Principal Engineer Gfac Sasia Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Main Responsibilities Strategy, Roadmap & Technical Direction Define and implement technical strategy for cell film process development aligned to business and technology objectives. Identify emerging trends/risks/opportunities and recommend future investments/initiatives. End-to-End Module Development & Scaling Lead multi-functional development, integration, and scaling of thin film processes tailored for advanced NAND devices; ensure manufacturability/scalability/readiness for integration. Drive technology transfer and ramp-up activities to ensure seamless transition from R&D to high-volume manufacturing. Complex Problem Solving & Business Outcomes Resolve complex technical challenges (including RCA/mitigation of process/device failures). Lead cost reduction, yield improvement, and reliability enhancement programs via innovative process/material utilization. Leadership & External Representation Mentor senior engineers and influence technical direction across the organization; represent the function in technical forums and strategic collaborations (consortia, conferences, joint dev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team via plasma process optimization, new/FOAK chemistry & hardware qualification , and CIP development collaboration with dry etch suppliers. Collaborate with cross-functional teams to drive breakthroughs in defect reduction, particle/residue control, CD uniformity, profile control, and chamber-matching across the global fleet. Develop the process and hardware CIP roadmap for Dry Etch — covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades. Drive process & hardware improvement with emphasis on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules ( Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High-Aspect-Ratio (HARC) Etch, Spacer/ALE, etc.). Partner with suppliers to establish equipment start-up acceptance criteria, chamber qualification flows, and tool service requirements ; work with global facilities to address new tool installation requirements (abatement, exhaust, RF compliance, gas/chemical infrastructure). Improve tool efficiency, WPD, and utilization across all Micron Dry Etch fleets through benchmarking, MAXOUT-style productivity programs, and pathfinding solutions . Set up IoT/FDC sensors and advanced chamber telemetry for defen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Strategize and lead productivity, yield, quality, cost improvement engagement with global sites and network team via process optimization, new/FOAK chemistry & technology qualification, CIP development collaboration with suppliers. Collaborate with cross functional team for breakthrough in defects reduction and particle removal efficiency enhancements. Develop roadmap for process and hardware CIP implementation Drive process & hardware improvement development with an emphasis on safety, defect reduction, cost efficiency, scale, quality, and sustainability in Wet Process (SWC, Bench, Scrub, Backside, Bevel, etc.). Collaborate with suppliers to establish equipment start-up acceptance criteria and tool service requirements, and work with global facilities to address new tool requirements. Improve tool efficiency and utilization across all Micron sites through benchmarking and innovative pathfinding solutions. Set up IoT sensors for defense line strengthening in Wet tools and develop new solutions for excursion prevention. Establish and improve process conditions and technology, upgrade process capability, and reduce production costs. Enable new solutions for energy savings, water conservation and waste reductions. Qualifications & Skills: Proven experience in process & hardware improvement and development within the semiconductor industry. Remarkable skill in developing a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Craft and analyze digital and analog circuits used in the development of memory products including simulating, optimizing, and floor planning DRAM circuits. Collaborate with various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to proactively craft HBM products that optimize all manufacturing functions and assure the best performance, power, cost, quality, reliability, time-to-market, and customer happiness. Innovate and integrate end-toend groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). Employer will accept a Master’s degree in Electrical Engineering, Physics, Computer Engineering, Semiconductor Engineering or a related field and 10 years of experience in the job offered or in a related field. Position requires: 1. High-speed memory design on data paths, from I/O interface to core array 2. 2. Power domain network analysis 3. Memory test architectures like MBIST and production silicon validation 4. Digital design methodologies experience including RTL design, synthesis, and physical implementation 5. ASIC design development using digital design 6. Memory core timing, latency control, and signal integrity consideration in advanced designs <p style="

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Own package architecture and execution from feasibility through tape-out, qualification, and production readiness, ensuring design intent is translated into manufacturable, reliable, and scalable solutions. Serve as the technical authority for complex package issues, leading cross-functional reviews, trade-off decisions, and risk closure across product, silicon, technology, assembly, quality, supplier, and OSAT teams. Balance performance, reliability, manufacturability, cost, quality, and schedule to deliver production-ready solutions while mentoring engineers through difficult technical decisions. Advance design rules, methodologies, automation workflows, and technology roadmaps for future products. Represent the packaging team in Silicon–package–board co-design by integrating floorplan, interface, interconnect, power, signal, thermal, and mechanical requirements, and resolve cost and manufacturing trade-offs to achieve a balanced package solution. Ability to apply baseline digital fluency and role-approp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Quality Management System (QMS) & Document Standardization Own and drive Quality Management System (QMS) documentation governance across Assembly & Test. Lead global standardization of: Procedures Specifications Work Instructions Best-known methods (BKMs) Quality documentation templates Establish document control processes to ensure compliance, consistency, and traceability. Partner with site quality teams to review, consolidate, and harmonize quality documents across global manufacturing sites. Drive continuous improvement opportunities to simplify documentation and eliminate redundant processes. iQCP Business Unit SME (Agentic Quality Transformation) Serve as Business Unit Subject Matter Expert (SME) for iQCP deployment initiatives. Translate business requirements into AI agent use cases and digital workflow solutions. Partner with SMAI, Digital Transformation teams, and Quality stakeholders to: Define requirements Map business processes Validate agent outputs Measure business value realization Drive user adoption of AI-enabled quality agents. Support pilot execution, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal/MTS Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are driving the future of semiconductor design and innovation through advanced CAD, EDA, and AI-enabled engineering solutions. Our team works on technologies that help accelerate the development of next-generation memory and storage products used around the world. If you enjoy solving complex technical challenges, collaborating across engineering disciplines, and shaping the tools that enable breakthrough products, you'll find meaningful work here. As a CAD Engineer, you will play a key role in developing, improving, and supporting design automation tools and workflows used across integrated circuit design, physical implementation, and verification. You'll work closely with design, process, and software engineering teams to enhance productivity, introduce new technologies, and help drive the adoption of AI and machine learning within engineering workflows. Responsibilities: Lead the development, evaluation, and enhancement of CAD and EDA tools, flows, and methodologies Drive large-scale technical projects and provide expertise within CAD, design automation, and verification domains Guide AI and machine learning integration across CAD workflows and engineering applications Collaborate with design and process engineering teams to improve design efficiency and tool effectiveness Deliver training, documentation, and technical support for new tools, processes, and methodologies Minimum Qualifications: Bachelor's degree in Computer Engineering

