Process Integration Senior Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Quality Metro Real-time Defect Analysis (RDA) Engineer, you will be responsible for enabling robust quality monitoring, early detection, and rapid containment of quality risks across advanced packaging and NPI manufacturing environments. You will focus on leveraging RDA platforms, Statistical Process Control/ Fault Detection & Classification (SPC)/ (FDC) systems, automation, and data analytics to prevent escapes, accelerate learning, and improve product and process robustness, particularly during N ew Product Introduction (NPI) , pilot, and early ramp phases. This role acts as a critical bridge between Quality, RDA, Process, Equipment, and NPI teams, ensuring quality requirements are embedded into monitoring strategies and operational execution. You will work closely with Site and Global Quality, Process Integration, Equipment Engineering, and Automation teams to drive quality-focused diagnostics, excursion management, and continuous improvement in a high-change, high-learning environment. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational stan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits. Design, implementation, and improvement of Complex Analog Power Management IPs such as Bandgap reference, Voltage/Current reference, Regulators, Charge-pumps, CMOS Amplifiers, Comparators in advanced semiconductor process nodes for advanced DRAM products. Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions. Being responsible for and managing the layout process including floor-planning, placement, and routing. Performing verification processes with modeling and simulation using industry standard simulators. Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Driving innovation into the future Memory generations within a dynamic work environment. Leveraging AI About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is undergoing a historic expansion with a new fabrication facility in Boise, ID, and we are building a strong remote technical network to accelerate capability, ramp readiness, and line health. We are seeking a Lead Metrology & RDA Applications Engineer to provide technical leadership and operational ownership across metrology and inline optical inspection (RDA) while working remotely from Taiwan in direct support of the Boise fab. In this role, you will lead measurement and inspection strategy, drive tool and recipe readiness, and ensure data quality and process control for high-volume manufacturing (HVM), production ramp, and technology development. You will work hands-on with advanced metrology platforms (e-beam, optical, x-ray, etc.) and RDA optical inspection toolsets (eScan/Brightfield/Darkfield/Macro/SP) to develop robust line monitors, establish statistical controls, detect excursions early, and reduce defectivity. You will partner closely with Process Integration, Manufacturing, Process Development, Equipment Engineering, Yield, and Data/Automation teams across Boise and the global network to standardize best-known methods, enable effective tool matching, and ensure scalable solutions for ramp and long-term sustainment. Key Responsibilities Leadership Provide technical leadership for metrology + RDA strategy, sustainment, and readiness within assigned technology areas. Own end-to-end readiness: recipe maturity, measuremen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where breakthrough patterning technologies become manufacturing-ready solutions. Our team is shaping the future of memory by evaluating and enabling next-generation lithography technologies, including EUV and High NA EUV. We work closely with technology development, manufacturing, equipment suppliers, and industry partners to drive innovation and deliver scalable solutions for future memory products. As a Lithography Pathfinding Process Development Engineer, you will help define how advanced patterning technologies support Micron’s long-term roadmap. You will lead pathfinding activities, evaluate emerging lithography solutions, and develop implementation strategies that influence future technology decisions. This role is part of Micron’s Technical Leadership Program (TLP), offering the opportunity to grow as a technical leader, mentor others, and drive industry-changing innovation. Responsibilities: Define and lead pathfinding activities for advanced patterning technologies, including EUV and High NA EUV, and identify roadmap applications where they provide value Develop and optimize EUV lithography modules within Technology Development, partnering with process integration and adjacent process teams to meet manufacturing requirements Collaborate with defect inspection teams and mask suppliers to establish inspection and quality strategies for EUV masks Partner with manufacturing sites to align equipment, materials, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Leadership & Strategy Lead and manage OCT Photo teams across multiple sites, ensuring alignment with company goals and technology roadmaps. Develop your team, build up, train and enable collaborations across all collaborators. Drive strategic initiatives in scanner and track hardware, process optimization, cost reduction and yield improvement. Build and implement Photo Manufacturing Roadmap, Equipment and Material Strategy for capex optimization in new node enablement and ramp-up. Engage with both internal and external suppliers to strengthen partnership and lead initiatives to achieve and exceed internal customer expectations Lead worldwide efforts to transform VOC (voice of the customer) to enhance Photo team business processes or standards Cross-Functional Collaboration Partner with multiple cross function teams such as global procurement, global quality, central process integration engineering, Technology development, Central Planning and Modeling, Central Layout, SMAI, Corp IT, FECOS, MAE etc teams across central and site-specific organizations to ach

