Pi Mb And Espec Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities Yield Loss Accounted For Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode Work closely with PI to identify defect that is coming from their area to brainstorm for CIP Learn NPI processes, phase gates, and yield best practices Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss Yield Deviation Control Analyze and report on yield deviation issue and trigger action from PI, PE or RDA Support block run and partial conversion build yield analysis to early detect any impact on yield Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring Yield Improvement Opportunities Brainstorm with staff from other departments to brainstorm for improvement opportunities to propose to PI Utilize software tool like Auto-diagnostics to find yield improvement opportunities Integrating Artificial Intelligence Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements Contributes to a culture of continuous improvement by identifying, testing, and sha

About the job Shape the infrastructure work that keeps Graphcore software moving at scale. As Technology Owner, you will turn software infrastructure priorities into clear, actionable work. You will connect product intent, engineering delivery and cross-team coordination. Your work will help a 30-person Software Infrastructure team build, test and support the platforms used across Graphcore software. You will bring clarity to complex dependencies, delivery choices and roadmap decisions. You will own and refine backlogs, shape PI plans, support sprint delivery and coordinate across technical teams. You will work closely with Technology Managers, Technology Owners, technical leads and engineers. This role suits someone who brings calm, structure and technical curiosity to complex work. You will help teams move faster without losing quality, context or purpose. The team and culture You will work with the Software Infrastructure team, which provides platforms and services for the wider Software organisation. Their work supports how Graphcore teams build, test and develop software. Work is planned in increments, shaped through backlog refinement, sprint planning, reviews and demos. Decisions are made through close engagement with engineers, technical leads and product partners. You will give multiple sub-teams clear direction and well-defined deliverables. You will also surface risks early, speak up on trade-offs and help teams stay aligned. What we're looking for Experience working as a Product Owner, Technology Owner or similar role in an agile engineering setting. Strong backlog management skills, with the judgement to connect work to product outcomes. Confidence working with technical teams, complex systems and cross-team dependencies. Ability to simplify complex information for technical and non-technical stakeholders. Strong facilitation skills, with the ability to guide discussions towards clear decisions. Technical understanding of software development, testing o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, exp

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams. This role is based in San Francisco and requires in-person presence four days per week. In this role, you will: Own PCB layout, component placement, routing, and fabrication release for complex robotic systems. Collaborate with SI/PI engineers to refine layouts based on simulation results. Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements. Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release. Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes. Inspect newly received PCBAs and participate in board-level manufacturing failure analysis. Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models. You might thrive in this role if you: Have 6+ years of experience designing complex, multilayer PCBs. Are fluent in Cadence Allegro PCB Designer and Constraint Manager. Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

Roll : SAP FI/ABAP Support Consultant Location : Visakhapatnam and Hyderabad Employment Type : Full-Time Experience : 5+ Years Skiils : SAP FI,SAP ABAP Job Summary: Provide support and enhancements for SAP FI and ABAP applications. Analyze and implement simple change requests (e.g., adding/changing a field, field validations, report updates, screen modifications). Perform basic ABAP development, testing, and transport management. Support incident resolution and user queries. Coordinate with onsite teams and business stakeholders. Preferred Skills: SAP FI functional knowledge (GL, AP, AR, Asset Accounting). Basic ABAP development and debugging. Experience with small enhancements and support activities. Knowledge of SAP interfaces/integrations. Preferred: Experience with SAP integrations with Workday (employee master data, organizational data, payroll, HR-related interfaces using IDoc, APIs, middleware such as CPI/PI/PO).

About Us Paytm is India's payment Super App offering consumers and merchants the most comprehensive payment services. As the pioneer of the mobile QR payments revolution in India, today Paytm stands as India’s largest payment company by Users, Merchants, Payment Transactions, and Revenue. Paytm’s mission is to drive financial inclusion across the nation and bring half a billion Indians into the mainstream economy through technology-led financial services. Paytm enables commerce for small merchants and distributes various financial services offerings to its consumers and merchants in partnership with financial institutions. Paytm has been a trailblazer in the merchant space by introducing innovative solutions like QR codes to accept payments and the Sound-box to reconcile payments via voice alerts. Furthermore, we are actively distributing loans to these partners via our 'Paytm for Business' application. Role Overview We are looking for a high-performing Hunter Account Director to drive net-new enterprise business for Pi Commerce. This is a pure hunting role focused entirely on acquiring large enterprise logos, owning complex end-to-end sales cycles, and driving meaningful revenue growth. Operating at the intersection of AI, SaaS, and customer engagement, you will be responsible for positioning a highly differentiated platform directly to CXOs and executive leadership teams across a diverse range of industries. Key Responsibilities  Own the end-to-end enterprise sales cycle — from initial prospecting and discovery to commercial negotiation and closure.  Drive new logo acquisition aggressively across large enterprises (BFSI, Retail, Telecom, Healthcare, etc.).  Build and manage a robust, qualified sales pipeline through outbound hunting, professional networking, and strategic account mapping.  Lead CXO-level conversations, masterfully articulating business value propositions around AI-led customer engagement.  Conduct deep, consultative discovery to th

About the Team DoorDash Labs is DoorDash's autonomous delivery group, building the robots and hardware that move goods without a driver. The Hardware team designs the electronics at the core of these systems — digital and mixed-signal control boards, power and motor-control electronics, embedded firmware, and the test and integration benches that prove the whole system works. We're building out an experienced and diverse set of electrical engineers to increase our velocity, bandwidth, and operations. About the Role You'll bring PCB layout in-house — a core quality goal — owning floorplanning, stackups, and layout while coordinating closely with mechanical, thermal, and SI/PI engineering to land complete, manufacturable boards. You will report into the Director, Electrical Engineering on our Hardware team in our DoorDash Labs organization. Our offices are open, and depending on the role this position is hybrid or fully onsite — expect to be fully onsite when needed. You're excited about this opportunity because you will… Perform floorplan analysis and create stackups, layout, and footprints Work with mechanical engineering to ensure fit and form compatibility with mechanical systems Work with thermal engineering to ensure a thermally sound layout Work with SI/PI engineering to ensure the board design is complete and robust Drive toward consistently high-quality layout We're excited about you because… Strong PCB layout experience across digital and mixed-signal boards Familiar with stackup technologies, their limitations and considerations, and cost/lead-time impacts Controlled-impedance and high-speed routing know-how; PI/PDN fundamentals Proficient in a professional layout tool (Altium, Cadence, or similar) Comfortable coordinating with mechanical, thermal, and SI/PI engineering Compensation The successful candidate’s starting pay will fall within the pay range listed below and is determined based on job-related factors including, but not limited to, skills, experie

Role Overview As a Key Account Manager / Enterprise Account Manager, you will own strategic relationships with leading D2C, digital-first, and retail brands. You will help them drive customer acquisition, engagement, retention, and support through the Paytm Pi Marketing platform—our AI-powered customer engagement platform. In this role, you will be responsible for driving new business, growing existing accounts, and positioning our comprehensive suite of solutions across Enterprise CPaaS, AI Agents, and Omnichannel Customer Engagement. Key Responsibilities 1. Business Development & Revenue Portfolio Ownership: Own the acquisition and growth of a strategic portfolio of D2C, e-commerce, and retail brands. Target Achievement: Consistently deliver on annual revenue, gross margin, and account growth targets. Expansion: Proactively identify and execute cross-sell and upsell opportunities across the full product suite. Stakeholder Engagement: Build, nurture, and manage strong executive relationships with CXOs and decision-makers across Marketing, CRM, Digital, Customer Experience (CX), Support, Product, and E-commerce teams. 2. Sales & Account Growth End-to-End Sales Lifecycle: Lead the complete sales lifecycle—from initial solution mapping and commercial negotiation to final closure and account expansion. Strategic Planning: Develop and execute comprehensive account plans for key enterprise clients. Adoption & Performance: Drive long-term product adoption, platform usage, and account retention. Metrics & KPIs: Continuously track key business metrics, including revenue growth, adoption rates, and customer success KPIs. 3. Solutioning Understand complex customer challenges and architect tailored solutions across: Enterprise CPaaS: WhatsApp, SMS, Voice, Email, and RCS AI Agents Omnichannel Customer Engagement Conversational Commerce 4. Cross-Functional Collaboration Product & Engineering: Share critical customer feedback, adoption barriers, feature requests, and market

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: A senior advanced assembly technology development engineer is responsible for introducing new technology to enable next generation packaging. This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone. This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully. Responsibilities Explore new technology on semiconductor industry such as flip chip, TCB and hybrid bonding process equipment and packaging material. Provide plan and resource requirement to enable new technology. Set up DOE plan and execute. Build sample and perform data analysis skill. Lead efficiency trouble shooting skill to improve process. Prepare documentation for process transfer from TD to HVM Review process stability by FDC, SPC and test result. Self-motivated and capable of working independently, proactively identifying opportunities and driving projects with minimal direction. <span

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3&#43; months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. PCRB & Quality Governance Lead or support PCRB reviews for process, equipment, material, and system changes Ensure conversion activities comply with quality governance frameworks (GCP, PCRB, Conversion Control) Perform risk gatekeeping for Class 2 and Class 3 conversions and track open issues to closure Risk Assessment & Analysis Execute and review risk assessments (e.g., PPA, FMEA, scenario‑based analysis) Collaborate with SMEs, PI, PE, QE, CPIE, CH, and other stakeholders to ensure risks are fully identified and mitigated Support investigation and resolution of post‑conversion quality issues (DPM, UE, yield drift, etc.) Cross‑Functional & Cross‑Site Collaboration Work closely with Site PCRB teams, PI, Process, Equipment, and Material teams Support cross‑site initiatives and transfers (e.g., OMT, F15, F16, Falcon) including One PCRB operations Act as a quality gatekeeper by providing independent technical judgment and risk‑based recommendations Systems & Process Improvement Participate in continuous improvement of systems and processes (GCP, PCRB, Auto‑CPM, dashboards) Maintain conversion review records, metrics, and management reports Support internal and external audits (e.g., IATF, customer audits) through evidence preparation and response coordination Qualifications Required Bachelor’s degree or above in Engineering or

