Probe Application Integration Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The TSE Technician – HBM Probe supports Test Solutions Engineering (TSE) activities for High Bandwidth Memory (HBM) products at wafer probe. The role executes operational, data, and system‑level tasks that enable efficient HBM probe evaluations, production releases, and yield/debug activities , working closely with TSE engineers across NPI and high‑volume manufacturing phases. This position is critical in supporting fast‑paced HBM development cycles where tight execution, data discipline, and cross‑functional coordination are essential. Key Responsibilities Support HBM probe activities by executing requests from TSE engineers, including: Evaluation and production lot assignment, tracking, and coordination Lot handling, status monitoring, and execution follow‑up Attribute tagging, traveler setup, and hold / release execution Support experiments and investigations related to: Yield improvement Test time optimization Test errors and probe‑related issues Perform data mining and generate reports with basic analysis to support: Engineering debug and root‑cause investigations NPI learning cycles and ramp readiness Production

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality Driving innovation into the future Memory generations within a dynamic work environment Demonstrate openness to leveraging AI‑based tools and automation to improve design efficiency, accelerate analysis, and explore innovative solutions across the design and verification workflow. Minimum Qualifications Bachelor’s degree in electrical or computer engineering with 12-15 years of experience with DDR5, LPDDR5, LPDDR6, or HBM3 or in any other memory related field. Preferred Qualifications Strong communication and teamwork skills.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality Driving innovation into the future Memory generations within a dynamic work environment About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Site Inventory Control (SIC) team is at the forefront of our ambitious expansion efforts. SIC plays a pivotal role in connecting wafer starts, inventory strategy, cycle time management, output delivery, and factory execution. As a Senior Engineer for Fab 4 HVM SIC, you will be the operational hub, driving alignment between Technology Development (TD), High Volume Manufacturing (HVM), Probe, Supply Chain, Planning, and Engineering organizations. This outstanding opportunity allows you to lead the charge in optimizing inventory and cycle time performance while ensuring flawless factory execution! We are looking for individuals who thrive on collaboration and tackling complex operational challenges. You'll have the chance to bring to bear data to drive decisions and implement AI-enabled solutions to improve speed, accuracy, and decision-making. Responsibilities: Lead multi-functional initiatives for wafer starts, inventory, cycle time, and output performance to support business commitments Develop and improve inventory control methodologies, business processes, and operational metrics and recommend corrective actions Develop and implement inventory, priority, and capacity strategies for New Product Introduction (NPI) programs Foster coordination between Technology Development, High Volume Manufacturing, Supply Chain, Planning, and Engineering teams to optimize inventory positions and factory flow Identify and mitigate constraints, risks, and op

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a Mechanical Engineer for a senior individual-contributor role leading printed circuit board assembly (PCBA) test fixtures and infrastructure for advanced robotic systems. You will independently turn evolving requirements into working fixtures, make technical tradeoffs, and own delivery from concept and detailed design through fabrication, validation, deployment, and reliable operation. This role combines development-lab work with deployment at contract manufacturers. You will build precision mechanical systems for board programming, functional test, and characterization, including board nests, probe plates, connector interfaces, alignment features, clamps, enclosures, and thermal interfaces. You will partner with electrical, firmware, software, manufacturing, and reliability teams to make fixtures repeatable, protective of delicate assemblies, and maintainable as board designs evolve. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. Travel to contract-manufacturer sites is part of the role, with timing based on build and deployment needs. In this role, you will: Own the mechanical architecture of PCBA test stations, including frames, board nests, datum schemes, access, guarding, ergonomics, and serviceability. Design probe and bed-of-nails fixtures, connector-mating mechanisms, board supports, clamps, and interchangeable tooling for programming, functional test, and characterization. Use first-principles analysis and simulation to assess stiffness, probe and insertion forces, board def

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. Develop efficient and innovative solutions of production test flows through test algo optimization. Design test plans for new tests and test algorithms for DRAM, which cover test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Develop test programs for products using primarily C++ coding and Python on Automated Test Equipment (ATE) in the given area followed by test program release to manufacturing areas. Drive innovation and improvement through optimizing test programs by applying more efficient testing methods to reduce product test times and manufacturing costs. Demonstrate a thorough understanding of the device/part as it applies to device/part testing. Automate test processes by writing software to improve work efficiency. Develop tools to help provide better analysis and insight of the terabytes of probe data. Develop new Design for Test (DFT), Design For Manufacturability (DFM), and Design For Reliability (DFR) capabilities. Independently debug and identify root causes of test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and justification of program validation and its release to ensure program quality and data integrity. Evaluate and verify yields/quality with global teams to ensure shipping

