Packaging Engineer Jobs

About the Team DoorDash Labs is a team within DoorDash building autonomous delivery robots and other autonomy solutions from the ground up for DoorDash's core delivery platform. If you have a passion for applying autonomy and robotics in a service used by millions of people daily, then we want to talk to you! About the Role We are seeking a hands-on Electrical Engineer to review the design, drawings, and schematics of the electrical systems for our 4-wheeled autonomous delivery robot. This role is responsible for delivering robust, production-ready hardware across high-speed digital design, PCBAs, RF integration, harnessing, and board-level packaging. This is a deeply technical position for someone who can move seamlessly between system-level thinking and detailed circuit execution. You're excited about this opportunity because... Develop electrical systems for a complex mobile robotic platform from concept through production. Lead high-speed digital design efforts (PCIe, MIPI, Ethernet, DDR, multi-gigabit SERDES, etc.). Own PCBA development including schematic capture, stack-up definition, layout guidance, impedance control, and design-for-manufacture. Drive RF integration (Wi-Fi, LTE/5G, GNSS, Bluetooth, RADAR, and LiDAR), antenna placement, layout constraints, and signal integrity. Develop and review cable harness designs, connector selection, grounding strategy, and environmental robustness. Collaborate closely with mechanical engineering on board packaging, thermal management, vibration resistance, and environmental sealing. Define and implement power distribution architecture, battery interfaces, protection circuits, and system monitoring. Ensure compliance with EMI/EMC and regulatory requirements (FCC/CE) (CISPR-25 and FCC Part 15 Class A). Support prototype builds and bring-up, debug hardware/firmware interface issues, root-cause failures, and drive corrective actions quickly. Establish design standards and perform detailed design reviews across the EE team.

About the Company: Nivagen is a global company dedicated to enhancing lives by developing and providing cost-effective generic prescription drugs and over-the-counter products for the North American market. For over a decade, we've remained steadfast in our commitment to the core values of excellence, integrity, and respect for people. Our team of professionals collaborates tirelessly to pioneer advancements in manufacturing, distribution, and quality control, ensuring a holistic approach to healthcare. Through vertical integration of the pharmaceutical supply chain, cutting-edge technology, and unwavering dedication to excellence, we continually strive to redefine medication accessibility and affordability. We prioritize our employees' well-being by offering competitive pay, comprehensive benefits, and robust training and development opportunities. By investing in our workforce and fostering a culture of growth and support, we empower our team to drive innovation and make a positive impact in the healthcare industry. At Nivagen, our mission is clear: to make a meaningful difference in people's lives by delivering high-quality, affordable medications while upholding the highest standards of integrity and excellence. Job Location: Nivagen Pharmaceuticals 3900 Duckhorn Dr, Sacramento, CA 95834. About the Job: The Automation & Controls Engineer – Aseptic & Packaging Systems is responsible for supporting, maintaining, troubleshooting, and improving automation and control systems used in a cGMP pharmaceutical manufacturing environment. This role supports aseptic processing, sterile filling, inspection, packaging, utilities, and facility automation systems. The Automation & Controls Engineer provides technical ownership and support for systems such as PLCs, HMIs, SCADA, manufacturing equipment controls, vision systems, serialization systems, data historians, robotics, motion control, building automation interfaces, and equipment network infrastructure. This po

Job Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. What we do: Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy to exceed the aspirations of our global customers. We are seeking a visionary Principal Engineer to lead the charge in Intel's foundry revolution, serving as a strategic technical architect and executive partner in guiding our most critical customers through the entire product development lifecycle. In this leadership capacity, you will orchestrate multidisciplinary strategies spanning device engineering, product integration, and yield analysis to steer customers from critical design tape-out and pre-silicon evaluation through to NPI silicon qualification. Furthermore, you will define t

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Propulsion Systems & Mechanical Integration Engineer to own the mechanical integration of propulsion systems across our next-generation defense platforms. In this hands-on role, you will work at the intersection of propulsion, structures, fluids, thermal management, avionics, and vehicle systems to turn propulsion concepts into reliable, testable, manufacturable hardware. You will integrate next-generation engines, fuel systems, valves, pumps, tanks, actuators, thermal protection, and associated support hardware in tightly constrained aerospace vehicles. You will drive the mechanical architecture and interfaces required to accomodate propulsion systems while balancing performance, mass, packaging, manufacturability, reliability, and cost. At Mach Industries, we are redefining the future of defense through advanced, scalable platforms. As a Mechanical Engineer, you will play a key role in prototyping and refining mechanical systems, and optimizing designs for performance and scalability. Collaborating with a multidisciplinary team, you’ll help shape the next wave of defense technologies, from concept to deployment. Key Responsibilities Own mechanical integration of propulsion systems from early architecture and co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept throug

