Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for designing and analyzing digital and analog circuits used in the development of memory products. Engage in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. Collaborate with various internal design and verification teams all over the world and support the efforts of groups, including Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsible for power delivery network evaluation and optimization of DRAM designs, as well as design and optimization block level power generators. Utilize both analog and digital CMOS design skills to work on the analog circuits. Responsible for working with Product Engineering to verify silicon performance vs simulation performance of circuits you design. Work with Process integration and transistor modeling personnel in designing the circuits to be used on Micron's next groundbreaking process node. Review product requirements and logic diagrams for device definition. Responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor devices and components. Employer will accept a Bachelor's degree in Computer Engineering, Electrical Engineering, Electronics Engineering, or related field, followed by fi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE + 10 years or BSEE + 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where breakthrough patterning technologies become manufacturing-ready solutions. Our team is shaping the future of memory by evaluating and enabling next-generation lithography technologies, including EUV and High NA EUV. We work closely with technology development, manufacturing, equipment suppliers, and industry partners to drive innovation and deliver scalable solutions for future memory products. As a Lithography Pathfinding Process Development Engineer, you will help define how advanced patterning technologies support Micron’s long-term roadmap. You will lead pathfinding activities, evaluate emerging lithography solutions, and develop implementation strategies that influence future technology decisions. This role is part of Micron’s Technical Leadership Program (TLP), offering the opportunity to grow as a technical leader, mentor others, and drive industry-changing innovation. Responsibilities: Define and lead pathfinding activities for advanced patterning technologies, including EUV and High NA EUV, and identify roadmap applications where they provide value Develop and optimize EUV lithography modules within Technology Development, partnering with process integration and adjacent process teams to meet manufacturing requirements Collaborate with defect inspection teams and mask suppliers to establish inspection and quality strategies for EUV masks Partner with manufacturing sites to align equipment, materials, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE + 10 years or BSEE + 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . As a team member of technology development reliability group, you will be working with DRAM device/process development team and circuit design team. You will be responsible for analyzing reliability performance of hot carrier, bias temperature instability, electromigration etc. for each cell transistor, high performance CMOS and advanced interconnect. Also, you will be responsible for reliability model building and the consultation from device development team and circuit design team. The reliability is one of the important pillar for device scaling and state of the art technology development. Its work is based on understanding the semiconductor device physics, DRAM architecture knowledge, DRAM process integration knowledge. For the new reliability findings during the technology development phase, to point in the right direction is required. Responsibilities and Tasks: Develop and implement test methodologies to evaluate wafer-level & circuit-level reliability behavior and performance. Analyze results and create reports to deliver decision-ready, actionable recommendations for guiding technology development. Collaborate with Process Integration and characterization teams to correlate reliability signature with process conversions and parametric test data. Integrate other data sources (inline metro, param,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a S MTS ( Seni o r Member of Technical Staff) , you will be a part of revolutionary Next Generation NAND research & development Dry Etch team driving Advanced NAND and dry etch technology forward . The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND . A SMT S Dry Etch Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced dry etch processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP . You will work on state of the art <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal/Member of Technical Staff (MTS) IO/Clock Design Engeer to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Design Engineering Group (DEG) is where bold ideas become real technology. We push the limits of memory and storage innovation, and we thrive in a collaborative environment where engineers learn, build, and solve challenges together. We are driven by curiosity, creativity, and the pursuit of better solutions every day! As a Design Engineer, you will help shape the next generation of Micron’s memory products. You’ll work closely with global design, verification, and product teams to bring innovative circuit designs from concept to silicon. Your work will directly influence product performance, quality, and reliability—and contribute to advancements that define the semiconductor industry. Responsibilities: Design, optimize, and verify block‑level circuits for DRAM projects Compare silicon performance with simulation results and support correlation activities Collaborate with process integration and modeling teams on new process node development Partner with global design groups and provide layout guidance through post‑layout simulation Minimum Qualifications: Bachelor’s degree in Electrical Engineering with 2&#43; years of semiconductor design or manufacturing experience Demonstrated experience in mixed-signal, digital, or analog IC design Experience designing regulators, charge pumps, oscillators, current references, bandgaps, or comparators Proficiency with SPICE and Verilog modeling and simulation Experience working wi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Technology