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Boise Expansion Team is helping build the future of semiconductor manufacturing as Micron expands its leading-edge memory production in Boise, Idaho. We are a collaborative organization focused on innovation, operational excellence, and continuous improvement. Join a team where your work will directly influence product quality, manufacturing performance, and the next generation of technology. As a Yield Analysis Engineer, you will play a key role in improving fab yield through advanced data analysis, defect characterization, and root cause investigation. You will work closely with Process Integration, Process Engineering, and Failure Analysis teams to identify yield limiters, drive corrective actions, and deliver sustainable yield improvements. This role offers the opportunity to combine semiconductor expertise, analytics, and AI-enabled tools to solve complex manufacturing challenges. Responsibilities: Monitor probe yields and trends to identify yield excursions, characterize yield loss, and explain gaps between target and actual performance Perform advanced data analysis and develop yield paretos to prioritize issues and guide factory yield-improvement efforts Apply statistical methods and data-mining techniques to identify root causes and uncover opportunities for process improvement Partner with Failure Analysis, Process Integration, and Process Engineering teams to correlate electrical, physical, and manufacturing data and drive issue resolution Develo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the groundbreaking of memory innovation, partnering across design, integration, modeling, and characterization to define the next generation of memory solutions. We thrive on solving sophisticated technical challenges and turning breakthrough concepts into scalable technologies that shape Micron’s future. As a Pathfinding Device Integration Engineer, you will help drive early-stage technology development by connecting device physics, materials science, and process integration. In this role, you will evaluate emerging device concepts, develop experimental strategies, and generate data-driven insights that influence future technology decisions. Your work will play a key role in advancing device scaling, performance, and manufacturability across Micron’s long-term roadmap. Responsibilities: Evaluate novel device concepts, material systems, and integration schemes to enable future technology scaling and performance improvements Lead process integration efforts by aligning materials and process flows into actionable technology solutions Design and implement experiments in the R&D fab to optimize device performance and manufacturability Analyze inline, parametric, and probe data to identify operating mechanisms, variability drivers, and process opportunities Collaborate with modeling, characterization, reliability, and device teams to as

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities of your team will include, but are not limited to: 1. Contributing to the development of new DRAM, emerging memory products and IP’s by enabling the overall design, layout, and optimization of Memory/Logic/Analog circuits 2. Supporting design validation & verification, reticle experiments and required tape-out revisions 3. Performing verification processes with modeling and simulation using industry standard simulators 4. Contributing to cross group communication to work towards standardization and group success 5. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure proper manufacturability of product 6. Proactively solicit inputs from Standards, CAD, modeling, Technology Development groups to ensure the design quality and reliability 7. Driving innovation into the future Memory generations within a dynamic work environ

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Design Engineer in the NVE Design Engineering Core group at Micron Technology, Inc., you will contribute to the development of memory products that are best-in-class, using your specialized knowledge and Micron proprietary methods of designing and analyzing core and mixed circuits used in the development of memory products! What’s Encouraged Daily: Design, simulate, optimize, and floor‑plan NAND circuit blocks. Evaluate design feasibility and analyze circuit functionality across use cases. Implement analog and mixed‑signal circuit designs that meet performance and reliability specifications. Validate design performance at block‑ and chip‑level using industry‑standard simulation tools. Collaborate with multi-functional teams to analyze and reduce NAND power consumption. Build and maintain Python‑based AI utilities that collaborate with EDA tools to accelerate development workflows (e.g., environment setup, corner execution, regressions, automated documentation, predictive build/layout). Review existing user documentation and generate new build collateral. Collaborate with groups such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to ensure optimized manufacturability, cost, reliability, and time‑to‑market. Minimum Qualifications: MS/PhD or equivalent experience preferred, BS in electrical engineering required. 2&#43; years of NAND design relevant proven experience required.<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the groundbreaking of memory innovation, partnering across design, integration, modeling, and characterization to define the next generation of memory solutions. We thrive on solving complex technical challenges and turning breakthrough concepts into scalable technologies that shape Micron’s future. As a Pathfinding Device Integration Engineer, you will help drive early-stage technology development by connecting device physics, materials science, and process integration. In this role, you will evaluate emerging device concepts, develop experimental strategies, and generate data-driven insights that influence future technology decisions. Your work will play a key role in advancing device scaling, performance, and manufacturability across Micron’s long-term roadmap. Responsibilities: Evaluate novel device concepts, material systems, and integration schemes to enable future technology scaling and performance improvements Lead process integration efforts by aligning materials and process flows into actionable technology solutions Design and implement experiments in the R&D fab to optimize device performance and manufacturability Analyze inline, parametric, and probe data to identify operating mechanisms, variability drivers, and process opportunities Collaborate with modeling, characterization, reliability, and device teams to assess t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: You must be enrolled in an AAS/Certificate Program in Mechatronics, Robotics, Engineering Technology, or related field of study program! Micron Technology Virginia is looking for enthusiastic interns to join our state-of-the-art research and development fabrication facility. As one of the most advanced fabs globally, we specialize in various process areas including Wet Etch, Dry Etch, Diffusion, Photolithography, Metrology, RDA, PCVD, CMP, Implantation, and Probe. As a Fab Equipment Maintenance Technician Intern, you will gain a basic knowledge of the semiconductor fabrication process. Interns will be exposed to new technology and the equipment we use in the clean room environment to manufacture the world’s leading memory solutions! Interns receive on-the-job training that includes safety and cleanroom protocol, preventative and corrective maintena

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead the architecture, design, integration, and silicon validation of complex analog and mixed-signal circuits for advanced DRAM products, including amplifiers, comparators, references, LDOs, charge pumps, oscillators, DLLs, I/O circuits, and on-chip monitors. Drive development of custom analog and digital IP from concept through tape-out, silicon bring-up, and production. Define architectures and design methodologies to optimize power, performance, area (PPA), reliability, yield, and manufacturability. Lead verification, modeling, parasitic analysis, silicon correlation, and design signoff across PVT and reliability corners. Guide physical implementation, including floorplanning, matching, placement, routing, and reliability-aware layout practices. Collaborate with Product, Process, Test, Probe, Assembly, and Manufacturing teams to ensure successful product qualification and high-volume production. Drive design quality, standardization, and continuous improvement through advanced CAD, modeling, automation, and verification methodologies. Mentor and develop engineering talent while providing technical leadership across projects and product generations. Drive innovation through reusable IP development, patents, technology roadmaps, and differentiated circuit architectures. Leverage engineering tools powered by AI and agentic AI workflows to improve build efficiency, accelerate verification, optimize PPA, and reduce p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Leveraging AI for design quality

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality. This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations. Responsibilities Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards. Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, tim