Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Director, OMT PEE PH at Micron, you will have the outstanding opportunity to drive innovation and excellence in our engineering processes. This pivotal role involves coordinating the performance of critical metrics to achieve world-class results. Your leadership will be essential in managing new technology startups, transfers, and providing technical support to achieve benchmark performances in safety, yield, continuous improvement, and cost management. Key Responsibilities: Establish and continuously improve critical performance metrics to ensure flawless operations. Coordinate new tech-node equipment installation and release strategy. Implement effective manufacturing technology transfers. Develop and complete risk mitigation plans for pilot line and ramp activities. Drive Tool of Record/Process of Record gap closure to mitigate ramp risks. Manage yield ramp and volume ramp projects, ensuring accurate handling of Time To Mature and Yield, Tool Install Qualification, and Non-Conforming Die issues. Collaborate with R&D, Procurement, and suppliers to resolve manufacturing issues and establish improvement roadmaps. Foster collaboration across various departments including Manufacturing, Process Integration, Quality, Business Units, and external suppliers. Lead teams in adopting AI-enabled ways of working, ensuring responsible and ethical use of AI technologies. Requirements: Proven tr
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Lead the Yield Analysis organization to achieve fab yield and quality goals by establishing strategy, priorities, and execution plans focused on Yield Deviation, Yield Tail reduction, yield ramp acceleration, and long-term yield improvement. Own key yield metrics and communicate performance, risks, and recovery plans to site and executive leadership. Establish and drive KPI-based yield management systems including Yield Loss, Static Yield, Yield Tail, Deviation Loss, Root Cause Identification Rate, Time-to-Source, CAPA Closure Rate, PFA Cycle Time, and Issue Tracker Health. Develop forecasting methodologies, dashboards, and operating mechanisms that drive accountability and predictable yield improvement. Provide technical leadership for Model-Based Problem Solving (MBPS) and Root Cause Analysis (RCA) by coaching engineers to move beyond symptom identification and achieve verified physical root cause. Drive rigorous problem-solving methodologies including hypothesis testing, fault-tree analysis, 5-Why investigations, DOE development, and statistical validation. Lead cross-functional issue resolution teams by partnering with Process Integration, Process Engineering, RDA, Failure Analysis, Quality, and Manufacturing organizations to prioritize yield opportunities, accelerate containment actions, implement CAPAs, establish robust defense lines, and ensure sustainable issue closure. Drive advanced yield analytics and deep probe-data mining capabilities across the organization. Ensure teams effec
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department NAND Product Engineering, Probe Product Engineering Project Title AI-Enabled Wafer Probe Test Optimization and Yield Analytics Project Description The NAND Probe Product Engineering Intern will undertake an engineering project focused on wafer probe testing, silicon characterization, yield analysis, and test optimization. Working under the guidance of experienced Product Engineers, the intern will study how probe test strategies are developed and evaluated across product development and manufacturing phases. The project provides exposure to advanced NAND semiconductor technologies, wafer-level testing, statistical data analysis, yield improvement methodologies, and Artificial Intelligence-enabled engineering workflows. The intern will collaborate with cross-functional teams, including Design, Design for Test, Design Validation, Process Integration, Backend Test, Reliability, and Manufacturing Engineering. Objective of the Project Develop an understanding of wafer probe testing and its role in NAND product development and manufacturing. Evaluate probe test data to identify yield patterns, product behavior, and test optimization opp
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Boise Expansion Team is at the forefront of Micron’s historic growth as we invest in leading-edge semiconductor manufacturing and build the future of memory and storage technology. Our Yield Analysis organization plays a critical role in delivering world-class product quality, accelerating yield ramps, and driving operational excellence. We are looking for collaborative, innovative leaders who are excited to help shape the future of semiconductor manufacturing in Boise. As a Yield Analysis Manager, you will lead a team focused on improving fab yield performance through advanced analytics, structured problem solving, and cross-functional collaboration. You will drive yield improvement strategies, develop engineering talent, and leverage data, automation, and AI-enabled solutions to accelerate issue resolution and strengthen manufacturing performance across the organization. Responsibilities: Lead the Yield Analysis team to achieve fab yield and quality goals through yield deviation management, yield-tail reduction, yield ramp acceleration, and long-term yield improvement Establish and manage yield KPIs, forecasting methods, dashboards, and operating mechanisms that drive accountability and measurable business results Drive technical excellence in Model-Based Problem Solving (MBPS), root cause analysis, statistical validation, and corrective action implementation Partner with Process Integration, Process Engineering, Failure Analysis, Quality, and Manufacturing teams
