Technology Development Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The CVD Central Process and Equipment Engineering (CPEE) High Volume Manufacturing organization is seeking a highly motivated engineer to drive manufacturing excellence, equipment performance, and network-wide productivity across Micron's global semiconductor fabrication facilities. This role is responsible for developing and executing manufacturing strategies that improve equipment capability, factory output, cost competitiveness, and technology readiness while leveraging advanced analytics, digital manufacturing solutions, and AI-enabled tools to accelerate decision making and operational improvements. The successful candidate will work closely with global manufacturing teams, technology development organizations, and strategic equipment suppliers to define long-term equipment and manufacturing roadmaps, identify future capability requirements, and accelerate deployment of innovative solutions across the Micron network. This position provides a unique opportunity to influence manufacturing strategy, shape supplier development priorities, and drive competitive advantage through advanced equipment and manufacturing solutions. Strategic Manufacturing & Supplier Leadership •Develop and drive long-term manufacturing and equipment capability roadmaps to support future

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, Micron develops technologies that accelerate the transformation of information into intelligence. The DRAM Engineering Group (DEG) creates advanced memory solutions that enable modern applications, including artificial intelligence, high-performance computing, and immersive user experiences. Our team fosters innovation, collaboration, integrity, and continuous learning while solving some of the industry’s most complex engineering challenges. The Semiconductor Design Engineer will contribute to the design, simulation, optimization, and validation of digital and analog CMOS circuits for advanced DRAM and emerging memory technologies. This role provides opportunities to work across the full product lifecycle, from early technology development through product qualification, while collaborating with global design, verification, and manufacturing teams. The successful candidate will develop technical expertise in memory design, circuit analysis, and design automation while supporting the delivery of high-quality products. Responsibilities Design, simulate, analyze, and optimize CMOS memory circuits and functional blocks, including memory arrays, control logic, datapaths, address decoding, and input/output interfaces. Support physical design activities such as floor planning, placement, routing optimization, layout verification, and manufacturability improvements.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure. Drive yield breakthroughs by understanding the end‑to‑end test flow , product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements. Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs . Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification . Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner. Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency. Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams . Communicate project status, risks, an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manager of the CMP area for the Advanced Technology Engineering team at Micron Technology, Inc., you will build and develop an elite team. Your team will drive new product introduction and ramp at our newest memory fab. This brand-new site in Boise, ID will combine technology development and manufacturing to transfer groundbreaking products from R/D into manufacturing. Your team will engage on Micron’s groundbreaking products from early in the development stage and support them all the way through customer qualification. Your objective is to use global internal and external resources to enable equipment and yield performance to plan. Responsibilities: Ensure all required safety training is completed and work is conducted in accordance with Micron safety policies while promoting a positive work environment. Hire, develop, mentor, and manage a team of highly capable process engineers. Support the qualification of a new innovative processing facility. Provide regular feedback to your team members on performance and career development. Engage with suppliers to develop the process and equipment needed to meet Micron’s technology roadmap. Collaborate with the Technology Development team to ensure successful transfer and ramp of product yield and quality. Engage with other Manufacturing teams and lead w

Job Details: Job Description: Logic Technology Development (LTD) is looking for an experienced individual interested in becoming a Process Integration and Yield Technician. As a Process Integration and Yield Technician, you will assist engineering with route creation, modification, and troubleshooting of the flow of material through our factory using in-house software. In this role your primary responsibilities may include (but are not limited to): Provide assistance to engineering in collecting and recording data during the development of next-generation technology. You will use database report analysis in order to assist with route modification and out-of-control material disposition. Helping with the execution of experiments during development. - You will Utilize a practical application of science, math, and engineering to a wide range of problems. Willing but not limited to work in a lab environment. In addition, the candidate must be willing to: Work in compressed work week schedule consisting of three twelve-hour days in a row with one additional day every other week. Lift 25 lbs. repeatedly while sometimes being on their feet for an extended period. Periodically gowning up to go into the factory to assist with wafer movement activities. A successful candidate should also exhibit the following behavioral traits: Effective communication skills and flexibility to work well in a diverse team environment, multitasking skills and the ability to adjust to rapidly changing priorities, critical thinking and analytical problem-solving skills and strong attention to detail, proactive mindset, able to work and think independently with little or no supervision. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualificatio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate relevant experience in at least three of the five focus areas outlined below. Job Responsibilities Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design-process gaps through collaborative engagement with foundry process teams. Influence foundry

