Packaging Research And Development Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Position Summary As an IoT Engineer, Engineer based in Singapore, you will design, build, and deploy Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will implement hands-on engineering work from proof-of-concept through deployment and sustainment, contributing to scalable and secure solutions that improve quality, productivity, and early risk detection. You will collaborate cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while operating with a strong safety mentality and a bias for practical, reliable delivery. Key Responsibilities Develop and deploy IIoT solutions end-to-end: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Build machine vision solutions: support hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm development, performance validation, and deployment readiness. Work with process, equipment, automation, quality, and IT/data platfor

Who we are Lab37 Robotics , is a technology company focused on the development and deployment of robots designed specifically for direct-to-customer food production. Our mission is to revolutionize the food industry by creating innovative robotic solutions that enhance efficiency, quality, and customer satisfaction. We are passionate about pushing the boundaries of technology to deliver cutting-edge products that meet the evolving needs of our clients. Role Overview You love designing, prototyping and testing new brands at speed. Given a solid brief, you can generate a full identity system fast — logo, color, type, packaging, menu, digital — without sacrificing craft. You're a maker first, with the strategic sensibility to know when the design is doing its job and when it isn't. You’re a brand world native and stay on top of what’s trending. What you’ll do Own brand direction: produce mood boards and brand synopsis that define the visual and narrative identity Lead brand naming, brand story, and logo/iconography — go from concept brief to full identity system Execute component photography and hero imagery — build the visual library that powers AI asset generation and marketplace listings Produce the full OFO asset pack (backgrounds, thumbnails, variants) and marketing assets (website, social, merch) Build and maintain a design system and templating toolkit so assets can be produced at scale Support digital onboarding and launch with platform-ready creative Work in tight sprints — expect fast feedback cycles and fast iteration What we are looking for 3+ years of brand design experience — portfolio that shows full identity systems, not just logos Experience creating in other mediums beyond static design, including photography and video Fast. You ship. You don't get precious. Strong typography and layout fundamentals Experience designing for food / hospitality / CPG (understanding of packaging, menus, and food-adjacent visual language)

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Principal Layout Designer in the Next-generation HBM Architecture Team , you will drive layout for 3D-stacked, high-performance memories. Apply your knowledge to deliver high-quality layout designs across analog and/or mixed-signal domains in collaboration with peer architecture, design, and packaging teams. Implement layout designs for early architecture concepts to demonstrate feasibility and identify optimizations. Responsibilities: Design layouts for critical analog and mixed-signal blocks. Drive exploratory layout process for next-generation architectures, including floorplanning, placement, and routing. Integrate full chip designs and perform layout verification (LVS, DRC), quality checks, and documentation. Collaborate and communicate across domains, including signal integrity, architecture, design, and advanced packaging, to ensure successful architecture exploration. Minimum Qualifications: Hands-on layout experience with critical analog blocks and full designs. Experience with Cadence VLE/VXL and Mentor Graphics Calibre DR

Secure Every Identity, from AI to Human Identity is the key to unlocking the potential of AI. Okta secures AI by building the trusted, neutral infrastructure that enables organizations to safely embrace this new era. This work requires a relentless drive to solve complex challenges with real-world stakes. We are looking for builders and owners who operate with speed and urgency and execute with excellence. This is an opportunity to do career-defining work. We're all in on this mission. If you are too, let's talk. The Pricing Strategy & Ops Team The Pricing Strategy & Ops team owns the end-to-end pricing, packaging, and commercialization of all products across both Okta and Auth0, bringing new innovations to market while continuously optimizing our existing portfolio. We partner closely with Product and GTM teams to design strategic commercial frameworks and own the SKU execution needed to operationalize our business at scale. The Director, Commercial Strategy & Buying Programs Opportunity We are seeking a world-class Pricing & Commercialization leader to design, scale, and drive our enterprise monetization and commercial purchasing frameworks. In this role, you will be the chief architect of Okta's Enterprise License Agreements (ELAs), channel partner pricing structures, and competitive initiatives. You will work across Sales, Renewals, Product Management, Product Marketing, Partners and Operations teams to optimize our monetization strategy and capture market value as Okta continues to scale. This role requires a unique blend of strategic structured thinking, pricing & deal strategy acumen, and cross-functional leadership. You will lead x-functional teams to translate packaging and pricing innovations into high-velocity commercial buying programs that land successfully with customers and the field. What you’ll be doing Define, launch and scale global Enterprise License Agreements (ELAs) and bundling strategies that simplify transactions, i