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE + 10 years or BSEE + 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal/Member of Technical Staff (MTS) IO/Clock Design Engeer to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Lead, hire, mentor, and develop a team of Diffusion & Implant engineers, providing regular feedback, career development, and fostering a culture of collaboration, accountability, and technical excellence. Own and drive DF and IMP process module development, including cell development, process characterization, Integration, process margin improvement, and manufacturability for 3D NAND nodes. Drive execution of process development activities aligned with TD roadmap, ensuring timely delivery of robust, scalable, and high-performance solutions. Collaborate closely with Process Integration, Manufacturing Development, Equipment Engineering, and global TD teams to meet integration requirements and technology breakthroughs. Lead transfer of processes to high-volume manufacturing, supporting pilot ramp, yield improvement, and long-term process stability. Drive DOE-based experiments and data-driven methodologies to optimize process performance, expand process window, and improve cost effectiveness. Implement advanced process monitoring and control strategies to ensure stable, repeatable, and manufacturable performance. Identify and lead process simplification, cost reduction, and productivit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role passionate about RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Realtime Defect Analysis (RDA) Technology Development Engineer at Micron, you will learn how to use pioneering defect detection equipment and processes to fix and solve issues. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development. We need engineers who are passionate about detecting problems and eager to make changes for the better. You will have the opportunity to learn defect detection equipment applications and also use data analysis skills to identify and solve process issues. This position will provide the opportunity for you to collaborate with engineers in process integration, process development, data science, and yield analysis within and outside Technology Development. As a Technology Development RDA engineer, your ideas will have the ability to impact the team globally. You will be responsible to support experimentation, data analysis, baseline health metrics, and systematic and random defect improvement through partnering with others in Research and Development and High Volume Manufacturing. Analytical Skills: Strong data analysis and problem-solving abilities. Recipe Management: Write or modify equipment recipes to support the needs of the RDA area.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Opportunity Summary: Micron's Equipment Engineering team at our Manassas, VA (Fab 6) 300mm semiconductor manufacturing facility is responsible for maintaining, troubleshooting, and optimizing advanced wafer fabrication toolsets that directly drive yield, productivity, and cost of ownership. As an Equipment Engineer II – CMP, you will support CMP operations by resolving equipment issues, leading improvement projects, and partnering with process engineers, technicians, and suppliers to sustain high-volume manufacturing performance. (Disclaimer ) While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a team member who is anxious to grow in both technical breadth and depth. If you are open to learning from and being a valued member of a team of top-tier engineers, we are eager to help build on your existing foundation and expand your individual and collaborative skills in this exciting and unique opportunity. What’s Encouraged Daily: Maintain and optimize CMP semiconductor manufacturing equipment for high-volume production. Troubleshoot equipment issues using structured problem-solving methods such as 8D, FMEA, SPC, and root cause analysis. Support tool installations, qualifications, upgrades, and process integration activities. Drive equipment uptime, reliability, throughput, and yield improvements, including exploring Agentic AI workflows to streamline troubleshooting a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an MGR, F4 TAIWAN ROC ME at Micron, you will guide a group of engineers and production experts to reach outstanding results in safety, quality, delivery, cost, and employee growth. You will oversee manufacturing performance, build team skills, and guarantee successful implementation of business objectives within your designated manufacturing sectors. This is a unique chance to be a leader in technological progress in semiconductor manufacturing! The successful candidate must demonstrate strong leadership capability, deep understanding of semiconductor manufacturing operations, effective English communication skills, and the ability to use data and AI-based tools to improve decision-making and operational efficiency. Key Responsibilities Manufacturing Operations Leadership Lead daily manufacturing operations to meet productivity, cycle time, quality, and cost objectives. Drive continuous improvement initiatives to optimize equipment utilization, throughput, and operational performance. Ensure prompt identification, communication, and resolution of production issues. Collaborate with cross-functional partners including Engineering, Quality, Planning, Process Integration, and Supply Chain teams. Area Technical Expertise Develop and maintain comprehensive knowledge of manufacturing processes, operational flows, equipment interactions, and key business drivers across multiple productio