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Technology Development (TD) department at Micron Technology leads innovation. It drives the advancement of data retention and storage systems that change how the world uses information. The team develops next-generation semiconductor processes and technologies and works closely with global R&D and manufacturing teams to bring innovative solutions from concept to production. Join a collaborative environment where you will help shape the future of semiconductor technology while working alongside experienced engineers and technical leaders. Position Overview As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), your role includes developing advanced packaging approaches and linking technologies. You will contribute to their integration in future semiconductor products. Working in a highly collaborative R&D environment, you will support process development, technology evaluation, and qualification activities while gaining hands-on experience with modern semiconductor technologies. This role provides an excellent opportunity for engineers who are passionate about innovation, problem-solving, and continuous learning. Responsibilities Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products. Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance. Participate in e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is seeking a recognized technical expert and strategic leader to join our team as a Principal Advanced CMOS Device & Process Integration Engineer. The successful candidate will establish technical direction for advanced CMOS device and process integration, drive major technology decisions, and lead the resolution of the organization’s most complex cross-functional engineering challenges. This individual will combine deep semiconductor expertise with AI-assisted analytics (Claud Assist, Code Assist, etc.), modeling, automation, and knowledge-management technologies to transform the speed, quality, and scalability of CMOS technology development. AI tools will augment the individual’s technical leadership and decision-making, while final engineering accountability remains with the technical leader. This is a high-impact opportunity to shape current and future CMOS platforms for advanced memory products and influence Micron’s long-term technology competitiveness. As a Principal Advanced CMOS Device & Process Integration Engineer, you will be a technical authority for advanced CMOS device architecture and process integration. You will define and influence CMOS technology roadmaps, establish device and integration strategies, and guide the development of advanced CMOS, and future technologies. You will lead organization-wide technical initiatives involving Process Engineering, Circuit De

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Job Description The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below. Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design-process gaps through collaborative engagement with foundry process teams. Influence foundr

Job Details: Job Description: Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. About This Role: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements. Your Mission: Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes. Key Responsibilities Process Innovation and Excellence Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules Drive defectivity reduction and uniformity improvements through systematic process enhancement Lead technical problem resolution and deliver solutions that meet aggressive technology node targets Optimize equipment performance working with internal teams and key suppliers Strateg

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

Job Details: Job Description: Intel Ireland is a leading centre for semiconductor manufacturing and technology development, producing advanced process technologies that enable Intel products used around the world. Our teams work in a highly automated, high-volume manufacturing environment, focused on safety, innovation, operational excellence, and continuous improvement. This is a shift-based role. Candidates must be able to work on a monthly rotating shift pattern. Exact shift details will be shared during the interview stage. Responsibilities/What you'll do: As an Experienced Manufacturing Technician at Intel Ireland, you will support wafer manufacturing operations in a high-volume semiconductor environment. You will bring strong technical capability in equipment maintenance, troubleshooting, and operational support, while helping to maintain safe, efficient, and high-quality manufacturing performance. In this role, you will: Perform functions associated with all aspects of wafer production, including manufacturing operations, equipment handling, and process-related activities. Support equipment operation within the manufacturing area to meet safety, quality, output, and cost targets. Conduct preventative and corrective maintenance on manufacturing equipment in a regulated environment. Troubleshoot equipment and process issues, complete repairs, and support defect reduction activities. Use technical manuals, specifications, drawings, diagrams, schematics, and verbal instructions to perform assigned tasks. Apply structured problem-solving techniques and use appropriate tools and test equipment to address production and equipment challenges. Support installation, repair, operation, and performance

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. Drive continuous improvement initiatives to minimize defects and optimize process reliability. Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. C

Business Systems Manager Description - Position Summary Lead financial planning, manufacturing cost modeling, capital forecasting, and financial systems for MTD (MEMS Technology Development) and associated labs. Serve as a strategic partner to MTD labs, and executive leadership by translating financial and operational data into clear investment, resource, and long-range planning decisions. Core Responsibilities Financial Planning and Performance Lead annual budgeting, quarterly forecasts, Long-Term Planning, affordability reviews, capital prioritization, close activities, and executive financial reviews. Deliver variance, depreciation, headcount, scenario, and investment analyses with actionable recommendations. Provide timely reporting on financial results, operational trends, risks, and opportunities. Financial Systems and Data Governance Lead the vision, roadmap, and requirements for AMD (asset tracking), RaFT (forecasting tool), and related planning platforms. Govern cost objects, funding assignments, master data, reconciliations, and integrations across SAP, RaFT, AMD, eMagic (inventory finance system), and reporting tools. Improve data quality, usability, controls, and automation so systems remain trusted sources of record. Manufacturing Cost and Capital Leadership Lead manufacturing cost models and collaborate with Financial Analyst partners on ESC forecasts for wafer fabrication, development, and product platforms. Translate yield, capacity, and operating performance into cost, margin, funding, and investment insights. Help facilitate capital planning, depreciation and actuals reporting, purchase-order analysis, affordability assessments,