Staff Dram Semiconductor Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR4,LPDDR4,DDR5 and LPDDR5 that can operate at high speeds of up to 6400MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: • Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops • Strong judgment to validate AI outputs before use (review assumptions, align with specs/standards, cross-check with simulations, waveforms, assertions, and coverage reports, and document what was accepted/changed) prior to incorporating results into design decisions, verification plans, or debug conclusions • Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We're advancing some of the most important technologies in modern computing. Our memory solutions power AI, cloud, enterprise, mobile, and high-performance computing platforms around the world. The Memory Systems Architecture team explores complex technical challenges across the memory stack and turns them into practical product innovations, helping shape the future of memory technologies and industry standards. As a Technical Staff Member, you will provide systems-level architecture leadership for next-generation memory solutions. This role combines analytical modeling, architecture development, reliability strategy, and cross-functional influence to help define future products. You will work across engineering disciplines to evaluate tradeoffs, guide technical decisions, and develop differentiated solutions that deliver value to customers and platforms. Responsibilities: Define architectures for DDR, LPDDR, HBM, CXL-attached memory, and emerging memory technologies. Develop analytical and simulation-based models to evaluate performance, reliability, power, thermal, and cost tradeoffs. Drive architecture requirements across DRAM, packaging, modules, controllers, platforms, and system software. Lead technical studies, roadmap development, and architecture recommendations supported by quantitative analysis. Influence cross-functional teams, mentor engineers, and contribute to patents, publications, and standards activities. Mi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will contribute to developing modern wafer bonding process technology that keeps Micron at the forefront of memory technology. This position is important because it directly affects product quality, reliability, yield, cost savings, efficiency, and risk control. You will initiate, develop, and fine-tune bonding processes while addressing manufacturing line challenges. You will also manage process, equipment, and material evaluations and improvements to apply changes at various process steps. Your duties include leading and engaging in activities to improve yield and reduce costs, overseeing new process baseline qualifications, and collaborating with suppliers to achieve quality, cost, and risk objectives. You will use AI/ML/LLM tools to boost efficiency and maintain flawless operations. Responsibilities include, but not limited to: Develop and optimize wafer bonding processes to enable next-generation DRAM technologies. Plan and execute experiments (DOEs) to improve process performance, product quality, and reliability. Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving. Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing. Collaborate with manufacturing, suppliers, and cross-

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall design, layout, and optimization of DRAM Memory array/Peripheral Logic/Analog circuits Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate schematic optimization and design‑space exploration Assist in parasitic analysis, sensitivity studies, and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Oversee and manage the layout process including floor-planning, placement, and routing Perform circuit-level verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Drive innovation into the future memory generations and design methodology within a dynamic work environment Minimum Qualifications Master’s degree in electrical or computer engineering with 4-8 years of experience in memory design. Strong fundamentals in CMOS circuit design, device physics and memory operation. Experience with SPICE-based simulation and parasitic extraction. </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: As a Mixed-Signal Design Engineer in Micron’s Pathfinding Design Team, you will play a key role in crafting next-generation memory technologies. This position involves contributing to defining, developing, and analyzing high-speed logics to operate the memory. These paths span from the memory array to the interface block for memory technologies, including DRAM and emerging memories. You will work on novel concept development, circuit simulation, optimization, and floor planning to enable groundbreaking memory solutions! Responsibilities: Provide technical direction and design implementation for a memory control circuits (both of digital and analog) from the memory array to the interface block. Collaborate closely with physical design teams to ensure timing closure, CDC robustness, and power intent alignment. Demonstrated experience working with custom mixed-signal IC build and development for volatile or nonvolatile memory technology. Experience with modeling and simulation of ICs using HSPICE/finesim. Minimum Qualifications: Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or related field. 7&#43; years of experience in custom mixed-signal circuit design. Proficiency with UNIX and CADENCE design environment (Simulation, Schematic entry, SPF extraction) </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Design and maintain standard cells for new DRAM products on new technology Closely collaborate with DTCO team to develop stdcells architecture for emerging technologies Characterization and modeling of Standard cells to provide timing/power model Quality Analysis of characterized liberty models in terms of performance, Power and Functionality Develop automation test bench/flow/tools to improve the work efficiency and help data analysis Co-work with international colleagues on developing new flows and tools for stdcells design Ability to identify stdcells design & char pain points suitable for AI-based automation and collaborate with cross‑functional teams to deploy scalable solutions. Requirements Good understanding of CMOS circuit design Good knowledge of CMOS device physics and layout Experience in total stdcells flow from DTCO development/ spec definition till lib release RTL/GDS flow setup, block level timing analysis, ICC2 experience. Preferred Synopsys EDA flow Finefet & planner experience required. Experience in any characterization tools (Siliconsmart/Liberate)and Cadence Virtuoso preferred. Experience in Primetime, Solido Analytics Familiar with analog/digital simulation tools, i.e. HSPICE, HSIM, VerilogHDL, FINESIM, Simvision Experience in Standard Cell design, layout and verification Experience in Skill, TCL, Per

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Hands on experience in SV, UVM based Verification. Good scripting skills using perl, python is a plus Good understanding of digital / mixed signal circuits and experience in Digital /Mixed signal Verification. Understand the usage of industry standard tools like Virtuoso, Xcellium, Simvision, vsim, Waveview, Finseim, Hspice and Micron-specific simulators Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments and contribute to cross-group communication to work towards standardization and group success About M

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work with international colleagues on developing new verification flows to take on the challenges in design. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Ability to identify verification pain points suitable for AI-based automation and collaborate with cross‑functional teams to deploy scalable solutions. Core Requirements Good communication skills and ability to work well in a team Exposure to gate level simulations ( with delays ) and Logic schematic analysis Analytical capability for complex CMOS and/or gate level circuit designs Proficient with Spice and Verilog simulations Qualifications & Skills Experience in DRAM, SRAM or other memory related fields Experience in python scripting Experience in timin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Leveraging AI for design quality

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Owner at Micron Technology, Inc., you will report to the Smart Manufacturing and Artificial Intelligence organization. The team defines, drives, and delivers end-to-end smart manufacturing solutions, integrated across functions of the business. The team applies industry-leading methodologies in automation, artificial intelligence (AI) , and generative AI (GenAI) to enhance Micron’s product development, business, and administrative processes across the company. Responsibilities and Tasks Support DRAM technology development, which includes deployment of existing smart-manufacturing solutions to TD as well as the development of new customized tools/solutions for TD. Work with users to capture and analyze information related to the adoption of apps for Smart Manufacturing. Identify gaps, weaknesses, and inefficiencies in current solutions, including opportunities for AI-driven enhancements. Define business solutions and propose projects for implementation, leveraging AI and GenAI technologies where applicable. Lead projects and activities requiring coordination, support, and management of resources from global teams. Collaborate with Data Engineers and Data Scientist to design, execute, and deliver smart manufacturing solutions. Use metrics and performance data to identify opportunities for improvement, including predictive analytics and intelligent decision support. Provide domain and system expertise; collaborate with data sci