Process Integration Senior Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Boise, we are part of a historic $15 billion investment to expand one of the world’s most advanced semiconductor manufacturing sites. As a leader in memory and storage innovation, we are building the future of DRAM technology while creating opportunities to solve complex engineering challenges in a collaborative, fast-paced environment. As a Vapor Etch Process Engineer, you will develop and optimize critical vapor-phase cleaning and etch processes that enable advanced DRAM manufacturing. Unique to Micron, vapor etch is integrated within Wet Process Engineering, offering the opportunity to work across both wet chemistry and gas-phase surface reactions while partnering with equipment, integration, and yield teams to drive manufacturing excellence. Responsibilities: Own and optimize vapor etch process modules to support high-volume manufacturing Develop, qualify, and maintain processes on single-wafer vapor etch platforms Drive defectivity reduction and improve process performance through data-driven analysis Perform root cause investigations using SPC, FDC, FMEA, and 8D methodologies Partner with equipment and integration teams to improve yield, cost, productivity, and process stability Minimum Qualifications: BS or MS degree in Engineering or equivalent industry experience 2+ years of direct vapor etch process experience in semiconductor manufacturing Experience owning semiconductor manufacturing processes in a high

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High-Volume Manufacturing (HVM) fab is at the leading edge of DRAM technology, driving sophisticated semiconductor innovation through EUV lithography. We operate in a fast-paced, data-driven manufacturing environment focused on achieving extraordinary yield, process capability, and operational excellence while maintaining strict safety and contamination-control standards. For this great opportunity as an EUV Photolithography Engineer, you will lead the development, optimization, and sustainment of EUV processes and scanner performance critical to advanced DRAM nodes. You will be responsible for ensuring process stability, improving yield and throughput, and driving continuous improvement through data analysis, multi-functional teamwork, and sophisticated process control techniques in a high-volume manufacturing environment. Responsibilities Own EUV lithography processes and scanner fleets, ensuring stable high-volume manufacturing performance through SPC monitoring, overlay/CD optimization, defectivity reduction, and tool matching. Lead rapid response to process excursions, including containment, root-cause analysis, wafer disposition, and implementation of corrective and preventive actions (CAPA). Collaborate with Operations, Equipment Engineering, Integration, and Metrology teams to align on production priorities, resolve risks, and optimize cycle time, capacity, and output. Drive continuous improvement of process capability, yield, and equipment productivity using sophist

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview This role focuses on using process and defect simulation methodologies to systematically identify defect root causes (true RC) and enable process window optimization . As part of the RDA / Yield Engineering organization, you will work on high-impact projects that connect process physics, simulation results, and manufacturing data to improve process capability and final product yield. This is an exciting opportunity for engineers passionate about linking simulation with real fab problems and turning modeling insights into measurable manufacturing improvements. Responsibilities Develop and apply process / defect simulation models to understand defect generation mechanisms across key wafer fabrication steps. Correlate simulation results with inline defect, EBI, process data, and yield indicators to identify true root causes of defects. Drive data-backed process optimization strategies to expand process windows and improve yield and reliability. Perform what-if simulations to evaluate the impact of process parameter changes, material variations, or equipment conditions. Partner with process, integration, and equipment engineers to translate simulation insights into fab-implementable actions . Lead or support defect reduction, yie

We are looking for a strategic Business Process Manager to architect the agentic transformation of our GTM tech stack. The GTM Ops, Strategy, Field Readiness, and Sales Development team at Asana enables growth, efficiency, and performance at scale through the strategic management of revenue operations, systems, strategy + analytics, and enablement. In this role, you will act as a thought partner to business stakeholders, a designer of future-state workflows, and the connective tissue between the business and Enterprise Technology (ET). You will own our end-user CPQ experience, drive our agentic quoting capability, and solve complex system dependencies across the broader GTM ecosystem to help Asana scale. This role is based in our San Francisco office with an office-centric hybrid schedule. The standard in-office days are Monday, Tuesday, and Thursday. Most Asanas have the option to work from home on Wednesdays. Working from home on Fridays depends on the type of work you do and the teams with which you partner. If you're interviewing for this role, your recruiter will share more about the in-office requirements. What you’ll achieve Partner as a key cross-functional thought leader with Sales, RevStrat, ET, Deal Desk, and Finance to design scalable, AI-ready workflows that accommodate evolving GTM motions. Own the strategy, requirements gathering, and adoption health of our CPQ platform and agentic quoting capabilities. Scope, prioritize, and manage enhancements across the Salesforce Opportunity object and broader GTM stack to maximize data integrity and cross-functional alignment. Execute end-to-end UAT by authoring test scenarios, managing edge cases, and establishing a reusable UAT framework for future releases. Resolve handoff failures across system integration points to optimize downstream operations across Deal Desk, Provisioning, Order Management, and Billing. Deliver transparent communication and regular updates regarding project timelines, success metrics, an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Diffusion Process Development Engineer, you will act as a technical leader accountable for FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices! This position emphasizes gate dielectric scaling, process reliability, and manufacturing preparedness. The ideal candidate blends extensive expertise in diffusion processes, oxidation principles, and device physics with practical experience transitioning technologies from development to production. You will collaborate closely with groups dedicated to process development, device engineering, equipment, and manufacturing to support future technology nodes. This role requires work with AI for productivity. Key Responsibilities Lead the progress of FEOL diffusion, thermal treatment, and gate oxidation operations in advanced DRAM technology. Develop and scale ultra-thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability. Drive process development from concept through integration, pilot qualification, and manufacturing transfer. Evaluate, qualify, and optimize diffusion and oxidation equipment platforms and reactor builds. Define and monitor manufacturing metrics, including statistical process control, process capability, defectivity, and variability. Interpret electrical, physical, and materials characterization data to guide development decisions. Partner with external suppliers to develop hardware and processes aligned with future technology

