineering team; set clear expectations, provide regular feedback, and build growth plans aligned to APTD needs. Own team execution: define goals/KPIs, prioritize the IoT roadmap, assign ownership, and ensure high-quality, on-time delivery from concept to factory deployment. Drive end-to-end IIoT solution development: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Drive machine vision solutions: guide hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm approach, performance validation, and deployment readiness. Partner with process, equipment, automation, quality, and IT/data platform stakeholders to tra

The Monetization Strategy team drives Asana’s pricing/packaging strategy and execution, helping our customers get more value out of our offerings and capturing a fair share of that value. We work cross functionally to deliver impactful offerings for team productivity and collaboration. We’re helping to define the Work Management category and inventing new ways for teams to work more efficiently together and see the larger purpose behind their work. Our team works directly with Product/Engineering, Sales/Support, Customer Research, Marketing, Data Science, Finance and Operations to deliver valuable offerings to our customers. You’ll take part in every type of product work here – from strategy to product to process improvements – conceptualizing, launching, and iterating on Asana itself for millions of teams around the world. As Senior Pricing Strategy & Operations Manager, you will serve as a leader shaping Asana's product monetization strategy across the organization. This is an individual contributor-style role with no direct reports, reporting to the Head of Pricing & Packaging. You will partner closely with executive stakeholders across Product, Sales/GTM, Marketing, Finance, and Operations to define, launch, and optimize our end-to-end monetization strategy—driving sustainable revenue growth, unlocking new business opportunities, and delivering an exceptional customer experience at scale. This role is based in our San Francisco office with an office-centric hybrid schedule. The standard in-office days are Monday, Tuesday, and Thursday. Most Asanas have the option to work from home on Wednesdays. Working from home on Fridays depends on the type of work you do and the teams with which you partner. If you're interviewing for this role, your recruiter will share more about the in-office requirements. What you’ll achieve Own and drive the monetization strategy, including packaging, pricing models, price levels, and discount strategy. E

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities Build and develop critical analog, mixed-signal, custom digital blocks, and provide full chip level integration support. Build and tapeout PWF Reticles. Collaborate with the Scribe Build team to implement and review Advanced Packaging requirements. Engage in TSV build with HIG-HBM DTPCO teams, ensuring flawless electrical, thermal, and mechanical performance. Exhibit a highly motivated, diligent, meticulous, and methodical approach in IC layout development. Perform layout verification like LVS/DRC/Antenna checks, quality control, and documentation. Ensure timely delivery of block-level layouts with outstanding qual

The Monetization Strategy team drives Asana’s pricing/packaging strategy and execution, helping our customers get more value out of our offerings and capturing a fair share of that value. We work cross functionally to deliver impactful offerings for team productivity and collaboration. We’re helping to define the Work Management category and inventing new ways for teams to work more efficiently together and see the larger purpose behind their work. Our team works directly with Product/Engineering, Sales/Support, Customer Research, Marketing, Data Science, Finance and Operations to deliver valuable offerings to our customers. You’ll take part in every type of product work here – from strategy to product to process improvements – conceptualizing, launching, and iterating on Asana itself for millions of teams around the world. As Senior Pricing Strategy & Operations Manager, you will serve as a leader shaping Asana's product monetization strategy across the organization. This is an individual contributor-style role with no direct reports, reporting to the Head of Pricing & Packaging. You will partner closely with executive stakeholders across Product, Sales/GTM, Marketing, Finance, and Operations to define, launch, and optimize our end-to-end monetization strategy—driving sustainable revenue growth, unlocking new business opportunities, and delivering an exceptional customer experience at scale. This role is based in our Vancouver office with an office-centric hybrid schedule. The standard in-office days are Monday, Tuesday, and Thursday. Most Asanas have the option to work from home on Wednesdays. Working from home on Fridays depends on the type of work you do and the teams with which you partner. If you're interviewing for this role, your recruiter will share more about the in-office requirements. What you’ll achieve Own and drive the monetization strategy, including packaging, pricing models, price levels, and discount strategy. Ensur

