Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Probe Integration Engineer at Micron Technology, Inc. within Test Solutions Engineering Department Key Equipment Group (KEG); you will have responsibilities for developing, deploying, and supporting Wafer Probe Equipment and Processes used in our manufacturing global locations with an emphasis on HBM (High Bandwidth Memory). The successful candidate will spend much of their time working on company-wide initiatives promoting greater quality, efficiency, and standardization of Probe operations together with enabling Probe roadmap technologies. A typical day in this position allows candidates to be creative and innovative in the deployment of first-of-a-kind solutions that solve complex problems. Responsibilities and Tasks: Responsibilities for this role will include, but are not limited to, the following: Deploy first-of-a-kind equipment and process capabilities through evaluations of Wafer Probers, Testers & Probe Cards Collaborate with global teams to establish and implement the best-known method probe processes globally. Engage equipment suppliers & vendors to address issues of quality, performance, and change management. Establish manufacturing metrics to drive continuous improvement of equip

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a HIG IE Engineer, your responsibilities encompass tactical execution and planning to support tactical pillar, CAPEX and OCAP budget management, material planning for wafer probe C1-C4 to Micron IQP, build Business Processes to enable wafer level activities. Also to work as a window for wafer PRIME, pWLR and DOE material acquisition, drive sample deliveries to execution for Wafer Reliability and IQP Reliability. You are also expected to understand procurement of items, inventory logistic management, audits, continual improvements, 6S housekeeping, and project management. It is a must for a HIG PSE IE Engineer to be familiar with Claude Code, AI apps and leveraging AI for work productivity and quality improvements. Responsibilities include, but are not limited to: Able to utilize Claude Code and AI apps in regular work. Proven creation of Claude Code apps (Advantageous with more than one creation) Have clear knowledge of HBM wafer probe operations starting from Assembly to post C4. Have clear knowledge of wafer material acquisition from FE processes. Liaison with NPO, SIC, NPI teams from F15 and OMT. Have knowledge in MES/MAM attributes, tagging of lots from AAA, DAA and NAA lots. Familiar with CBG setting to ensure engineering wafers are not mixed with MFG wafers. Able to track E2E DOEs requests from start to CRD/MAD. Work closely with requestors on process needs. Able to work as a team with fellow members in a safe, cohesive, and collabo

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. Contribute to a culture of continuous improvement by identifying , testing and sharing AI-enablement enhancement within one scope of work. Driving New Product Introduction process through NPI Phase Gate Review. Coordinating new product start- up to achieve first pass qualification. Understand new product start-up datelines, product applications and customer requirements; and communicate this information to the new product start-up team Working with process / equipment / manufacturing / planning area owners to bring new product and packag

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As a Process Control Systems Engineer, you will integrate and monitor key performance indicators across semiconductor manufacturing Defense Line systems, including SPC, FDC, R2R, and other process control applications. You will identify KPI gaps, coordinate CAPA follow-up, track actions through closure, and provide management-level performance visibility. You will also develop dashboards, retrieve and analyze data using SQL and Snowflake, support data digitalization, and participate in AI-enabled manufacturing and analytics projects. This role requires strong analytical thinking, cross-functional coordination, learning agility, and an interest in semiconductor process control and smart manufacturing. Key Responsibilities Integrate and monitor KPIs across different Defense Line and PCS systems. Identify performance gaps and follow up on corrective and preventive actions. Track action owners, due dates, risks, effectiveness verification, and closure status. Develop dashboards for KPI, system health, issue, and CAPA monitoring. Retrieve, clean, transform, and analyze data using SQL and Snowflake. Support AI, machine learning, and advanced analytics applications. Coordinate with process, manufacturing, quality, automation, IT, and global PCS teams. Participate in PCS integration, digitalization, and management-assigned projects. Maintain technical documents, governance workflows, and audit evidence. Qualificati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further! This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end to end memory system architectures, to guide long term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron. Responsibilities: Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance. Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach Drive long‑term memory technology packaging strategy and influence industry standards Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. Micron is seeking a Design Infrastructure Engineer to build, enable, and scale characterization infrastructure and deliver generated IP to multiple advanced memory and logic developments. This position includes characterizing both standard and custom cells across various process technologies. These encompass Micron internal nodes as well as external foundries, such as TSMC. The position supports multiple HBM product lines, including HBM DRAM dies, Logic dies (JEDEC and custom variants), and advanced 3D HBM architectures. You will work where circuit build, EDA infrastructure, and silicon validation readiness meet. You will develop robust, scalable, and high-quality characterization flows. These flows directly affect timing closure, power modeling, and product quality for next-generation HBM programs. Responsibilities: Develop and sustain scalable infrastructure for standard cell and custom cell characterization, encompassing timing, power, noise, and signal integrity modeling. Build reusable, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global leader in memory and storage solutions, driving innovation in next-generation DRAM technologies that power artificial intelligence, cloud computing, and advanced computing applications. The Dry Etch Process Development team develops and optimizes advanced plasma etch processes that enable future memory scaling and support groundbreaking semiconductor manufacturing. As a Dry Etch Process Development Engineering Intern, you will gain hands-on experience developing and optimizing semiconductor etch processes in a collaborative research and development environment. Working under the mentorship of experienced engineers, you will contribute to a technical project focused on process development, experimentation, data analysis, and technology innovation. The internship provides broad exposure to semiconductor processing and culminates in a presentation of project results to engineering and leadership teams. Responsibilities Research and develop innovative solutions that support future memory technologies and advanced dry etch process development. Develop, complete, and analyze experiments to optimize dry etch processes and improve product performance. Perform statistical analysis of technology development and pilot manufacturing data to identify trends and drive process improvements. Collaborate with process, equipment, integration, and multi-functional engineering teams to solve complex technical challenges. Apply AI-Enabled analytical tools, Leveraging AI, programming, or automa

