Probe Application Integration Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Join an inclusive team passionate about one thing: using their expertise in the continuous pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while contributing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing! Responsibilities Operate and support the full robotics and automation fleet – autonomous mobile robots, CoBOTs and associated automation platforms – delivering material handling, picking and loading operations across Probe, Fab, Smart Warehouse, bridges and supporting facilities. Serve as the robotics point-of-contact for your assigned shift – monitor operations, publish shift announcements, handle critical issues, and deliver clear passdowns to the next shift. Monitor jobs and missions end to end (start, ETA, completion,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Yield Analysis Module Lead, you will leverage advanced data analytics and deep process knowledge to identify, characterize, and quantify key yield limiters within assigned fab modules. You will lead rigorous investigative efforts to determine root causes of yield excursions, develop and publish actionable yield paretos, and translate complex data into clear technical direction for improvement. Working closely with the YA PTO team, Process Integration, and Process Engineering, you will provide accurate, data-driven guidance to the fab, influence corrective action strategies, and drive sustainable yield improvements. This role offers direct ownership of yield performance and a critical opportunity to impact continuous improvement across the manufacturing line. Lead and maintain an effective training and development program, providing coaching and mentorship to elevate team proficiency and support growth of direct reports. Proficient in Module based Data Analysis, Part Type Ownership Analysis and new part setup activities Track probe yield performance and trends to identify, characterize, and explain gaps between target and actual yields. Perform advanced data analysis to quantify yield issues and generate accurate yield paretos that guide fab priorities and improvement efforts. Apply statistical and data‑mining techniques to identify root causes and uncover opportunities for sustainable yield improvement. Collaborate closely with PI, Probe, PE, EFA, and PFA tea

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We develop advanced memory technologies that transform how the world uses information to enrich life for all. As a Design Engineer, you will craft and optimize digital, analog, and memory circuits while collaborating with global design and verification teams. You will build solutions that improve quality, reliability, manufacturability, and product performance while continuing to learn and innovate in a global engineering environment! Responsibilities Design, develop, and optimize memory, logic, and analog circuits for new memory products. Perform circuit validation, parasitic modeling, reticle experiments, and tape-out revisions to drive performance and manufacturing efficiency . Lead layout activities including floorplanning, placement, routing, verification, modeling, and simulation using industry-standard tools. Collaborate across Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to solve technical challenges and support successful product execution. Drive innovation in future memory technologies while building design quality and standardization across global engineering teams. Minimum Qualifications Bachelor’s degree or equivalent experience in Electrical Engineering, Electronic Engineering, or a related field, with 10+ years of relevant industry experience; or a master’s degree with 7+ years; or a Ph.D. with 5+ years of relevant industry experienc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but are not limited to · Responsible for the architecture, design, implementation, and validation of analog and mixed-signal circuits used in NAND Flash across the complete design lifecycle. · Design and develop circuits such as charge pumps, amplifiers, voltage regulators, data converters (ADC/DAC), bandgap references, sensor interfaces, and power-management blocks. · Translate system-level requirements into detailed circuit specifications, architectures, schematics, verification plans, and clear design documentation. · Perform transistor-level design and optimization to meet performance, power, area, noise, and reliability targets. · Conduct DC, AC, transient, noise, Monte Carlo, and corner simulations to verify functionality and robustness across process, voltage, and temperature variations. · Validate block- and chip-level design performance using standard industry simulators, including evaluation of parasitic effects and integration quality. · Participate in cross-functional evaluation of key NAND features and collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, and other partner teams. · Analyze design and silicon issues, drive root-cause analysis, and implement robust corrective actions. · Coordinate technical activities for a small team when required, including design reviews, execution tracking, and knowledge sharing. · Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design and implement physical layouts for advanced digital, analog, and mixed-signal circuits used in the development of memory products. Responsible for translating schematics into high quality, manufacturable layouts that meet process rules, performance targets, and schedule commitments, while collaborating closely with cross functional engineering teams. Create physical layouts of transistors, resistors, capacitors, and interconnect structures for digital, analog, and mixed-signal circuits. Perform block-level floor planning, including layout area estimation and optimization. Develop IC top-level floorplans and provide accurate total die area estimates. Execute routing, power bus design, and creation of robust PDN (Power Domain Network) solutions to ensure optimal electrical performance, reliability, and scalability. Ensure layouts comply with foundry process design rules and verify layout-versus-schematic (LVS) and design rule checks (DRC). Apply recommended layout, verification techniques, tools, and design flows to deliver high-quality designs on schedule. Work closely with analog/mixed-signal and digital design engineers to ensure proper layout implementation, including critical matching and symmetry requirements. Collaborate with Design Engineering, Product Engineering, Process Integration, Probe, and Assembly teams to proactively optimize designs for manufacturability, cost, quality, reliability, and time-to-market. Create and maintain layout-related documentation and actively participate in layout and design reviews. Support continuous improvement of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to