Development (TD) department at Micron Technology leads innovation. It drives the advancement of data retention and storage systems that change how the world uses information. The team develops next-generation semiconductor processes and technologies and works closely with global R&D and manufacturing teams to bring innovative solutions from concept to production. Join a collaborative environment where you will help shape the future of semiconductor technology while working alongside experienced engineers and technical leaders. Position Overview As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), your role includes developing advanced packaging approaches and linking technologies. You will contribute to their integration in future semiconductor products. Working in a highly collaborative R&D environment, you will support process development, technology evaluation, and qualification activities while gaining hands-on experience with modern semiconductor technologies. This role provides an excellent opportunity for engineers who are passionate about innovation, problem-solving, and continuous learning. Responsibilities Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products. Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance. Participate in e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products! We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions! In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will own physical implementation and top-level integration of large digital designs in our NAND products. Drive blocks and full-chip partitions through synthesis handoff, floorplan, place-and-route, and timing/DRC/LVS closure. Perform hierarchical design planning and top-level assembly. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Leading all aspects of and managing the layout process including floor-planning, placement, and routing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the groundbreaking of memory innovation, partnering across design, integration, modeling, and characterization to define the next generation of memory solutions. We thrive on solving complex technical challenges and turning breakthrough concepts into scalable technologies that shape Micron’s future. As a Pathfinding Device Integration Engineer, you will help drive early-stage technology development by connecting device physics, materials science, and process integration. In this role, you will evaluate emerging device concepts, develop experimental strategies, and generate data-driven insights that influence future technology decisions. Your work will play a key role in advancing device scaling, performance, and manufacturability across Micron’s long-term roadmap. Responsibilities: Evaluate novel device concepts, material systems, and integration schemes to enable future technology scaling and performance improvements Lead process integration efforts by aligning materials and process flows into actionable technology solutions Design and implement experiments in the R&D fab to optimize device performance and manufacturability Analyze inline, parametric, and probe data to identify operating mechanisms, variability drivers, and process opportunities Collaborate with modeling, characterization, reliability, and device teams to assess t

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary The MTS advances thin film process development for NAND cell film by leading project initiatives, executing complex experiments, conducting material characterization, and supporting process integration/fixing, while promoting manufacturability and continuous improvement. Operates as a key technical contributor delivering measurable results at department/site level; mentors early-career staff aligned to TLP entry expectations; strengthens SOP/knowledge systems. Main Responsibilities Lead project-level initiatives for cell film process development; execute complex experiments and integration support under senior guidance. Maintain thorough records; prepare comprehensive technical reports; participate in multi-functional problem solving; drive continuous improvement and optimization. </sp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary The MTS is a senior technical contributor who drives wet process development through complex experimentation, material/chemical characterization, and integration fixing, while helping establish process technology roadmaps and delivering silicon ‑ based solutions for future memory needs. Acts as a key contributor expected to deliver measurable results and mentor early ‑ career engineers aligned to technical leadership expectations . Main Responsibilities Lead project ‑ level initiatives focused on development of wet processes. Carry out complex experiments and support process integration under guidance o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron's Boise R&D site, the DRAM Technology Development organization drives innovation in next-generation memory solutions. The team develops advanced DRAM cell architectures, access devices, materials systems, and integration technologies that enable future scaling, improved performance, enhanced reliability, and manufacturing readiness. Engineers work across device, materials, process integration, modeling, design, and product engineering teams to bring groundbreaking memory technologies from concept to production. As an intern in the Advanced DRAM Device & Cell Technology team, you will contribute to the development and characterization of future DRAM cell and access device technologies through experimental studies, data analysis, and collaboration with multidisciplinary engineering teams. This position combines semiconductor device physics, materials engineering, silicon experimentation, electrical characterization, and data-driven decision making to improve cell performance, density, retention, reliability, and manufacturability. The successful candidate will collaborate with multi-functional teams to evaluate novel materials, device architectures, and integration schemes supporting future memory technology development. Responsibilities Support the evaluation of DRAM access devices, capacitors, and cell stack elements through characterization, data analysis, and assessment of new device architectures, materials systems, and integration schemes. Design and implement