Packaging Research And Development Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. We are opening a new AI Engineering Campus in Bengaluru which will play a central role in Graphcore's work building the future of AI computing. The physical design team sits within the wider silicon design team which includes RTL, verification and DFT. Our work also involves strong links with architecture, packaging and product engineering. We are responsible for working with those teams to create high-quality RTL and building the final chip layout (e.g. GDSII) ensuring a signoff-quality design is delivered to the Foundry (e.g. TSMC). We are looking to hire high-quality silicon physical design engineers to join our team. The successful candidate will support the team with achieving our goals and creating the right engineering solutions. We are a collaborative team and good communication is essential, as is the ability to adapt and learn. For the successful candidate we offer an open, honest and collaborative environment working on leading-edge designs at the most advanced nodes. Our engineers are not siloed, and they are trusted and encouraged to ta ke ownership of their designs and problem solutions. You will be part of a team that looks for improvements to everything we do: our designs, our flows, our methodologies, our infrastructure. Responsibilities and Duties Applicants will be expected to contribute technically to the development of Graphcore's next generation of AI superchips, focusing on achieving robust, high-performance and power-efficient designs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Package Pathfinding Architect We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next‑generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further. This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end‑to‑end memory system architectures, to guide long‑term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron. Main Responsibilities: Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance. Lead cross‑stack co‑optimization across silicon, package, board, and system with package ce

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. An Operations Improvement Engineer is a key member of the Operations Improvement (OI) Team. This role is responsible for driving performance optimization across PWF, Assembly (HBM, advanced packaging) and T est Operations by identifying improvement opportunities in output, cycle time, cost, and efficiency. It involves applying industrial engineering principles to enhance core manufacturing functions such as line management, production planning, scheduling and dispatching. Additionally, the role supports factory automation initiatives by exploring and implementing innovative solutions that streamline processes and reduce variability. Key Responsibilities: Identify and analyze optimization opportunities within PWF, Assembly (HBM, advanced packaging) and Test

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Summary As an APTD MTS (Member of Technical Staff) based in Taiwan, you will lead and develop the IoT engineering team delivering Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will set technical direction and priorities, drive execution from proof-of-concept through deployment, and build scalable, secure solutions that improve quality, productivity, and early risk detection. You will partner cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while building a culture of safety, accountability, and continuous learning. Key Responsibilities Lead, coach, and develop the IoT engineering team; set clear expectations, provide regular feedback, and build growth plans aligned to APTD needs. Own team execution: define goals/KPIs, prioritize the IoT roadmap, assign ownership, and ensure high-quality, on-time delivery from concept to factory deployment. Drive end-to-end IIoT solution development: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Drive machine vision solutions: guide hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm approach, performance validation, and deployment readiness. Partner with process, equipment, automation, quality, and IT/data platform stakeholders to tra

Position Overview: The Director, Product Marketing will own the end-to-end go-to-market strategy for Diligent Boards , driving positioning, messaging, product launches, market intelligence, sales enablement, pricing and packaging, and customer adoption across key segments and regions. We are looking for a strategic B2B SaaS product marketer with strong technical aptitude who can translate complex technology into compelling customer value. The ideal candidate has experience in a SAAS technology company. Exposure to product-led growth (PLG) is highly valuable. You will partner closely with Product, Engineering, AI/Data, Sales, Marketing, Customer Success, Enablement, Finance, and senior leadership to identify market opportunities, influence product strategy, and bring differentiated technology solutions to market. This is a high-impact role requiring someone who can move seamlessly between technical product detail, customer insights, commercial strategy, and compelling storytelling . Key Responsibilities: Go-to-Market & Product Strategy Own end-to-end GTM strategies for Diligent Boards across key customer segments and regions. Develop differentiated positioning, messaging, value propositions, and launch strategies based on customer, market, and competitive insights. Partner with Product and Engineering to understand product roadmaps, technical capabilities, integrations, data, AI functionality, and translate these into compelling customer benefits. Identify opportunities to improve product-market fit, adoption, expansion, and revenue growth. AI & Technical Product Marketing Develop GTM strategies for AI-powered products and capabilities , translating AI/GenAI functionality into clear business value and differentiated market positioning. Build sufficient technical depth to

Position Overview: The Director, Product Marketing will own the end-to-end go-to-market strategy for Diligent Boards , driving positioning, messaging, product launches, market intelligence, sales enablement, pricing and packaging, and customer adoption across key segments and regions. We are looking for a strategic B2B SaaS product marketer with strong technical aptitude who can translate complex technology into compelling customer value. The ideal candidate has experience in a SAAS technology company. Exposure to product-led growth (PLG) is highly valuable. You will partner closely with Product, Engineering, AI/Data, Sales, Marketing, Customer Success, Enablement, Finance, and senior leadership to identify market opportunities, influence product strategy, and bring differentiated technology solutions to market. This is a high-impact role requiring someone who can move seamlessly between technical product detail, customer insights, commercial strategy, and compelling storytelling . Key Responsibilities: Go-to-Market & Product Strategy Own end-to-end GTM strategies for Diligent Boards across key customer segments and regions. Develop differentiated positioning, messaging, value propositions, and launch strategies based on customer, market, and competitive insights. Partner with Product and Engineering to understand product roadmaps, technical capabilities, integrations, data, AI functionality, and translate these into compelling customer benefits. Identify opportunities to improve product-market fit, adoption, expansion, and revenue growth. AI & Technical Product Marketing Develop GTM strategies for AI-powered products and capabilities , translating AI/GenAI functionality into clear business value and differentiated market positioning. Build sufficient technical depth to

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is building high-performance AI systems and the supply chain required to deliver them at scale. We are looking for a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment. This role is based in Santa Clara, CA; Austin, TX, or Toronto, ON, with regular travel to Taiwan and other Asia-based partner sites, approximately 25-30%. Candidates should be located near one of these hubs and able to work effectively across North American and Asia-Pacific time zones. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor’s degree in Supply Chain, Engineering, or a related discipline. Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners. Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues. Are a clear, direct, a

About the Role We are seeking a Strategic Finance Lead to help lead the economics of our AI products. In this role, you will be a key partner to our product, inference, and data teams, providing financial expertise to optimize model spend and drive pricing and margin decisions. In this role, you'll develop deep expertise in the unit economics of AI products, from per-request serving cost to consolidated product-level margin across our portfolio. You'll build the models that inform Perplexity's pricing, packaging, and model-deployment decisions, own the product-margin methodology that reconciles revenue and inference cost from production data, and translate complex model economics into clear financial narratives for leadership. This is a high-impact role for someone who thrives at the intersection of finance and AI product strategy, and who is energized by building frameworks from scratch in a fast-moving environment. This position is based in San Francisco and requires in-person attendance 2-3 days per week. Key Responsibilities Finance lead for inference and model spend, including budgeting, monthly forecasting, variance analysis, and financial plan maintenance Build and maintain product-margin models across the product portfolio, reconciling revenue, serving cost, and gross margin from production usage data Develop deep expertise in model provider contracts, pricing structures, and cost drivers, and surface optimization opportunities across the model portfolio and routing mix Serve as subject matter expert for product unit economics, owning source of truth on cost per request, margin by product and tier, and customer-segment and feature-level economics Own the consolidated model-cost forecast, translating product roadmaps and model transitions into forward-looking spend and margin trajectories Analyze the margin impact of pricing, packaging, and model-deployment decisions, distilled into a framework for product and pricing strategy Partner closely with product, in

About the team OpenAI’s Applied AI organization turns our latest model capabilities into products used by hundreds of millions of consumers, developers, and organizations worldwide. Our teams build the product experiences and platform foundations behind ChatGPT, Codex, our API platform, and offerings for businesses, enterprises, educational institutions, and other customers. Financial Engineering powers how customers purchase, access, and pay for these products. We build the systems behind pricing and packaging, checkout, payments, subscriptions, usage-based billing, credits, entitlements, invoicing, and the broader order-to-cash lifecycle. Our work spans consumer subscriptions, self-serve businesses, sophisticated enterprise agreements, developer usage, and emerging monetization models. These systems sit at the intersection of product experience and financial infrastructure. They must make it easy for customers to adopt OpenAI products while maintaining strong guarantees around correctness, reliability, security, reconciliation, and auditability. We partner closely with Product, Data Science, Finance, Accounting, Risk, Operations, and Go-to-Market teams to launch new offerings and build a financial platform that can evolve with OpenAI’s rapidly growing product portfolio. We are looking for an experienced engineer to help architect and build the next generation of these systems. In this role, you will: Have 5+ years of professional software engineering experience building and operating production backend, platform, or distributed systems. Have strong fundamentals in API design, data modeling, storage systems, transactional workflows, and event-driven architecture. Have experience building systems where correctness, reliability, observability, security, or data integrity are especially important. Are comfortable owning ambiguous, business-critical problems from initial definition through launch and long-term operation. Bring a product-oriented mindset and care about