At Snowflake, we are powering the era of the agentic enterprise. To usher in this new era, we seek AI-native thinkers across every function who are energized by the opportunity to reinvent how they work. You don’t just use tools; you possess an innate curiosity, treating AI as a high-trust collaborator that is core to how you solve problems and accelerate your impact. We look for low-ego individuals who thrive in dynamic and fast-moving environments and move with an experimental mindset — who rapidly test emerging capabilities to discover simpler, more powerful ways to deliver results. At Snowflake, your role isn't just to execute a function, but to help redefine the future of how work gets done. Snowflake's Corporate Development team operates across acquisitions, strategic investments, and partnerships - and as that activity scales, so does the need for strong operational infrastructure across the full lifecycle. We are seeking a Corporate Development Operations & M&A Integration Lead to own diligence support and integration execution, build the systems and processes that make the team run, and maintain visibility across our Snowflake Ventures portfolio. The scope spans Corporate Development operations, including M&A diligence and integration, and portfolio oversight. This is a high-impact role for someone who is equally comfortable driving a complex diligence process and post-close integration and building the playbooks and tooling that make the next one faster. You bring structure to ambiguous situations, communicate clearly across all levels of the organization, and are energized by leveraging AI to build systems that scale. What You Will Be Doing M&A Diligence & Integration Bring an integration and operational lens into the diligence process. This includes evaluating organizational fit, identifying integration risks, reviewing operational readiness, and flagging issues that should inform deal structure or timing. Coordinate cross-functional

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. The Role We are seeking a thorough SOC Physical Verification & Integration Specialist to drive the physical assembly and signoff of our next-generation SOCs. In this role, you will own the physical integration strategy from the floorplan stage through to tapeout, ensuring seamless assembly of massive multi-hierarchical blocks. You will act as the critical bridge between block-level implementation, top-level integration, and final foundry signoff, ensuring that complex physical bottlenecks are resolved without compromising power, performance, or area (PPA). Key Responsibilities Top-Level Physical Integration: Drive the full-chip physical assembly of very large-scale SOCs (e.g., multi-billion transistor designs). Manage top-level floorplanning, bump planning, global power grid (PG) integration, and top-level clock/routing integration. Hierarchical Verification Methodology: Architect and deploy highly efficient, hierarchical physical verification (PV) flows. Define the boundary conditions, abstraction models, and interface rules required to assemble heavily partitioned, massive-scale designs. Signoff Execution & Debugging: Own full-chip DRC, LVS, ERC, Antenna, ESD, and Latch-up signoff using industry-standard tools (e.g., Siemens Calibre) at advanced process nodes (5nm, 3nm, or below). Cross-Functional Collaboration: Partner tightly with the Physical Design (PD

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Welcome to Micron's Advanced NAND Process Pathfinding Team — where the next generation of memory technology is developed. We operate at the groundbreaking forefront of semiconductor innovation, engineering world-class memory solutions built for uncompromising performance. If you're ready to redefine what's possible in NAND process technology, we'd love you on this journey with us. As a Principal Engineer / Member of Technical Staff (MTS) – Thin Films, you'll spearhead groundbreaking initiatives alongside some of the industry's most accomplished technologists. Your mission: architect and deploy next-generation thin film fabrication methods that keep Micron ahead of the global competition. This is a role for a technical leader who thrives on solving the toughest challenges in materials, deposition, and device integration. Responsibilities: Advance thin film process development to meet demanding structural, electrical, and reliability targets across the NAND roadmap. Lead the creation of thin films for next-generation NAND cells, including dielectric, conductive, interface, and charge-storage layers. Explore new materials, precursor chemistries, and deposition techniques to unlock future sca

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team committed to advancing Dry Etch processes within Micron’s R&D organization, pushing the limits of plasma etch technology to enable future memory products. We work at the intersection of physics, materials, and manufacturing to solve hard problems and move new ideas from concept to production. This is a highly collaborative environment where deep technical expertise directly shapes Micron’s technology roadmap! As an R&D Dry Etch Process Development Engineer, you will develop and optimize plasma dry etch processes for advanced memory technologies. You will take ownership from early research through pilot line execution and global process transfer. Experienced engineers in this role drive multi‑area technology roadmaps and influence Micron’s leadership in semiconductor manufacturing. Responsibilities: Develop and optimize plasma dry etch processes to meet structural and electrical requirements Drive dry etch technology roadmaps and deliver solutions for future product nodes Perform root cause defect analysis and failure mode investigations Partner with integration, yield, manufacturing, and vendors to ensure robust processes Support process transfer from R&D pilot line to global production fabs Minimum Qualifications: Bachelor’s degree in Electrical, Mechanical, Materials, Chemical Engineering, Physics, or related field with 5+ years of semiconductor experience Strong understanding of d

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Staff Engineer leads module ‑ level photolithography process development for advanced NAND technology nodes. This role owns process robustness, manufacturability, and readiness for technology transfer. Success requires strong technical depth, execution leadership, and the ability to translate device requirements into reliable, scalable process solutions. Main Responsibilities Lead development, optimization, and troubleshooting of photolithography processes to meet yield, quality, and performance requirements. Translate device and integration requirements into robust process flows, specifications, and control strategies. Perform and own material evaluations, OPC/layout development, process window analysis, and overlay optimization. Design and implement advanced process control methodologies using SPC, DOE,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Fab16s (Tainan) Scanner Process Manager As a Fab16s (Tainan) Process Manager, you will… Lead and manage a team of process engineers to oversee process development, optimization, and sustaining in semiconductor manufacturing. Drive process performance, yield improvement, and cost optimization while leveraging AI-driven analytics, automation, and advanced data modeling to enhance decision-making, process control, and operational efficiency. Provide technical leadership and support across manufacturing, equipment, and integration teams. Responsibilities and Tasks • Forecast and manage process-related operational costs, including materials, yield loss, and metrology expenses. Drive cost reduction initiatives through AI-based yield analysis and predictive modeling. • Develop and implement robust process control systems to ensure stability, repeatability, and high yield. Leverage AI-assisted fault detection, root cause analysis (RCA), and knowledge systems to improve excursion response and reduce variability. • Work closely with Equipment Engineering and Manufacturing teams to address process constraints and optimize OEE, yield, and throughput. Utilize AI/ML models to improve process windows and sampling strategies. • Partner with cross-functional teams to develop scalable process solutions, integrating AI-enabled monitoring systems, digital dashboards, and smart alerting for real-time process health tracking. • Provide support to ensure compliance with EHSS

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes. Responsibilities Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond. Work with process development engineers in Singapore and Boise, US TD site and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes. Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability. Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable. Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts. Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions<

In this role, you will: Own diagnostic deployment for the current service vehicle fleet and successor platforms, from requirement definition through release into the operating fleet, and foster design for diagnostics with system, firmware, and software teams. Improve diagnostic quality to reduce time-to-diagnose in the fleet. Drive fault isolation accuracy and resolution so a triggered fault points to the right component and repair activity. Close end-to-end diagnostic gaps from requirement through V&V. Own the diagnostic requirements set, maintain traceability between requirements, implementation, test coverage, and in-fleet performance, and lead design and test reviews to catch gaps early. Define and deploy service actions tied to diagnostic outcomes. Partner with service engineering and fleet operations to ensure each fault maps to an actionable, verified repair, and confirm effectiveness using fleet data. Identify and develop prognostic features that predict component and system issues ahead of failure, translating fleet telemetry into monitoring strategies that reduce unplanned downtime, and report diagnostic health and gap closure status to cross-functional and program leadership. Develop metrics to measure diagnostic success and use them to identify system and process gaps, driving continuous improvement across the diagnostic lifecycle. Qualifications Bachelor's or Master's of Science in Electrical, Mechanical, Systems, or Computer Engineering. 10+ years of experience in vehicle or system diagnostics, with direct experience supporting a production or operating fleet. Demonstrated experience improving diagnostic quality and fault isolation accuracy using field data, with measurable reduction in time-to-diagnose. Working knowledge of automotive serial communication protocols (CAN, CAN-FD, LIN, Automotive Ethernet) and diagnostic protocols and standard