Source Code Integration enables Product teams at Datadog to develop features that leverage our customers’ source code. This brings the platform closer to developers, as it helps them relate their telemetry to code to run automated investigations, debug their services with stack traces and profiles, scan their code for security issues, or make proactive fixes, among others. The team owns all the platform services, infrastructure and integrations required to access and synchronize our customer repositories in a secure, reliable and efficient manner. We are looking for a hands-on technical leader to drive the growth of our platform, as Datadog shifts left and becomes more developer-friendly and AI-ready. In this role you will lead the growth of our platform to support an increasing number of high profile features and teams, and work with a team of engineers of varied experience levels to shape our roadmap and deliver impactful solutions at scale. At Datadog, we place value in our office culture - the relationships that it builds, the creativity it brings to the table, and the collaboration of being together. We operate as a hybrid workplace to ensure our employees can create a work-life harmony that best fits them. What You’ll Do: Lead and cultivate a team of engineers of diverse experience levels, including performance management and career development Lead technical and strategical discussions to better understand the challenges and opportunities faced by our team and our stakeholders Own and drive the relationships with product teams and major stakeholders, balancing competing requests with long term investments, and prioritizing impact across the whole platform Run a lightweight process to pace and track what we work on. Support the progressive delivery of high quality work through demos and frequent iteration Stay in touch with your team’s systems, and roll up your sleeves when needed to unblock your team by writing code or troubleshooting issue

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary The Principal Engineer provides technical leadership for Cell Film process development, defining technical direction, fostering innovation, and ensuring successful integration of new processes into manufacturing to enable next-generation NAND device scaling. Defines and implements technical strategy; leads cross-functional teams; owns end-to-end module development with manufacturability/scalability readiness. Resolves complex technical challenges with business impact and drives transfer and ramp readiness into high-volume manufacturing . Main Responsibilities Strategy, Roadmap & Technical Direction Define and implement technical strategy for cell film process development aligned to business and technology objectives . Identify emerging trends/risks/opportunities and recommend future investments/initiatives .

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Job Title Business Process Expert - Travel & Expenses Job Description Job Responsibilities: The Business Process Expert is responsible for ensuring best-in-class Philips’ business capabilities within the Travel & Expenses (T&E) domain, with full accountability for the design, governance, and continuous improvement of the end-to-end travel expense process. This includes expense submission, audit, settlement, and compliance with the global travel policy and internal control framework. The role requires deep expertise in SAP Concur and strong understanding of SAP ERP integrations and related upstream/downstream systems, ensuring seamless data flow, system integrity, and compliant execution of T&E processes. The BPE is responsible for designing and maintaining detailed end-to-end process flows, driving standardization, simplification, and harmonization across regions. With a strong continuous improvement and simplification mindset, the role applies industry best practices (e.g., Lean, Six Sigma, Agile) to enhance process efficiency, strengthen controls, and improve employee experience. The BPE actively identifies optimization opportunities, including automation and digitalization within the T&E landscape. The role plays a key part in governance and change management by: Coordinating and aligning with IT development teams on system enhancements and integrations Defining, reviewing, and approving business requirements Ensuring high-quality execution and validation of System Integration Testing (SIT) Maintaining strict attention to detail to ensure compliance with audit and control requirements In addition, the BPE is responsible for enabling operational excellence by training and supporting operational teams, ensuring consistent understanding and execution of T&E processes, policies, and tools. The ro