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within the larger SI R&D group, as a Principal Signal Integrity Engineer at Micron, you will be responsible for: Leading the development and analysis of high speed (HS or similar expertise) memory interfaces and power distribution networks (PDN) . Applying AI/ML and data-driven techniques to accelerate Signal Integrity / Power Integrity analysis, build optimization , and engineering decision-making. Applying automation, scripting, and AI-assisted engineering workflows to improve simulation efficiency and coverage. Representing the Signal Integrity R&D team in technical cross-functional collaborative groups , integrating with package build, silicon develop, system invent, product engineering, and marketing departments to ensure overall product performance. Driving and developing SI/PI aspects of future standards (including but not limited to JEDEC, ONFI, and IBIS) through system and product electrical capability exploration. Supporting external customers as needed. Formulating techniques and protocols for SI/PI analysis. Supporting and driving path-finding activities for IO and channel innovation to enable the next generation of memory technologies at higher speeds and densities. Minimum Qualifications PhD or MSEE, or equivalent experience, with at least 5 years of industry experience. Deep experience in Signal and Power Integrity, particularly in areas affecting I/O circui

Our MDM team is seeking an experienced Principal Full-Stack engineer, to join an established engineering team. You will work on our D&B Connect application, a strategic self-service Master Data Management (MDM) platform that enables customers to cleanse, match, enrich, monitor, and manage their first-party data using D&B's Commercial Graph and D-U-N-S®-anchored data assets. This serves as our primary MDM customer-facing platform, accessed via web UI plus CRM, Marketing and Cloud Data Warehouse integrations with planned support for AI-driven headless access through MCP tools. The Principal Engineer (Full Stack) is responsible for working across the full stack, building highly scalable distributed solutions that enable positive user experiences and measurable business growth. This role needs to complete the assigned projects with end-to-end ownership. Team Overview Design and evolve enterprise-grade Master Data Management (MDM) platforms powering core business entities (e.g., customers, suppliers, leads, reference data) Address challenges in data quality , identity resolution , integration , and governance at scale Build highly available, resilient systems that support both real-time and batch workloads across global regions Collaborate with product, data, and platform teams to transform business needs into scalable technical solutions Key Responsibilities Work across the full stack, building highly scalable distributed solutions that enable positive user experiences and measurable business growth Partner with development and product teams to ensure product quality in a fast-paced Agile environment Partner with SRE team to deploy and manage data infrastructure on cloud platforms such as GCP or AWS<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE &#43; 10 years or BSEE &#43; 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Principal Engineer - Offensive Operations — TN - Work from home. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview As a Principal Engineer within the Validation Strategy & Test Architecture organization, you will define and drive the future of validation strategy, coverage architecture, and next-generation validation solutions for Micron's Data Center SSD portfolio. This role focuses on identifying validation gaps, developing scalable coverage methodologies, evaluating emerging technologies, and improving validation effectiveness through strategic, data-driven approaches. You will work closely with architecture, firmware, system, product, and validation teams to translate customer requirements, product architectures, field learnings, and technology roadmaps into actionable validation strategies and reusable coverage solutions. The role will also help drive adoption of AI-assisted engineering capabilities, leveraging Generative AI, Large Language Models (LLMs), Agentic AI, and advanced analytics to improve coverage analysis, requirements understanding, engineering productivity, and validation decision-making. Responsibilities Define validation strategies and coverage architectures for next-generation Data Center SSD technologies and customer deployments. Develop scalable validation meth

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. Role: The team member will typically work on processors, controller architectures or ASICs for Enterprise SSD Group. Should be proficient in block level low power aware floorplanning, placement, clock tree synthesis, routing, RC extraction, STA timing closure, IR/EM analysis, DRC/LVS/ERC and tape out activities. Requirements Minimum of 15 years of hands-on physical design implementation/IR/EM experience along with APR flow development and PPA analysis STA closure at block & Full Chip Experience in Advanced process technology nodes (5nm/3nm preferred) Experience with Ansys Redhawk-SC tool Experience with Cadence layout tools ( In

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal Engineer in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization. Mater