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As Data Analysis Engineering Intern at Micron, you will learn about the exciting field of semiconductor failure analysis, using state of the art solutions to improve next generation memory solutions. The goal of this internship is to accelerate the cell cycles of learning by developing inline prediction to end of line cell performance using machine learning. We need engineers who are passionate about detecting problems and making changes for the better, and seek out innovative ways in how predict what will happen. We will assign you project to develop critical thinking and problem-solving skills. Your research tasks are designed to optimize and improve predictability of cell performance. Through this project we will provide the opportunity for you to collaborate with others from process integration, process engineering and data science. At the end of the period, we want you to have a deep understanding of the processes, device operation, and measurement strategies used in today’s semiconductor yield analysis department. Responsibilities: Review and analyze experimental data looking for device performance shift Possess a continuous improvement process (CIP) mentality, looking for ways to improve measurement accuracy and make a difference today! Recognize, identify, and raise awareness of process anomalies with the motivation of "who needs to know this now!" Use the data collected inline to drive process improvements Work with new detection tools and inspection strategies to loca
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, the DRAM Design organization develops industry-leading memory solutions that span technology development, advanced circuit design, product engineering, system validation, and manufacturing enablement. Teams collaborate globally to deliver innovative memory products that meet demanding requirements for performance, quality, reliability, and time-to-market. As an Intern DRAM Design Engineer, you will contribute to the design, analysis, verification, and optimization of digital, analog, and mixed-signal circuits used in next-generation memory products. You will work closely with design, verification, product engineering, test, process integration, assembly, and marketing teams to support new product development and manufacturability initiatives. This role also provides opportunities to apply Artificial Intelligence and AI Assisted methodologies to improve design workflows, automation, and design quality. Responsibilities Play a key role in the development of new memory products through circuit build, layout, optimization, and validation of Memory, Logic, and Analog circuits. Support physical design activities including parasitic modeling, floor-planning, placement, routing, reticle experiments, tape-out revisions, and design verification using industry-standard simulation tools. Collaborate with global design, verification, product engineering, test, process integration, assembly, and marketing teams to improve manufacturability, quality, and product performance. Proactiv
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 業務内容 次世代DRAM技術開発におけるプロセスインテグレーション業務を担当いただきます。 将来世代DRAMノード向けプロセス技術の開発および統合 キャパシタモジュールの設計、開発、最適化 複数のプロセスモジュールにまたがるインテグレーション業務 DOE(実験計画法)の設計・実行、およびデータ解析によるプロセス条件の最適化 歩留まりおよび品質に関する課題の特定と解決 プロセス、設計、デバイス、品質部門との連携 応募資格 技術要件 半導体プロセスに関する基礎知識 プロセスインテグレーションまたは関連するエンジニアリング分野の知識 DRAMデバイスおよび構造に関する知識があれば尚可 半導体エンジニアリング分野における10年以上の経験 コミュニケーションスキル 海外チームとの会議に頻繁に参加するため、英語でのコミュニケーション能力 日常業務に必要な日本語コミュニケーション能力 関係部門との協業や調整を行うための対人コミュニケーション能力 求める人物像 高い分析力および問題解決力を有する方 チーム環境において主体的に業務を遂行できる方 技術課題に対して粘り強く取り組み、責任感を持って対応できる方 ============================================ ■ Job Responsibilities In this role, you will be responsible for process integration activities for next-generation DRAM technology development. Your key responsibilities will include: Development and integration of process technologies for Future DRAM nodes Design, development, and optimization of capacitor modules Integration across multiple process modules to ensure consistency and performance Design and execution of experiments (DOE) and data analysis to optimize
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we build the memory and storage that powers everything from massive data centers to the devices people rely on every day. Our design teams carry silicon all the way to systems—developing advanced memory architectures, shaping the products around them, and validating the solutions used across the globe. We take real ownership of the technology we create, and we're always pushing what memory can do! As a Staff Analog Design Engineer, you'll design and analyze the analog and digital circuits at the core of our memory products, directly shaping their performance, cost, and reliability. You'll work alongside Micron's design and verification teams around the world and support Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to build products that optimize manufacturing and keep customers coming back. It's a role where your circuit decisions show up in silicon that ships at scale. Responsibilities: Design, optimize, and verify block-level analog and mixed-signal circuits for DRAM Evaluate new circuit topologies to improve block PPAC Expand verification coverage to strengthen robustness and mass-production yield Partner with global design groups, guide layout through post-layout simulation, and support silicon-to-simulation correlation Apply agentic AI and automation tools to improve design quality and efficiency Minimum Qualifications: Bachelor's degree in Electrical Engineering with 6+ years of semicond