NVIDIA’s Executive Briefing Center (EBC) Solutions Architect (SA) team is looking for a highly hands-on Solutions Architect with exemplary communication skills. The role involves developing, demonstrating (in the NVIDIA EBC), and packaging agentic AI systems. Partnering with account SAs you will co-develop proof of concepts (POC) and "uplift" their presentation quality to match the NVIDIA branding and messaging used with Executive meetings. This is a builder’s and presenter's role! You will spend time architecting and writing code. You will develop multi-agent systems, retrieval pipelines, and optimized inference stacks on NVIDIA’s full-stack accelerated computing platform. We want a creative, diligent, and curious engineer energized by agentic AI and ready to make significant change. If that’s you, join us! What you’ll be doing: Architect, build, and ship end-to-end Agentic AI applications for a variety of use cases—spanning multi-agent coordination, long-horizon reasoning, planning, and tool use. Act as Technical Advisor alongside fellow Subject Matter Experts (SME) in Executive Briefings. Creating and presenting demos that are used at Trade Shows or Customer Meetings. Partner with NVIDIA engineering, product, and sales teams to secure build wins, translate customer feedback into actionable product and roadmap insights, and scale global expertise through technical collateral, workshops, and developer communities. What we need to see: BS/MS/PhD in Computer Science, Electrical/Computer Engineering, Physics, Mathematics, AI/ML, or a related field (or equivalent experience) 2+ years as an ML/Software Engineer or Solutions Architect writing production-level code in Python and/or C/C++ in Linux environments. Validated experience building sophisticated agentic and multi-agent AI sy

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We're advancing some of the most important technologies in modern computing. Our memory solutions power AI, cloud, enterprise, mobile, and high-performance computing platforms around the world. The Memory Systems Architecture team explores complex technical challenges across the memory stack and turns them into practical product innovations, helping shape the future of memory technologies and industry standards. As a Technical Staff Member, you will provide systems-level architecture leadership for next-generation memory solutions. This role combines analytical modeling, architecture development, reliability strategy, and cross-functional influence to help define future products. You will work across engineering disciplines to evaluate tradeoffs, guide technical decisions, and develop differentiated solutions that deliver value to customers and platforms. Responsibilities: Define architectures for DDR, LPDDR, HBM, CXL-attached memory, and emerging memory technologies. Develop analytical and simulation-based models to evaluate performance, reliability, power, thermal, and cost tradeoffs. Drive architecture requirements across DRAM, packaging, modules, controllers, platforms, and system software. Lead technical studies, roadmap development, and architecture recommendations supported by quantitative analysis. Influence cross-functional teams, mentor engineers, and contribute to patents, publications, and standards activities. Mi

Silicon Product Integration Description - Role Overview We are seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs. The role serves as the technical bridge between HP, foundry partners, design teams, manufacturing organizations, and worldwide program teams to ensure successful technology development, qualification, and high-volume manufacturing readiness. The successful candidate will combine deep semiconductor foundry experience with strong program leadership skills to drive product execution from technology development through qualification and production launch. Key Responsibilities Product Engineering Leadership Own silicon product engineering activities across development, qualification, ramp, and sustaining phases. Drive structural cost saving initiative in wafer Foundry and advanced packaging factories. Lead NPI silicon builds and ensure timely execution of wafer, and advanced packaging factories deliverables. Partner with design, architecture, reliability, systems, and manufacturing teams to close technical issues. Drive issue resolution and technical solution for the process marginality and escalation. Foundry and Technology Development Serve as the primary technical interface with internal/external foundries and technology partners. Drive technical reviews, process optimization, design enablement, and qualification activities. Lead root-cause investigations and corrective actions related to yield, reliability, and manufacturability. Assess technology options and recommend development strategies for future products. Program and NPI Leadership Program Management Leadership cross-functional execution for strateg

Job Details: Job Description: The Role and Impact We are seeking a dynamic individual to lead global supply chain engineering and commercial teams in optimizing supply chain performance and fostering supplier relationships in support of Advanced Packaging Technology and Manufacturing (APTM) operations. In this role, you will drive operational excellence by integrating supplier strategies with Intel's manufacturing capabilities, collaborating closely with cross-functional teams to develop and implement strategies across global manufacturing sites. Business group Strategic Parts and Service Supply Chain (SPSC) is part of the Foundry Construction and Sourcing (FCS) team in Intel Foundry. We play a pivotal role in developing and managing supply chain solutions supporting Intel Foundry's wafer/packaging development and manufacturing operations. Key Responsibilities - Lead global supply chain teams to optimize supplier performance and operational efficiency through clear metrics, market intelligence, and continuous improvement. - Build strategic supplier partnerships to drive long-term engineering and supply chain roadmaps aligned with future technological needs. - Lead benchmarking and industry intelligence to drive supplier and technology improvements in factory equipment spares and service products. - Provide leadership through goal setting, facilitating team execution, maintaining accountability, and driving performance management practices. - Inspire and develop teams to achieve results while role modeling Intel values and creating a productive work environment. Qualifications: Minimum Qualifications - Bachelor's degree in a relevant field. - 12+ years of progressive experience with a Bachelor's degree, 10+ years of experience with an advanced degree in supply chain, engineering