About the Team The Pricing & Monetization team is responsible for how our products create and capture value. We partner closely with Product, Engineering, Data Science, GTM, and Finance to design pricing models, packaging, and commercial strategies that support adoption, growth, and long-term scaling of the business. To thrive in this team, you need to be a proactive problem-solver who excels at bringing structure to ambiguous challenges. Our work demands strategic thinking, cross-functional collaboration, and precision in execution. Team members succeed when they are analytical, detail-oriented, skilled at balancing multiple priorities, and passionate about driving high-stakes projects forward to deliver meaningful results. About the Role We are looking for a Pricing Strategist to shape how we price and monetize OpenAI’s API platform. You’ll own the end-to-end pricing strategy across model launches, price architecture, packaging, commitments and discounts, and monetization guardrails. You’ll work closely with senior leaders across Product, Engineering, Data Science, GTM, and Finance to define pricing approaches, improve commercial decision-making, and bring more rigor to how we monetize our API offerings. You should be comfortable building monetization frameworks and commercial policies, analyzing tradeoffs, supporting high-impact decisions and driving decision making. You should also care deeply about the customer perspective and believe that strong pricing reflects a real understanding of customer value, needs, and friction points in order to build pricing that is clear, fair, and aligned with how customers experience our products. This role will report to the Head of Product Pricing for API & Platform. What you’ll do Develop the end-to-end pricing strategy for our API platform, including model launch pricing, price architecture, packaging, discount logic, and monetization guardrails. Recommend pricing for new models, capabilities, and platform offerings,

About the team The Pricing & Monetization team is responsible for how OpenAI products create and capture value. We partner closely with GTM, Finance, and Product to design pricing models, packaging, and commercial strategies that support adoption, growth, and long-term scaling of the business. To thrive in this team, you need to be a proactive problem-solver who excels at bringing structure to ambiguous challenges. Our work demands strategic thinking, cross-functional collaboration, and precision in execution. Team members succeed when they are analytical, detail-oriented, skilled at balancing multiple priorities, and passionate about driving high-stakes projects forward to deliver meaningful results. About the role We are looking for a Pricing Strategist to shape the pricing frameworks, commercial policies, and decision principles that govern our most consequential commercial decisions. This role works closely with senior leaders across GTM and Finance to define our overall pricing strategy for our sales managed segment as well as the key pricing guardrails and commercial pricing framework we enable to help our sellers and customers move fast and land mutually beneficial commercial agreements at scale. The ideal candidate is comfortable developing durable monetization frameworks and commercial policies, analyzing tradeoffs, and supporting high-impact decisions. They bring structure to ambiguity, communicate tradeoffs crisply, and know when an exception reveals a one-off need versus a broader opportunity to improve our commercial model. This role will report to the Head of Go-to-Market Pricing. In this role, you will Develop frameworks and strategies that guide commercial pricing decisions. Design commercial constructs—including commitments, incentives, and risk-sharing approaches—that address customer needs while supporting healthy unit economics and long-term growth. Build and evolve discounting frameworks, guardrails, and approval principles that improve pric

In this competitive market, the Group Product Manager for Cloud Security will play a mission-critical role in providing product and strategy leadership to grow Datadog’s market share through differentiation, innovation and compelling customer value. This leader will lead a talented and growing team of product managers and work with world class engineers to build and grow multiple Cloud Security products that play an essential role for our customers’ cloud security programs, and growing Datadog into a security industry leader. You Will: Run and grow multiple Cloud Security products to meet revenue and business targets with the goal of building a multi-hundred million dollar annual business. Lead and own product strategy and roadmap for accountable security products, fully aligned to revenue and business goals and with compelling differentiation and customer value. Ensure predictable roadmap execution across direct and partner teams to achieve product and business outcomes required to meet the revenue and business goals. Analyze and develop pricing and packaging strategies to maximize revenue through attaching deep understanding of market dynamics and other strategic leverage points. Drive GTM strategy with GTM partner teams to achieve revenue and business goals Fulfill the role as the product-leader representative across accountable product lines with analyst, press and customer communities Manage and grow individual contributor (IC) Product Managers, ensuring they are motivated, delivering high quality work and finding high fulfillment. Model and contribute to a culture of learning and collaboration across product management and the broader organization Raise the bar of PM leadership through leadership in strategy development, roadmap planning and execution, GTM and overall product-leader responsibilities. You Are: An experienced leader in Product Management with demonstrated business growth and customer adoption success in the CNAPP, data and AI

