Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Project Title F10N/W CMOS Matching and RegE Wafer Edge Exclusion (WEE) Program Role Overview The intern will be responsible for driving yield improvement initiatives through CMOS matching analysis and RegE Wafer Edge Exclusion (WEE) program. The role focuses on identifying inline mismatches, reducing wafer edge-related yield loss, and developing robust analytical solutions to enable sustainable manufacturing performance. Key Responsibilities F10 N/W CMOS Matching Conduct fab to fab offload interaction studies to identify and diagnose inline mismatches between N and W processes that contribute to yield differences. Perform detailed bevel characterization to assess defectivity performance differences and quantify their impact on inline die loss. Analyze cross-module data to establish root cause relationships between process variation and yield performance. RegE Wafer Edge Exclusion (WEE) Program Drive key WEE performance metrics, including 22UE capability and 1H edge coat performance, to maximize overall yield. Identify, troubleshoot, and mitigate

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description & Requirements Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology. Responsibilities Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. Integrate and solve processes as part of multi-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for th

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior Member of Technical Staff in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufac

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Member of Technical Staff in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturabil

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Distinguish Member of Technical Staff in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and m

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process/equipment expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownersh

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JOB DESCRIPTION The Equipment Engineer role at Micron Technology, Inc. offers an outstanding opportunity to join a skilled team. This team focuses on launching, developing, and refining processes to improve product quality and reliability. The position aims to improve process yield, reduce costs, increase efficiency, and manage risks flawlessly. You will troubleshoot manufacturing line challenges and find effective solutions. Your duties include identifying, investigating, and resolving process or equipment issues using failure analysis, FMEA, 8D, or SPC methods. You will coordinate assessments and optimize processes, equipment, and materials by making necessary adjustments at various stages. You will lead activities for yield improvement and cost reduction, coordinate new baseline qualifications, and work closely with suppliers to meet quality, cost, and risk goals. RESPONSIBILITIES Guided by program or project objectives, serve as a subject matter expert within a technical field with latitude for decision making. - Ensure close interaction with equipment suppliers. - Work in close collaboration with process and manufacturing teams. - Drive equipment planning, selection, and configuration with the area process engineers. - Advanced troubleshooting of tool issues; solve complex problems and seek mentorship for issues of a highly complex nature. - Ensure continuous knowledge exchange on best-known methods; translate changes from other factories into improvement actions within

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description The Equipment Engineer role at Micron Technology, Inc. offers an outstanding opportunity to join a skilled team. This team focuses on launching, developing, and refining processes to improve product quality and reliability. The position aims to improve process yield, reduce costs, increase efficiency, and manage risks flawlessly. You will troubleshoot manufacturing line challenges and find effective solutions. Your duties include identifying, investigating, and resolving process or equipment issues using failure analysis, FMEA, 8D, or SPC methods. You will coordinate assessments and optimize processes, equipment, and materials by making necessary adjustments at various stages. You will lead activities for yield improvement and cost reduction, coordinate new baseline qualifications, and work closely with suppliers to meet quality, cost, and risk goals. Responsibilities Guided by program or project objectives, serve as a subject matter expert within a technical field with latitude for decision making. Ensure close interaction with equipment suppliers. Work in close collaboration with process and manufacturing teams. Drive equipment planning, selection, and configuration with the area process engineers. Advanced troubleshooting of tool issues; solve complex problems and seek mentorship for issues of a highly complex nature. Ensure continuous knowledge exchange on best-known methods; translate changes from other factories into improvement actions with

Process integration and Defect Reduction Engineer — New Mexico, Albuquerque. Apply via Workday.

Process Integration and Defect reduction Engineer — New Mexico, Albuquerque. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Conversion Coordinator in Fab 4, you will support Process Integration Engineering by enabling accurate, timely, and coordinated process changes and conversions. You will partner closely with PI Engineers and work cross‑functionally with Change Management, Traveler Control, Manufacturing, Process Engineering, and PI Technicians, as well as Operations, IT, Planning, and Inventory as needed. In this role, you will manage multiple system setup requests that enable automated lot processing, ensuring changes are implemented correctly and in alignment with established BKMs. You will also lead and support New Part Request (NPR) startups and help maintain and troubleshoot critical process control systems. The PICC team’s mission is to deliver on‑time, high‑quality Conversions, Traveler Revisions, and NPRs while minimizing manufacturing risk. This position provides hands‑on exposure to conversion management, project execution, and a wide range of Fab systems and cross‑functional team collaboration, making this role an excellent foundation for continued growth within Process Integration and manufacturing operations. Responsibilities: Submit and verify changes to setup in GeRM, Sigma, SPACE, Travelers, Queue Time, and LMS systems via GCPWeb. Implement, and make sure the use of worldwide standards for all of the responsibilities listed above. Maintain current parts, but also introduce new parts (NPR), and adher