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As MSH PDE Yield Enhancement (YE) Lead Engineer within Package Development Engineering (PDE), you will lead a team of YE Engineers responsible for yield performance, excursion management, and yield stabilization across High Bandwidth Memory (HBM) New Product Introduction (NPI) . This role is accountable for ensuring predictable yield ramps , fast learning closure , and robust manufacturing readiness for advanced HBM technologies. You will provide people leadership, technical direction, and execution governance , partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing, Quality, and Program Leadership to protect schedule, yield, and customer commitments. Job Responsibilities People & Team Leadership Build, lead, and develop a high‑performing MSH PDE YE team Set clear expectations on yield ownership, execution discipline, and escalation behavior Coach engineers on technical rigor, structured problem solving, and stakeholder communication Drive individual development plans, succession planning, and technical depth within the YE team Ensure sustainable on‑call / coverage models for critical NPI and

About Us Paytm is India's payment Super App offering consumers and merchants the most comprehensive payment services. As the pioneer of the mobile QR payments revolution in India, today Paytm stands as India’s largest payment company by Users, Merchants, Payment Transactions, and Revenue. Paytm’s mission is to drive financial inclusion across the nation and bring half a billion Indians into the mainstream economy through technology-led financial services. Paytm enables commerce for small merchants and distributes various financial services offerings to its consumers and merchants in partnership with financial institutions. Paytm has been a trailblazer in the merchant space by introducing innovative solutions like QR codes to accept payments and the Sound-box to reconcile payments via voice alerts. Furthermore, we are actively distributing loans to these partners via our 'Paytm for Business' application. Role Overview We are looking for a high-performing Hunter Account Director to drive net-new enterprise business for Pi Commerce. This is a pure hunting role focused entirely on acquiring large enterprise logos, owning complex end-to-end sales cycles, and driving meaningful revenue growth. Operating at the intersection of AI, SaaS, and customer engagement, you will be responsible for positioning a highly differentiated platform directly to CXOs and executive leadership teams across a diverse range of industries. Key Responsibilities  Own the end-to-end enterprise sales cycle — from initial prospecting and discovery to commercial negotiation and closure.  Drive new logo acquisition aggressively across large enterprises (BFSI, Retail, Telecom, Healthcare, etc.).  Build and manage a robust, qualified sales pipeline through outbound hunting, professional networking, and strategic account mapping.  Lead CXO-level conversations, masterfully articulating business value propositions around AI-led customer engagement.  Conduct deep, consultative discovery to th

About Us Paytm is India's payment Super App offering consumers and merchants the most comprehensive payment services. As the pioneer of the mobile QR payments revolution in India, today Paytm stands as India’s largest payment company by Users, Merchants, Payment Transactions, and Revenue. Paytm’s mission is to drive financial inclusion across the nation and bring half a billion Indians into the mainstream economy through technology-led financial services. Paytm enables commerce for small merchants and distributes various financial services offerings to its consumers and merchants in partnership with financial institutions. Paytm has been a trailblazer in the merchant space by introducing innovative solutions like QR codes to accept payments and the Sound-box to reconcile payments via voice alerts. Furthermore, we are actively distributing loans to these partners via our 'Paytm for Business' application. Role Overview We are looking for a high-performing Hunter Account Director to drive net-new enterprise business for Pi Commerce. This is a pure hunting role focused entirely on acquiring large enterprise logos, owning complex end-to-end sales cycles, and driving meaningful revenue growth. Operating at the intersection of AI, SaaS, and customer engagement, you will be responsible for positioning a highly differentiated platform directly to CXOs and executive leadership teams across a diverse range of industries. Key Responsibilities  Own the end-to-end enterprise sales cycle — from initial prospecting and discovery to commercial negotiation and closure.  Drive new logo acquisition aggressively across large enterprises (BFSI, Retail, Telecom, Healthcare, etc.).  Build and manage a robust, qualified sales pipeline through outbound hunting, professional networking, and strategic account mapping.  Lead CXO-level conversations, masterfully articulating business value propositions around AI-led customer engagement.  Conduct deep, consultative discovery to th

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Responsibilities: Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets . Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity. Own and advance product integration programs and loop‑level domain expertise , maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration , including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accel