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Power Delivery Network (PDN) Engineer , you will be part of the Heterogeneous Integration Group (HIG), responsible for the design, analysis, and optimization of power delivery networks for next-generation HBM products. You will work closely with architecture, design, physical design, packaging, and product engineering teams to ensure robust, efficient, and manufacturable power delivery solutions that meet aggressive performance, power integrity, and reliability targets. This is a hands-on technical role focused on PDN design, EM/IR analysis, and cross-domain optimization across technology, design, and layout. Key Responsibilities Design and develop SoC-level and HBM-cube-level power delivery networks for HBM designs, including power grid architecture, routing strategies, and decoupling schemes. Perform EM/IR analysis and optimization using industry-standard tools (e.g., Cadence RedHawk, Ansys Totem) to ensure power integrity across dynamic workloads. Collaborate with physical design teams on floorplanning, placement, and routing strategies to enable efficient PDN implementation. Drive power integrity closure across multi-mode/multi-corner scenarios, identifying and mitigating droop, noise, and electromigration risks. Work with package and system teams to co-optimize die-package-system PDN interactions, including bump/pad assignment and current distribution. Develop and validate power models, including activity-based current profiles and transient analysis for realistic

Real people. Real service. At SupplyHouse.com , we value every individual team member and cultivate a community where people come first. Led by our core values of G enerosity, R espect, I nnovation, T eamwork, and GRIT, we’re dedicated to maintaining a supportive work environment that celebrates diversity and empowers everyone to reach their full potential. As an industry-leading e-commerce company specializing in HVAC, plumbing, heating, and electrical supplies since 2004, we strive to foster growth while providing the best possible experience for our customers. We are looking for a new Value Added Services (VAS) Associate to join our growing Inventory Control Team and Fulfillment Center network. This individual will report into our Inventory Control Supervisor and is responsible for executing kitting, assembly, packaging, labeling, and inventory rework activities within the Inventory Control department. This role ensures that inventory impacted by promotions, internal process corrections, or quality initiatives is accurately modified, documented, and returned to available stock while maintaining high standards of inventory integrity and quality control. If you are motivated and want to start a career with a rapidly growing company , we’d love to hear from you! Job Type: Full-Time, Non-Exempt Location: 530,000 sq. ft. in Columbus, OH at 6085 Winchester Pike, Columbus, OH 43110 Schedule: Monday through Friday, from 11:00am to 7:30pm EST Base Salary: $20.00 per hour (paid weekly) Responsibilities: Assemble and package kits by combining multiple products, components, or promotional materials according to defined work instructions Perform inventory rework resulting from internal process corrections, quality holds, labeling errors, packaging updates, or operational changes Repackage, relabel, or reconfigure products to meet updated internal standards or customer requirements Locate, pull, stage, and return inventory components accurately to s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies. Responsibilities and Tasks Lab Management, Compliance & Audits Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards. Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency. Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime. Evaluate and introduce new FA tool models and capabilities in partnershi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

About the Team Our team turns OpenAI’s latest model capabilities into polished, trusted products for consumers and developers. We build the end-to-end experiences including product surfaces, platform layers, and developer workflows that make cutting-edge AI accessible, useful, and dependable at scale. OpenAI’s Financial Engineering (FinEng) team powers how revenue flows through our products - pricing and packaging, checkout, payments, subscriptions, and the financial infrastructure behind them. We partner closely with Engineering, Data Science, Risk, Finance, and Go-to-Market to make paying for OpenAI products seamless, reliable, and efficient worldwide. We pair rapid innovation with a rigorous approach to responsible deployment. Safety and trust are built into how we design, ship, and learn from real-world usage, so these tools deliver meaningful value while aligning with OpenAI’s mission. About the Role We are seeking an experienced Product Manager to scale the product efforts and technical strategy within our Financial Engineering team. The ideal candidate has prior experience in billing, finance, and accounting, ideally also building solutions for commercial users of varying sizes from small scale to enterprise. This role requires close collaboration with our product, finance, operations, and engineering teams. This position is based in San Francisco, CA. We utilize a hybrid work model with 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Develop a strategy and roadmap to efficiently scale the billing operations and customer experience behind OpenAI’s growing product portfolio Identify and execute opportunities to improve the order-to-cash processing for OpenAI’s largest and most strategic customers Build AI powered tooling for key partner teams such as Finance and User Operations to drive better decisions and business outcomes Collaborate with other product teams to defining OpenAI’s evolving monetization s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl