As part of APTD Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead/contribute…
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Packaging Module Development Engineer Jobs
1,525 active opportunities · Updated for October 2026
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Explore current packaging module development engineer jobs. Use filters to narrow by work mode, employment type, experience and date posted.
We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next…
As an SoC Physical Design Senior Manager, HBM in the Heterogeneous Integration Group (HIG), you will lead a team of physical design and physical verification engineers responsible for implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work…
The PDE API Process Integration (PI) Engineer is responsible for driving process integration excellence for Advanced Packaging products, including High Bandwidth Memory (HBM) products across sites during New Product Introduction (NPI) . This role ensures robust process…
About OLIX AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has…
Summary The DRAM Packaging organization is responsible for developing and delivering advanced memory packaging solutions that enable Micron’s next generation products. The team partners across design, technology development, manufacturing, quality, supply chain, and external…
Equipment: Koenig and Bauer EVO HD 32-inch Central impression press. 8 colors Job Description Flexographic Press Operator We are seeking an experienced Flexographic Press Operator to join a growing manufacturing team in a high-speed paper cup and food packaging production…
We are opening a new AI Engineering Campus in Bengaluru which will play a central role in Graphcore's work building the future of AI comp
Staff Silicon Physical Design Engineer at Graphcore in Bengaluru, KA, India.
Join Hire Hangar and work with fast-growing global companies while building a long-term career. Job Title: E-commerce Product Manager Location: Remote Time Zone: US Time Zones (EST–PST) Key Responsibilities Lead product strategy: define category focus, product roadmap, and…
Equipment: -Komori Lithrone GL640 HUV 40” 6C with in-line aqueous and UV coating -Komori Lithrone LS640P HUV 40” 6C perfector (2/4) with in-line aqueous and UV Job Description SECOND PRESSMAN – KOMORI SHEETFED Pay: Competitive and based on experience POSITION OVERVIEW We are…
Position Summary As an APTD MTS (Member of Technical Staff) based in Taiwan, you will lead and develop the IoT engineering team delivering Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will set…
Director, Product Marketing at Diligent Corporation in New York, New York, United States. Full-time · On-site · $173K – $217K/yr.
Director, Product Marketing at Diligent Corporation in London, England, United Kingdom. Full-time · On-site.
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms,…
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