Zafin is an AI platform company helping regulated institutions modernize how critical work is designed, governed, and delivered. Our technology enables organizations to move faster while maintaining the governance, accountability, and control required in highly regulated environments. Our portfolio includes Zafin AIOS , an agent orchestration platform for governed AI work; the Zafin Banking Platform , which helps banks modernize product, pricing, offers, billing, loyalty, and relationship management; and Zafin IO , an integration platform that connects data, systems, and workflows across complex enterprise environments. Headquartered in Toronto, Canada, Zafin partners with leading financial institutions across North America, Europe, the Middle East, Africa, and Asia-Pacific. As AI transforms the future of financial services, we're building the platforms that help regulated organizations adopt AI responsibly and at scale. What is the Opportunity? As a Product & Pricing Consultant, you will partner with customers to successfully implement Zafin's SaaS solutions by translating business requirements into scalable functional solutions. Acting as a trusted functional advisor, you will work closely with customers, Product Management, Engineering, and implementation teams to deliver successful business outcomes while promoting industry best practices What will you do? Lead business discovery sessions and requirements workshops with customer stakeholders. Elicit, analyze, and document business and functional requirements. Perform fit-gap analysis and recommend scalable solution approaches aligned with Zafin capabilities. Prepare key implementation deliverables including business requirements, functional specifications, user stories, process flows, and test documentation. Configure and validate Zafin solutions based on approved functional designs. Collaborate with Product Management, Engineering, and cross-functiona

The Opportunity Adobe seeks a Head of External Reporting and Technical Accounting, ESG Controller to join our finance leadership team. This highly visible, critical role will report to the Senior Director, Global Accounting, Reporting and Revenue Assurance and lead our External Reporting & Equity Accounting, Technical Accounting, and ESG Regulatory Reporting teams. This role will also lead the full Mergers & Acquisitions (“M&A”) cycle for accounting, from advising on deal structure and performing due diligence to overseeing the accounting valuation process and advising the record-to-report finance integration workstream. Key to success will be your ability to partner and influence cross functionally with our Revenue, Tax, Treasury, FP&A, Legal, Investor Relations, Corporate Social Responsibility and Employee Experience teams. What you'll Do Lead the external reporting team on drafting and filing all financial documents and SEC filings Coordinate with Investor Relations, Corporate Legal and senior leaders to review our earnings documents, including drafting the most complex or unique matters in a simple, easy, and understandable way Serve as trusted technical accounting advisor for complex transactions under existing or future rules, including overseeing policy updates for FASB pronouncements and SEC rules Assess the impact of proposed accounting pronouncements and standards to ensure compliance with SEC and GAAP reporting requirements and provide educational trainings to impacted stakeholders Own the global consolidated audit process to resolve issues and avoid delays Advise corporate development and legal teams on the accounting treatment for potential deals and strategic investments (i.e., asset acquisitions, business combinations, and VIE/VOE considerations) Cross-functionally manage the end-to-end financial due diligence for M&A transactions <l

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a HIG PSE IE Senior Technician , you will support HBM IQP Reliability, Device Reliability, Package Reliability, Wafer Reliability, and product debug activities . The role includes reliability testing, failure analysis, laboratory operations, inventory and logistics management, audits, safety compliance, and continuous improvement initiatives. You will leverage Artificial Intelligence (AI) and AI-assisted tools to improve IQP reliability run rate management, enhance debug capabilities, support wafer-level reliability testing, and drive automation and digital transformation within the lab environment. Key Responsibilities Support Device Reliability, Package Reliability, and Wafer Reliability execution. Monitor and manage IQP reliability run rates, sample flow, and hardware readiness. Perform first-pass failure analysis and product debugging using probe stations and other debug tools. Utilize AI-assisted tools to improve debugging efficiency, root cause investigation, and operational planning. Support automation projects, data analysis, dashboard reporting, and process improvements. Manage procurement, inventory, logistics, and laboratory readiness activities. Support audits, document control, ESD