Process Integration Senior Engineer Jobs

Silicon Product Integration Description - Role Overview We are seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs. The role serves as the technical bridge between HP, foundry partners, design teams, manufacturing organizations, and worldwide program teams to ensure successful technology development, qualification, and high-volume manufacturing readiness. The successful candidate will combine deep semiconductor foundry experience with strong program leadership skills to drive product execution from technology development through qualification and production launch. Key Responsibilities Product Engineering Leadership Own silicon product engineering activities across development, qualification, ramp, and sustaining phases. Drive structural cost saving initiative in wafer Foundry and advanced packaging factories. Lead NPI silicon builds and ensure timely execution of wafer, and advanced packaging factories deliverables. Partner with design, architecture, reliability, systems, and manufacturing teams to close technical issues. Drive issue resolution and technical solution for the process marginality and escalation. Foundry and Technology Development Serve as the primary technical interface with internal/external foundries and technology partners. Drive technical reviews, process optimization, design enablement, and qualification activities. Lead root-cause investigations and corrective actions related to yield, reliability, and manufacturability. Assess technology options and recommend development strategies for future products. Program and NPI Leadership Program Management Leadership cross-functional execution for strateg

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration. Key Responsibilities Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance. Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements. Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance. Drive cross-functional technical investigations and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As a Process Control Systems Engineer, you will integrate and monitor key performance indicators across semiconductor manufacturing Defense Line systems, including SPC, FDC, R2R, and other process control applications. You will identify KPI gaps, coordinate CAPA follow-up, track actions through closure, and provide management-level performance visibility. You will also develop dashboards, retrieve and analyze data using SQL and Snowflake, support data digitalization, and participate in AI-enabled manufacturing and analytics projects. This role requires strong analytical thinking, cross-functional coordination, learning agility, and an interest in semiconductor process control and smart manufacturing. Key Responsibilities Integrate and monitor KPIs across different Defense Line and PCS systems. Identify performance gaps and follow up on corrective and preventive actions. Track action owners, due dates, risks, effectiveness verification, and closure status. Develop dashboards for KPI, system health, issue, and CAPA monitoring. Retrieve, clean, transform, and analyze data using SQL and Snowflake. Support AI, machine learning, and advanced analytics applications. Coordinate with process, manufacturing, quality, automation, IT, and global PCS teams. Participate in PCS integration, digitalization, and management-assigned projects. Maintain technical documents, governance workflows, and audit evidence. Qualificati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High‑Volume Manufacturing (HVM) team is responsible for delivering stable, high‑yield semiconductor manufacturing to support Micron’s long‑term DRAM production strategy. The photolithography organization partners closely with operations, equipment engineering, and integration to maintain safe, efficient, and repeatable manufacturing. The Photolithography Process Engineer supports day‑to‑day health and capability of assigned, non‑critical lithography processes and tools. This role executes established control plans and standard work, monitors manufacturing signals, and supports issue resolution and continuous improvement activities with guidance from more experienced engineers. Responsibilities Execute established control plans and standard work to support stable lithography manufacturing. Monitor SPC, metrology, defect, and tool health indicators and escalate risks appropriately. Support excursion response activities, including containment, data collection, and documentation. Partner with shift operations and equipment engineering to support tool recovery and daily priorities. Complete well‑defined improvement tasks related to yield, output, cycle time, or cost with guidance. Minimum Qualifications B.S or M.S in Electrical/Electronics Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Computer Engineering, or a related technical field.. Understanding of high‑volume manufacturing execution, including SPC mon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking an Integration Reliability Engineer to develop the methods that enable complex products to be assembled, integrated, tested, and fielded reliably throughout the product lifecycle. You will support integration strategy, build readiness, interface risk management, failure investigation, and reliability growth across product development and production. This role spans Design Engineering, Manufacturing Engineering, Test Engineering, Operations, Program Management, and field support. The work is hands-on and connected to integration builds, production environments, test activities, and hardware failure investigations in Victorville, Ca.. Key Responsibilities Define integration strategies that establish readiness for component, assembly, and production. Conduct risk assessments, and inspection plan reviews for complex products and assemblies. Develop and improve control plans, initial controls, and methods for integrating complete systems. Support component integration, built-to-print assembly, validation activities, and the transition from development into repeatable production. Monitor yield, build health, and process robustness to identify risks affecting throughput and product realization. Lead systemic root-cause and co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bondin

