Packaging Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions Key Responsibilities Package Health Metrics & Monitoring Define quantitative package health metrics Develop detection mechanisms and monitoring dashboards for continuous health assessment. Perform electrical and mechanical characterization of packages. Inline Defect Characterization Implement real-time defect detection and classification (critical vs. non-critical). Conduct next-level characterization for critical defects and integrate findings into predictive models. Advanced Analytics & Knowledge Base Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes. End-to-End Traceability </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary The Material Engineer is responsible for driving packaging material qualification, material improvements, and supplier quality management to support manufacturing cost, quality, delivery, and risk objectives. This role collaborates closely with Key Material Group (KMG) teams, manufacturing sites, quality, suppliers, and partner organizations to execute material qualification, manage material changes, and ensure laboratory, equipment, and compliance readiness. Key Responsibilities Responsibilities include, but are not limited to: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Collaborate with KMG teams and site stakeholders to develop and implement material improvements that reduce cost and improve quality and delivery performance. Execute packaging material qualification for trays, carrier tapes, formed end caps, moisture barrier bags (MBB), desiccants, and humidity indicator cards. <li

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Metro Real-time Defect Analysis (RDA) Shift Engineer, you will be responsible for ensuring stable, continuous, and safe operation of advanced packaging equipment platforms, with a strong focus on New Product Introduction (NPI) and early-life production phases. You will serve as the first-line technical responder for equipment alarms, system issues, and process deviations across advanced packaging lines (e.g., wafer-level packaging, assembly, test, and backend processes). You will leverage RDA tools, automation systems, and cross-functional collaboration to minimize downtime, accelerate learning cycles, and ensure smooth transition from New Product Introduction (NPI) to high-volume manufacturing (HVM). You will work closely with Process, Equipment, NPI, Automation, IT, and Global RDA teams to support 24x7 operations, drive rapid issue resolution, and ensure adherence to standard operating procedures during high-change, high-learning environments typical of NPI ramps. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

Content Platform is responsible for ingesting, processing, storing, and delivering every piece of content on Spotify — from music and podcasts to audiobooks. Within Content Platform, the Media domain owns the end-to-end media pipeline, from the moment content arrives through to seamless playback for listeners around the world. We're looking for a Staff Engineer to provide architectural leadership across this media platform. You’ll help shape and drive the technical direction from ingestion through transcoding, packaging, storage, delivery, and playback. This is a role for someone who thinks in systems, understands the trade-offs between codec choices and infrastructure costs, and can drive technical strategy across multiple teams at scale. What You'll Do Define and drive the long-term architectural direction for Spotify's media pipeline across Content Platform. Lead large-scale technical initiatives that span multiple squads and organizations, including projects such as media delivery, codec rollouts, and future playback capabilities. Partner closely with engineering managers, product managers, and senior engineers to align technical strategy with product priorities, reliability goals, and cost efficiency, acting as a key technical counterpart for media architecture. Guide architectural decisions across media ingestion, transcoding, packaging, storage, content delivery, and playback. Author and review RFCs, architecture decision records, and technical design documents that guide engineering teams and leadership. Mentor senior engineers across the organization, helping raise technical quality, architectural thinking, and engineering excellence. Bring a cost-aware engineering mindset by understanding how media architecture decisions impact compute, storage, CDN utilization, and long-term platform sustainability. Who You Are You have deep expertise building large-scale media plat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits Requirement: 1 years of experience in semiconductor manufacturing, packaging, or assembly processes. Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses infor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

About the team OpenAI’s Applied AI organization turns our latest model capabilities into products used by hundreds of millions of consumers, developers, and organizations worldwide. Our teams build the product experiences and platform foundations behind ChatGPT, Codex, our API platform, and offerings for businesses, enterprises, educational institutions, and other customers. Financial Engineering powers how customers purchase, access, and pay for these products. We build the systems behind pricing and packaging, checkout, payments, subscriptions, usage-based billing, credits, entitlements, invoicing, and the broader order-to-cash lifecycle. Our work spans consumer subscriptions, self-serve businesses, sophisticated enterprise agreements, developer usage, and emerging monetization models. These systems sit at the intersection of product experience and financial infrastructure. They must make it easy for customers to adopt OpenAI products while maintaining strong guarantees around correctness, reliability, security, reconciliation, and auditability. We partner closely with Product, Data Science, Finance, Accounting, Risk, Operations, and Go-to-Market teams to launch new offerings and build a financial platform that can evolve with OpenAI’s rapidly growing product portfolio. We are looking for an experienced engineer to help architect and build the next generation of these systems. In this role, you will: Have 5+ years of professional software engineering experience building and operating production backend, platform, or distributed systems. Have strong fundamentals in API design, data modeling, storage systems, transactional workflows, and event-driven architecture. Have experience building systems where correctness, reliability, observability, security, or data integrity are especially important. Are comfortable owning ambiguous, business-critical problems from initial definition through launch and long-term operation. Bring a product-oriented mindset and care about