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles and Responsibilities Verification of Analog and mixed signal circuits. Generation of a Full chip mixed signal simulation environment where analog, digital and FW co-exist. Schematic/behavioral model generation of certain blocks to make FC simulation feasible/efficient Device level electrical rule checks – SOA, snapback, sfb etc Static and dynamic simulations to identify the leakage paths SPF extraction and fanout, coupling checks Power cycling simulations – PL and Brown out events Chip level user mode simulations correlating analog subsystems, logic and FW algorithms Design data sheet review and generation of verification plan You will also work and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products to optimize all manufacturing functions and assure the best cost, quality, root-cause analysis, reliability, time-to-market, and customer satisfaction. Requirements Understanding of MOS device physics mainly second order effects Basic knowledge of few analog circuits – CM, BGR, op-amp, regulators, ADC, DAC and charge pumps Familiarity with shell, Perl/python scripts Familiarity with virtuoso, hspice, xa and cosim Familiarity with HDLs – Verilog/SV and Verilog A/AMS Debug enthusiast with system level outlook Ability to grab complex workflows and constant drive to innovate
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Realtime Defect Analysis (RDA) Engineer in APTD, you will learn how to use pioneering defect detection equipment and processes to solve issues and drive continuous improvement. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development (TD). We're seeking an engineer who is passionate about creative problem solving and finding innovative solutions. This position will provide the opportunity for you to collaborate with engineers in process integration, process development, data science, and yield analysis within and outside of TD. Ideal candidates will investigate process anomalies through root-cause analysis, data manipulation, and correlations. You will be expected to support experimentation, data analysis, baseline health metrics, and systematic and random defect improvement. Your ideas will impact the team glo
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. We are currently looking for motivated individuals to join Micron Technology Inc. Central Engineering (CE) - Product Yield Enhancement (PYE) Engineering Team. As CE PYE Failure Analysis (FA) Engineer for Micron Technology, Inc., you will be responsible for providing full fault isolation and failure analysis support for qualifications, customer returns, new device introduction, and test failures. You will become the subject matter expert on fault isolation and physical failure analysis methods. As the CE PYE FA Engineer, you will be responsible for understanding all relevant methodologies to isolate electrical failures by working closely with Product Engineering Teams. You will also have a thorough understanding of the product architecture, process flow, and test sequence to work with Process Integration, Product, Test, and Quality Reliability Assurance Engineering groups ensuring physical defects are root-caused and classified. Job Description: Responsibilities: • Perform sophisticated electrical device characterization to determine electrical fail mechanisms. • Operate fault isolation equipment to accurately narrow down failure defect locations. • Conduct physical failure analysis to identify and classify physical d
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. We are currently looking for motivated individuals to join Micron Technology Inc. Central Engineering (CE) - Product Yield Enhancement (PYE) Engineering Team. As CE PYE Failure Analysis (FA) Engineer for Micron Technology, Inc., you will be responsible for providing full fault isolation and failure analysis support for qualifications, customer returns, new device introduction, and test failures. You will become the subject matter expert on fault isolation and physical failure analysis methods. As the CE PYE FA Engineer, you will be responsible for understanding all relevant methodologies to isolate electrical failures by working closely with Product Engineering Teams. You will also have a thorough understanding of the product architecture, process flow, and test sequence to work with Process Integration, Product, Test, and Quality Reliability Assurance Engineering groups ensuring physical defects are root-caused and classified. Job Description: Responsibilities: • Perform sophisticated electrical device characterization to determine electrical fail mechanisms. • Operate fault isolation equipment to accurately narrow down failure defect locations. • Conduct physical failure analysis to identify and classify physical d
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