About the Team OpenAI Finance is responsible for ensuring the organization is set up for success in pursuit of its mission. The Finance Program Management Office (FinPMO) is responsible for driving and scaling cross-functional finance programs and M&A integrations. FinPMO partners closely across Accounting, Strategic Finance, Corporate Development, Equity, Procurement, Treasury, Risk, and Legal to ensure financial change through M&A and other new business models is executed in a controlled, auditable, and operationally effective way. FinPMO plays a critical role in managing M&A including financial deal diligence, finance operations, post-close integrations, reporting and controls. We help quarterback the M&A process to help ensure corporate integrations are executed cleanly, risks are managed proactively, and leadership has clear deal visibility. About the Role As a M&A Finance Integration Lead, you will own and scale OpenAI’s finance integration model. This is a highly cross-functional, transactions driven role for someone who can bring structure to ambiguity, translate deal complexity into executable workplans, and drive successful M&A outcomes across multiple teams. We’re looking for someone to be the central point of accountability to oversee finance workstreams across the full M&A lifecycle. You’ll ensure integrations are executed cleanly, financial risks are mitigated early, and our books, controls, and systems remain stable as OpenAI scales. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role you will: Define and build standardized, scalable M&A finance integration frameworks. Drive consistent execution across multiple, simultaneous M&A integrations. Ensure timely, accurate M&A diligence including historical financials, revenue, equity, tax, and procurement. Lead integration planning for deal close readiness a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal Engineer - Process Development, CMP, NAND Job / Role Summary The Principal Engineer provides technical leadership for Chemical Mechanical Planarization (CMP) process development supporting advanced 3D NAND and future technology nodes. This role leads process characterization, margin improvement, integration, and transfer readiness, while driving cross-functional alignment with global development, manufacturing, equipment, and supplier teams. The position resolves complex process, yield, defectivity, and manufacturability challenges, influences module and site-level technical direction, and advances robust CMP capability for high-volume production through disciplined experimentation, process control, and technology roadmap execution. Main Responsibilities · Lead CMP process characterization and advanced process development for 3D NAND and future technology nodes. · Define and execute CMP process strategies that improve process margin, robustness, manufacturability, yield, and performance. · Lead complex experiments and data analysis to validate process windows, technology scaling readiness, and integration requirements. · Drive transfer of developed CMP processes to high-volume manufacturing at Fab10N and lead cross-func

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further! This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end to end memory system architectures, to guide long term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron. Responsibilities: Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance. Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach Drive long‑term memory technology packaging strategy and influence industry standards Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key responsibilities and task:- To lead and manage the NPI activities as a Product Owner, working together with cross functional teams to accomplish organizational and business objectives by: Driving New Product Introduction process through NPI Phase Gate Review. Coordinating new product start-up and to achieve first pass qualification. Understand new product start-up datelines, product applications and customer requirements; and communicate this information to the new product start-up team Working with process / equipment / manufacturing / planning area owners to bring new product and package into volume production; Providing timely support of First silicon, Engineering samples, Qual samples and meeting expectation on Engineering Hot lots cycle time as per PDT schedule. Regular monitoring the product yield trend; QDR and reliability to ensure that assembly operation is in control and initiate early attention if necessary; Owning the entire Product Life Cycle, from NPI to EOL. Understanding new product challenges and collaborate with Process / Equipment/Development owners to develop new technology capabilities ahead of market Acting as a point of contact to TPM on product related matters. Requirements: Bachelor's degree in an Engineering (Mechanical, Material, Chemical, Electrical ). Passionate in backend engineering process or package development. Eager to learn technical knowledge in com

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Photolithography Engineering Project Title Large-Scale Photolithography Software Stack Integration Project Description Photolithography is one of the most software-intensive and technologically advanced manufacturing processes in semiconductor manufacturing. Maintaining world-class performance requires an integrated software ecosystem spanning process control, equipment connectivity, data engineering, automation, visualization, machine learning, and decision-support systems. As an intern within the Photolithography Engineering team, you will collaborate with process, equipment, data, and manufacturing engineers to design and develop software solutions that transform large-scale manufacturing data into actionable insights and automated engineering workflows. Project assignments will be tailored to individual strengths, academic background, and learning interests, providing opportunities to contribute across software engineering, data engineering, system integration, analytics, and Artificial Intelligence domains. Where relevant, the project will incorporate AI-Enabled development approaches, Generative AI, Artificial Intelligence, AI Assistants, Agentic AI technologies, and Agen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global leader in memory and storage solutions, driving innovation in next-generation DRAM technologies that power artificial intelligence, cloud computing, and advanced computing applications. The Dry Etch Process Development team develops and optimizes advanced plasma etch processes that enable future memory scaling and support groundbreaking semiconductor manufacturing. As a Dry Etch Process Development Engineering Intern, you will gain hands-on experience developing and optimizing semiconductor etch processes in a collaborative research and development environment. Working under the mentorship of experienced engineers, you will contribute to a technical project focused on process development, experimentation, data analysis, and technology innovation. The internship provides broad exposure to semiconductor processing and culminates in a presentation of project results to engineering and leadership teams. Responsibilities Research and develop innovative solutions that support future memory technologies and advanced dry etch process development. Develop, complete, and analyze experiments to optimize dry etch processes and improve product performance. Perform statistical analysis of technology development and pilot manufacturing data to identify trends and drive process improvements. Collaborate with process, equipment, integration, and multi-functional engineering teams to solve complex technical challenges. Apply AI-Enabled analytical tools, Leveraging AI, programming, or automa

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Principal Engineer provides technical leadership for advanced photolithography development programs, defining and executing technology and equipment roadmaps that improve margin, scalability, and manufacturability. This role influences integration strategy, mentors engineers, and drives innovation across development teams. Main Responsibilities Lead photolithography process development across advanced technology nodes. Define and execute photolithography process and equipment roadmaps aligned with future device requirements. Drive early adoption of innovative materials, processes, and patterning schemes. Lead cross ‑ functional development programs and influence integration decisions.