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience or know-how in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modellin

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As FE CPIE CPI PI Senior Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution. In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. In addition, you will leverage AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate problem solving, improve productivity, enhance decision quality, and drive continuous innovation across product yield, quality, and business processes. Responsibilities and Tasks Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualific

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab-technology co-optimization , and advance Micron's leadership in data-driven semiconductor memory innovation. Qualifications: Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Solid experience with Plasma, FPM, HAR etching, and MC modeling Experience with Wet Pr

Location: Remote - SF / Boston / Austin Employment: Full-time Level: — Design our custom lasers and their integration with the wafer-scale interposer. You will contribute to our first- and second-generation custom laser designs, and to their integration with the wafer-scale interposer. Responsibilities Owning aspects of qualification and ramp up of VCSEL array product line from design and epitaxy through fabrication, testing and packaging at contract manufacturers. Working with epitaxial wafer vendors and contract manufacturers to ensure epitaxy and mask/fabrication designs can be successfully implemented and repeatably produced. Working with the electronics, packaging and wafer-scale interposer teams to improve the VCSEL design for the integrated interposer product, balancing density, yield and manufacturability tradeoffs in a novel architecture. Working with laser team to set technical direction/road map based on integrated interposer needs. Driving design reviews of VCSEL with other teams Requirements Deep understanding of VCSEL epitaxy design, fabrication design and process, validation, and qualification Experience taping out VCSEL epitaxy and mask/fabrication processes Hands-on experience contributing to an industry-first laser design Ability to work independently as well as in cross-functional teams including electronics, packaging Nice to have Experience using outsourced contract manufacturers for large volume production of VCSELs Experience with high-density VCSEL arrays and VCSEL polarization stabilization High speed direct modulation laser diode design/test experience Understanding of sources of process variation and statistical process control for yield improvement Laser packaging and/or reliability experience

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding Perform root‑cause and failure‑mode analysis a

Spotify’s Subscriptions Mission focuses on converting listeners into lifelong subscribers by delivering seamless, valuable experiences across pricing, packaging, and customer journeys. We build the systems and tools that power acquisition, retention, and overall subscription growth at scale. The Messaging Platform powers Spotify’s communications to over a billion users — from push notifications to emails and in-app messages that connect listeners to the content they love. Within this space, the Paloma squad focuses on message optimization: deciding which message reaches which user, through which channel, and at what moment. We’re evolving how messaging works at Spotify — moving from short-term optimization toward systems that understand long-term user journeys. By combining reinforcement learning approaches with deeper domain signals, we’re expanding how machine learning shapes the entire messaging funnel. What You'll Do Design, build, and ship machine learning models that optimize messaging across push, email, and in-app channels Plan and run A/B experiments in a multi-objective environment, balancing conversion, engagement, retention, and reachability Contribute to reinforcement learning systems that optimize for long-term user outcomes rather than immediate interactions Partner with product managers, data scientists, and engineers to define what success looks like and how to measure it Own the full ML lifecycle, from data and modeling to deployment, monitoring, and iteration Integrate ML models with upstream systems, including domain value signals and oppor

Senior Software Engineer Department: Engineering About Atomic Industries Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, most physical goods begin life in a mold or are shaped by a manufacturing tool. Producing these tools has always been slow, manual, and dependent on scarce expertise, taking weeks or months. We’re changing that. At our Detroit headquarters, we combine the industrial DNA of America’s manufacturing heartland with the speed, intelligence, and precision of Silicon Valley. Our AI-driven platform tackles the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days and soon, minutes. We don’t just build software; we run a fully operational factory where our technology produces production-grade tooling every week, enabling tight feedback loops and rapid iteration. Backed by top-tier investors, we’re restoring speed, flexibility, and capability to the American industrial base. Our mission is to make manufacturing as agile and scalable as the digital world, and in doing so, rebuild the infrastructure of the physical economy. About the Role As a Senior Software Engineer on the Platform Engineering team, you'll help transform cutting-edge research into scalable, production-grade software used by engineers, machinists, and customers alike. You’ll work across services and systems — from CAD and mesh pipelines to simulation infrastructure and web APIs — to build the core backend and data services that power Atomic’s platform. This role is ideal for generalists who are excited to work across disciplines and take ownership of complex, high-impact systems. What You’ll Do Design and implement scalable backend systems and APIs in Python and other languages Build and maintain services for geometry processing, simulation orchestration, and real-time data handling Design schemas and pipelines for structured and unstructured dat