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Responsibilities: Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods Identify, diagnose, and resolve assembly process related problems Coordinate and complete process, equipment, and material evaluati

Customer Success Manager - Growth and Retention The Customer Success Manager - Growth and Retention is responsible for reducing churn, improving customer health, and protecting recurring revenue through early risk detection, cross‑functional mitigation, and scalable retention programs. The role partners closely with Renewals, Customer Success, Customer Engagement, Competitive Intelligence, and Pricing & Packaging to orchestrate coordinated customer‑save strategies. This role also provides renewal objection handling expertise , enabling teams to navigate downsells, downgrades, competitive threats, pricing pushback, TCO/ROI concerns, and budget constraints. The ideal candidate excels at influencing cross‑functional teams, handling commercial risk, and translating customer insights into save actions. Key Responsibilities 1. Churn Risk Identification & Health Intelligence Maintain a standardized customer risk scoring framework leveraging health signals, product usage, support patterns, sentiment, and competitive exposure. Identify early risk indicators (e.g., discount cliffs, adoption gaps, under-deployed licenses, sponsor turnover). Partner with Renewal Ops, Data team to automate risk workflows in Salesforce Collaborate with Competitive Intelligence to map competitive displacement trends and update counter strategies. 2. Cross‑Functional Risk Orchestration (Renewals, CS, CI, Pricing) Lead weekly renewal risk reviews/war rooms with Renewals, CSMs/CEMs, and Sales to align on mitigation actions. Build account-level mitigation plans that include adoption interventions, executive alignment, value reinforcement, and commercial flexibility. Partner with Pricing & Packaging and Deal Desk to design controlled commercial offers (e.g., term/ramp, New Product Introductions, New SKU Impact, Product Bundling etc). Escalate systemic product, billing, or support issues and track resolution. 3. Renewal Objection Handling Serve as the subject‑matter expert for Re

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As FE CPIE CPI PI Senior Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution. In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. In addition, you will leverage AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate problem solving, improve productivity, enhance decision quality, and drive continuous innovation across product yield, quality, and business processes. Responsibilities and Tasks Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualific

About the role The Customer Success Manager - Growth and Retention is responsible for reducing churn, improving customer health, and protecting recurring revenue through early risk detection, cross‑functional mitigation, and scalable retention programs. The role partners closely with Renewals, Customer Success, Customer Engagement, Competitive Intelligence, and Pricing & Packaging to orchestrate coordinated customer‑save strategies. This role also provides renewal objection handling expertise , enabling teams to navigate downsells, downgrades, competitive threats, pricing pushback, TCO/ROI concerns, and budget constraints. The ideal candidate excels at influencing cross‑functional teams, handling commercial risk, and translating customer insights into save actions. What you’ll do 1. Churn Risk Identification & Health Intelligence Maintain a standardized customer risk scoring framework leveraging health signals, product usage, support patterns, sentiment, and competitive exposure. Identify early risk indicators (e.g., discount cliffs, adoption gaps, under-deployed licenses, sponsor turnover). Partner with Renewal Ops, Data team to automate risk workflows in Salesforce Collaborate with Competitive Intelligence to map competitive displacement trends and update counter strategies. 2. Cross‑Functional Risk Orchestration (Renewals, CS, CI, Pricing) Lead weekly renewal risk reviews/war rooms with Renewals, CSMs/CEMs, and Sales to align on mitigation actions. Build account-level mitigation plans that include adoption interventions, executive alignment, value reinforcement, and commercial flexibility. Partner with Pricing & Packaging and Deal Desk to design controlled commercial offers (e.g., term/ramp, New Product Introductions, New SKU Impact, Product Bundling etc). Escalate systemic product, billing, or support issues and track resolution. 3. Renewal Objection Handling Serve as the subject‑matter expert for Renewals by providing guidance, playbooks, and