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Senior Mechanisms Engineer to design, analyze, prototype, and deliver mechanical mechanisms for next-generation aerospace and defense platforms. In this hands-on role, you will own mechanism development from initial concept and kinematic architecture through detailed design, prototyping, testing, and production release. You will develop moving assemblies that meet demanding requirements for performance, reliability, mass, packaging, and environmental survivability while optimizing for manufacturability, assembly, cost, and production scalability. You will work closely with mechanical, structures, avionics, controls, manufacturing, and test engineering teams to integrate mechanisms into larger vehicle systems. The ideal candidate combines strong mechanical fundamentals with practical experience designing, building, and troubleshooting complex moving hardware in a fast-paced development environment. Key Responsibilities Own the mechanical design and development of mechanisms, from early CAD concepts to functional prototypes, drawing releases including GD&T, and eventually mass production. Design and analyze linkages, pivots, joints, bearings, shafts, gears, cams, latches, hinges, deployable assemblies and other mec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Develop and optimize HBM assembly and packaging processes to achieve manufacturing targets. Analyze process data and identify improvement opportunities using statistical and data-driven methodologies. Utilize AI-enabled tools and advanced analytics to improve troubleshooting efficiency and accelerate root cause identification. Drive yield improvement, defect reduction, and process capability enhancement initiatives. Support failure analysis activities and implement corrective and preventive actions. Collaborate with cross-functional teams to resolve technical challenges and support new product ramp. Apply digital and AI-assisted workflows to improve operational effectiveness and engineering productivity. Maintain process documentation and ensure compliance with manufacturing standards. Education Bachelor's or Master's degree in Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or related disciplines. Experience 0–2 years of experience for New College Graduates (NCG). Semiconductor manufacturing, packaging, or process engineering experience is a plus. Skills Strong analytical thinking and problem-solving capability. Ability to interpret and analyze large datasets to support engineering decisions. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Own package architecture and execution from feasibility through tape-out, qualification, and production readiness, ensuring design intent is translated into manufacturable, reliable, and scalable solutions. Serve as the technical authority for complex package issues, leading cross-functional reviews, trade-off decisions, and risk closure across product, silicon, technology, assembly, quality, supplier, and OSAT teams. Balance performance, reliability, manufacturability, cost, quality, and schedule to deliver production-ready solutions while mentoring engineers through difficult technical decisions. Advance design rules, methodologies, automation workflows, and technology roadmaps for future products. Represent the packaging team in Silicon–package–board co-design by integrating floorplan, interface, interconnect, power, signal, thermal, and mechanical requirements, and resolve cost and manufacturing trade-offs to achieve a balanced package solution. Ability to apply baseline digital fluency and role-approp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Engineering Operations Support Create, release, and track engineering lots within manufacturing systems. Monitor hold lots and support timely issue resolution. Execute authorized MES transactions, including lot creation, issue lot, undo process, and lot recovery activities. Support CQ lot start requests and engineering build execution. Support engineering and manufacturing operational meetings and follow-up actions. Material & Logistics Management Receive FOUPs from warehouse and verify material readiness. Perform FOUP/FOSB transfers to support engineering and qualification activities. Execute FOSB packaging and shipment preparation. Prepare shipment documentation and logistics records. Coordinate wafer and sample delivery for laboratory analysis activities. Support kit and re-kit activities for engineering lots. Inspection & Process Support Configure inspection-related recipes and operational setup activities. Modify and maintain Atlas maps to support engineering execution. Support transaction recovery activities, including system troubleshooting and data verification. Perform routine operational checks to ensure lot readiness and processing continuity. Troubleshooting & Continuous Improvement Investigate hold lot issues and support recovery actions. Escalate manufacturing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Overview As a Staff/Senior Process Development Engineer within PDE-CEM, you will leverage advanced semiconductor process characterization, failure analysis, yield analytics, and process integration expertise to accelerate product and technology development. The role focuses on developing robust assembly processes, improving yield and reliability, supporting New Product Introduction (NPI), and utilizing data-driven methodologies to optimize manufacturing performance. The ideal candidate combines strong semiconductor physics knowledge, advanced characterization skills, yield improvement experience, and cross-functional leadership capability to drive continuous process innovation and manufacturing excellence. Key Responsibilities Process Development & Characterization Develop and optimize Process of Record (POR) for assembly and packaging technologies. Establish process windows, process capability targets, and characterization strategies. Apply statistical methodologies including DOE, SPC, JMP, and Six Sigma to characterize and optimize manufacturing processes. Drive early process learning through advanced characterization and failure analysis techniques. Yield Improvement & Problem Solving</

Location: Hybrid - SF Employment: Full-time Develop and qualify Volantis’s testing procedures for custom lasers and scale for mass production. You will own development and implementation of testing and reliability procedures for our first- and second-generation custom laser designs, and their integration with the wafer-scale interposer. Responsibilities Partnering with the laser design team to define test plans, specifications and pass/fail criteria for new individually addressable VCSEL array designs. Characterizing prototype devices (LIV, spectral, far-field/beam profile, polarization, thermal and high-speed modulation) and delivering timely analysis that feeds back into design iterations. Managing test data, including databases, wafer maps, yield analysis and SPC, to track device performance and process variation in conjunction with the designers. Designing, building and maintaining wafer- and die-level prober systems, test fixtures and automated test software. Owning qualification and ramp-up of VCSEL array product testing systems, scaling from R&D characterization to high-volume production test. Working with the laser design, packaging and wafer-scale interposer teams to prove out reliability of the VCSEL itself and the overall system. Requirements Deep hands-on experience with semiconductor laser (preferably VCSEL) testing, characterization, validation, reliability and qualification. Experience designing prober systems, test fixtures and related software automation Proficiency with optical and electrical test equipment such as SMUs, optical spectrum analyzers, power meters, VNAs, and beam profilers Ability to work independently as well as in cross-functional teams including quality and packaging Nice to have Experience qualifying and using contract manufacturers for large volume production test of VCSELs Experience testing high-density VCSEL arrays, both top and bottom side emitting. High speed direct modulation laser diode test experience Understanding of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bondin