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the Customer Engineering Technical Leadership (CETL) function within HIG PSE, the Technical Leader will serve as a key technical interface between external customers and internal engineering teams. In conjunction with CIL (Customer Integration Lead), this role requires deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes (Front-End and Back-End). The position emphasizes technical problem-solving, multi-functional teamwork, and driving integration success for advanced HBM products. Develops and deploys AI systems that help automate processes and tackle technical challenges. Responsibilities: Develop a strong understanding of customer system architecture, application requirements, and integration challenges. Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams. Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies. Develops and deploys AI (artificial intelligence) systems that help automate processes and tackle technical challenges Work closely with internal teams across front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration. Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements. </ul

SINGAPORE REQUIRED COMPANY SPONSERED VISA DEPERNDS ON CANDIDATES SKILLS WORK PERMIT, S- PASS OR E PERMIT LOW COST VISA CANDIDATES SHOULD PAY ONLY 27000 RS BALANCE IS DEDUCTION YOUR SALARY. ELECTRICAL ENGINEER 1 TO 2 YEARS EXPERIENCE REQUIRED PACKAGING SUPERVISOR 0 TO 1 YEARS EXPERIENCE REQUIRED HELPER HARD WORKING REQUIRED CANDIDATE HR MANAGER 2 TO 4 YEARS EXPERIENCE REQUIRED ADMIN ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED ACCOUNTANT 1 TO 2 YEARS EXPERIENCE REQUIRED COMPUTER OPERATOR 1 TO 2 YEARS EXPERIENCE REQUIRED BILLING ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED BUSINESS DEVELOPMENT MANAGER 1 TO 2 YEARS EXPERIENCE REQUIRED ALL PROCESS DONE IN 45 DAYS

About the Role As Head of First Party Chip Finance, you will be the finance leader for OpenAI’s custom silicon efforts. You will partner with teams across chip design, engineering, infrastructure, supply chain, and finance to turn technical roadmaps into sound investment decisions and financially disciplined execution. This role spans the full chip development lifecycle: evaluating design and roadmap choices, building investment cases, forecasting development and production costs, and supporting manufacturing and deployment at scale. You will give leadership a clear view of program economics, funding requirements, and risks as we build first-party compute capabilities. In this role, you will: Lead financial evaluation of custom silicon programs, including development investment, production economics, deployment assumptions, and expected returns. Assess first-party chips against alternative compute options. Build and own program-level models and multiyear forecasts that connect engineering milestones, development spending, manufacturing volumes, supplier commitments, and cash requirements. Partner closely with chip-design and engineering leaders on technical decisions that affect performance, power consumption, cost, and time to deployment. Translate complex design tradeoffs into clear financial recommendations. Develop a detailed view of chip and system costs, including wafers, manufacturing yields, packaging, memory, testing, and integration. Identify opportunities to improve economics as programs move from development into production. Partner with Supply Chain and Procurement on supplier strategy and commercial negotiations, including capacity reservations, volume commitments, prepayments, and contractual risk. Work with Treasury, Corporate Finance, Accounting, Tax, and Legal to evaluate financing and payment structures, manage financial exposure, and support program execution. Support commercial deployment and pricing decisions through analysis of unit economics,

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Reolink , a leader in intelligent visual technology for homes and businesses, was founded in 2009 by a group of engineers with a strong commitment to and passion for smarter security solutions. Our products are now trusted by millions of users across more than 110 countries and regions worldwide. Building on this trust, we continue expanding our presence and bringing our innovations to more markets around the globe. Reolink remains committed to delivering advanced, reliable, and user‑centric solutions that empower people to protect what matters most. Position Title: Graphic Designer Location: Los Angeles, CA Job type: Full-time Report to: Head of Marketing Company: Reolink, an innovative leader in intelligent visual technology, is committed to transforming home security through advanced, reliable, and user-centric solutions. Visit reolink.com to learn more. Job Summary: We're looking for a talented Graphic Designer to help bring Reolink's security cameras and smart home solutions to life through striking visual design. This role will focus on producing polished graphics across digital and print channels that highlight product features like 4K clarity, color night vision, AI-powered detection, solar power, and weatherproof durability while building trust, reassurance, and aspiration around home and business protection. You'll work hand-in-hand with the Content Production Manager, Head of Marketing, Copywriter, marketing team, and HQ to create bold, brand-forward visuals for digital campaigns, social media, website assets, product launches, retail displays, email marketing, and packaging. The ideal candidate combines strong design craft and typographic sensibility with a sharp storytelling instinct, able to make security tech feel approachable, modern, and empowering for everyday homeowners and small business owners. Key Responsibilities: ● Design on-brand graphics for social media, digital ads, website hero content, email marketing, and product launches. ● Create sta