Work Flexibility: Field-based As an Endoscopy OnSite Specialist, you’ll play a critical role in supporting surgical teams by managing the transportation, reprocessing and high‑level disinfection (HLD) of flexible endoscopes and TEE probes in alignment with hospital policy and ANSI/AAMI standards, helping ensure equipment, processes and workflows run smoothly to drive exceptional patient care. *Love having your mornings free? This role offers a consistent Monday-Friday schedule from 2:00 PM to 10:30 PM, giving you time during the day for appointments, errands, family time, or whatever matters most to you. Plus, you'll earn an additional $1/hour shift premium. What You Will Do Transport flexible scopes and probes safely between procedural areas and reprocessing sites, take the lead on leak testing, manual cleaning and automated or manual HLD, and ensure every processed scope and probe is promptly returned to its designated storage location to keep teams moving and patient care flowing. Maintain communication with clinical departments regarding instrument availability. Validate and document all HLD cycles and labeling while maintaining accurate, detailed records, including procedure information, equipment usage, monthly performance metrics, and account updates, to ensure compliance and continuity of service. Stay current through ongoing training, maintaining a strong working knowledge of Stryker equipment, disposable products, and new technologies while educating clinical staff on product use. Follow all safety, facility, and privacy standards, including patient confidentiality requirements, while maintaining a professional appearance, work ethic, and customer‑focused mindset. Provide flexible coverage, including rotating schedules, on‑call, overnight and weekend shifts, and support for other accounts within

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Architecture Lead in Non-Volatile-Engineering NAND Flash design team at Micron Technology, Inc., your role will cover both pathfinding as well as execution of innovative non-volatile memory designs! You will work with and support the efforts of functional teams to innovate and evaluate key multi-functional features and architecture to ensure best in class memory products in terms of die size, performance, reliability and power. In this role, you are expected to participate in definition of simulation plans, environment setup, pass/fail criteria, and coverage analysis. You will also work closely with design team members during all phases of design from concept to production. In addition, you will actively participate in the design and quality methodology improvements across the department. You will also be responsible for assisting product engineers in post-silicon design validation, root cause analysis, and providing solutions! Responsibilities and Duties include, but not limited to: Innovate and architect innovative memory/storage solution for high performance and energy efficient systems Identify and innovate new concepts and features based on customer requirements Contributing to the development of new NAND Flash Memory by assisting with the overall design, layout, and optimization of Memory/Logic circuits Drive multi-functional team in key features evaluation and recommend decision on architecture Working with Marketing, Probe, Assembly, Test,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The TD Electrical Device Characterization team pushes the boundaries of Micron’s memory technology. We explore device behavior, uncover insights through data, and collaborate across engineering teams to enable next-generation products. We are a hands-on team that values curiosity, precision, technical rigor, and collaboration. In this role, you will drive electrical characterization for advanced memory technologies and partner with device, process, and product teams to turn measurements into actionable technical insights. Your work will help guide technology development and shape the performance and reliability of future NAND, DRAM, and emerging memory products. Responsibilities: Lead electrical characterization for advanced memory devices Develop measurement methods, algorithms, and scalable characterization standards Automate data pipelines and analysis using Python, JSL, C/C&#43;&#43;, and dashboard tools Architect test setups and manage wafer probe and ATE test flows Investigate device behavior, identify root causes, and communicate technical findings Minimum Qualifications: <span style="color:#6

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Member of Technical Staff (MTS) – 3D NAND Process Integration Job / Role Summary The role drives advanced 3D NAND technology pathfinding and process integration within the Advanced NAND Technology team in Singapore. It leads the translation of device concepts, materials, and process architecture into validated, manufacturable technology solutions. The position coordinates end-to-end development from concept through technology validation, applies data-driven, AI-assisted, and model-based methods to resolve complex scaling challenges, and collaborates across Device, Probe, Test, Design, and Operations to improve performance, yield learning, execution, and future-node roadmap readiness. Main Responsibilities Lead 3D NAND integration, pathfinding, and advanced architecture enablement in support of the technology roadmap. Drive end-to-end technology development from concept through validation, including learning vehicles, chara

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location 990 Bendemeer Road, Singapore 339942 Department Storage Technology and Products Group Product Engineering, Project Title NAND Silicon Design Validation and Automated Data Analysis Project Description The intern will undertake a structured engineering project focused on the silicon design validation of advanced NAND products. Under the guidance of experienced engineers, the intern will develop an understanding of NAND operations, Verilog simulation, validation planning, laboratory measurement techniques, and silicon validation data analysis. The intern will gain practical exposure to testers, oscilloscopes, probe stations, scripting tools, and approved in-house engineering software. The project will also provide opportunities to explore Artificial Intelligence and Machine Learning-enabled workflows for validation data collection, report generation, and anomaly detection. The intern’s activities will be limited to the assigned project and conducted with appropriate supervision. Objective of the Project Develop an understanding of NAND operations and silicon design validation methodologies. Apply circuit and feature knowledge to develop a structured validation plan. Collect an

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location F10N, 1 North Coast Drive, Singapore 757432 Department Non-Volatile Memory Test Engineering Project Title AI-Driven Test Engineering Automation and Analytics for NAND Products Project Description As an Intern Test Solutions Engineer in Non-Volatile Memory Test Engineering, you will work on advanced semiconductor test engineering projects focused on NAND memory product development, manufacturing test optimization, and Artificial Intelligence-enabled engineering automation. The project provides hands-on exposure to wafer probe, burn-in, and assembly test solutions used in high-volume semiconductor manufacturing environments. You will collaborate with experienced test engineers and cross-functional teams to develop analytical and automation solutions that improve test quality, engineering productivity, cost efficiency, and decision-making. Through this project, you will apply data analytics, machine learning, scripting, and software development techniques to real engineering challenges while developing practical knowledge of semiconductor memory testing. Objective of the Project Develop data analytics and Artificial Intelligence-enabled solutions for NAND test engineer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location F10A Singapore, 1 North Coast Avenue Singapore 757432 Department High Bandwidth Memory Product and Systems Engineering, Industrial Engineering Management Project Title AI-Enabled High Bandwidth Memory Sample Planning and Workflow Optimization Project Description As an intern in the High Bandwidth Memory Product and Systems Engineering Industrial Engineering team, you will participate in a structured project to improve the visibility and planning of High Bandwidth Memory sample workflows through data analytics, dashboard development, and Artificial Intelligence. The project focuses on mapping the end-to-end sample workflow from Die Bank through probe, test, shipment, and the Reliability Lab. The intern will develop an AI-Enabled solution to predict sample arrival and reliability start dates, forecast burn-in resource demand, automate selected notifications, and provide operational insights through interactive dashboards. The internship provides hands-on exposure to semiconductor sample logistics, process documentation, predictive analytics, business intelligence, and workflow optimization. The intern will collaborate with engineering, planning, operations, and information techn

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a HIG PSE IE Senior Technician , you will support HBM IQP Reliability, Device Reliability, Package Reliability, Wafer Reliability, and product debug activities . The role includes reliability testing, failure analysis, laboratory operations, inventory and logistics management, audits, safety compliance, and continuous improvement initiatives. You will leverage Artificial Intelligence (AI) and AI-assisted tools to improve IQP reliability run rate management, enhance debug capabilities, support wafer-level reliability testing, and drive automation and digital transformation within the lab environment. Key Responsibilities Support Device Reliability, Package Reliability, and Wafer Reliability execution. Monitor and manage IQP reliability run rates, sample flow, and hardware readiness. Perform first-pass failure analysis and product debugging using probe stations and other debug tools. Utilize AI-assisted tools to improve debugging efficiency, root cause investigation, and operational planning. Support automation projects, data analysis, dashboard reporting, and process improvements. Manage procurement, inventory, logistics, and laboratory readiness activities. Support audits, document control, ESD