Verification Director Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Internship Project Outline Template Project Title: Module Site TE CATALYST Project Description: This project will establish a systematic and repeatable method to collect, validate, review, and report data during new Module Test tester setup and qualification. The intern will work with the Test Engineering team to convert fragmented setup records into a controlled data package with clear ownership, review gates, and approval evidence. An AI-assisted review concept will be piloted to identify missing data, unusual trends, and potential setup or qualification concerns for engineer verification. Final tool release decisions will remain with the responsible engineers. The CATALYST Project need requalification process for SMT6 tester which needs relocation. Additional support is required to drive project completion, ensure compliance with operational requirements, and facilitate successful adoption by Site TEs across all qualification scenarios. The ideal candidate should be pursuing or have obtained a Bachelor's degree in Electronics Engineering or Mechanical Engineering, with an interest in manufacturing, testing, and equipment qualification processes. The ideal candidate should be pursuing or have obtained a Bachelor’s degree student in Electronics, Electrical, Mechatronics, Mechanical, Computer, Data Science, or Artificial Intelligence Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but are not limited to · Responsible for the architecture, design, implementation, and validation of analog and mixed-signal circuits used in NAND Flash across the complete design lifecycle. · Design and develop circuits such as charge pumps, amplifiers, voltage regulators, data converters (ADC/DAC), bandgap references, sensor interfaces, and power-management blocks. · Translate system-level requirements into detailed circuit specifications, architectures, schematics, verification plans, and clear design documentation. · Perform transistor-level design and optimization to meet performance, power, area, noise, and reliability targets. · Conduct DC, AC, transient, noise, Monte Carlo, and corner simulations to verify functionality and robustness across process, voltage, and temperature variations. · Validate block- and chip-level design performance using standard industry simulators, including evaluation of parasitic effects and integration quality. · Participate in cross-functional evaluation of key NAND features and collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, and other partner teams. · Analyze design and silicon issues, drive root-cause analysis, and implement robust corrective actions. · Coordinate technical activities for a small team when required, including design reviews, execution tracking, and knowledge sharing. · Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are looking for the individual contributor specific candidate who has hands on the SOC C verification, validation, product debug issues and silicon bring up experience. The candidate must be hands on multi-processors SOC C verification, validation activities and posses very strong skills in C/C++ and must have ARC processor verification experience, should be familiar with SNPS simulation, debug tools etc. The candidate should have good knowledge of End to End debug on any Bring Up Boards, other validation platforms (like HAPS prototyping platforms would be preferred). The candidate should be thoroughly strong in any of the PCIE, LPDDR, ONFI, AXI protocols and debug mechanism using Metaware debugger or any equivalent SW tool on boards. The candidate should be having good exposure to the Firmware flows during debug activities. Comfortable using AI internal (Copilot/Claude) About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The role is junior level, only for fresh graduates.該職缺提供給畢業生。 The general responsibilities of the position are the following: DRAM Probe Testing Improve DRAM probe testing coverage and quality on DRAM products Own the DRAM probe test flow , review and sign off probe test program releases to ensure quality control Develop innovative DRAM test algorithms and Leveraging Artificial Intelligence to improve test efficiency and reduce test cost New Generation DRAM Product Development Responsible for new DRAM product startup and yield improvement Support design verification and in-depth DRAM circuit analysis using CAD tools and Verilog simulations Work with the wafer fab process / integration teams to address process-related defects impacting DRAM yield Identify design marginalities in DRAM circuits and recommend design fixes for circuit-related issues Functional and Design Validation (DRAM) Design novel DRAM test algorithms and develop test programs for validating DRAM features, modes, and commands Analyze failures generated from characterization and validation activities Automate DRAM test program development and engineering workflows using scripting and data processing tools DRAM Product Yield Enhance

The Application Modernization Platform (AMP) team is dedicated to solving one of the industry's biggest challenges: transforming rigid, legacy applications that suffer from poor scalability and high operating costs into modern, microservices-based architectures on MongoDB. To accelerate this transition, MongoDB is building a dedicated Platform and Infrastructure team to develop the Application Modernisation Platform and Infrastructure . As we help customers modernize their application and data ecosystems, we face the challenge of deploying complex tooling into highly restrictive client environments and architecting automated verification frameworks to ensure data equivalence. This new team will architect the platform foundation and infrastructure that enables a "build once, run anywhere" model, ensuring our AI-powered modernisation suite operates seamlessly regardless of a client's security or network constraints. We are looking for engineers to join this high-visibility initiative, where you will solve unique distributed systems puzzles and help shape the future of how global enterprises leverage data and AI. We are looking for an experienced Software Engineer who thrives on solving infrastructure constraints and building developer-centric modernisation platforms with a strong background in building software testkits/frameworks. The ideal candidate will be designing and building automated frameworks that validate functional equivalence, performance benchmarks, and data integrity. From leveraging LLMs for unit test generation to building contract testing frameworks, your work will be the safety net for the world’s largest enterprise migrations. This role will be based in our India office in Gurgaon and offers a hybrid working model. The ideal candidate for this role will have 3-4 years of commercial software development experience with at least one JVM language such as Java, preferably using the Spring ecosystem Expertise integrating Large Language Models (LLMs) int

At Affirm, we exist for the moments that matter—giving people a clear, predictable way to pay over time, with no hidden fees, no surprises, and no tradeoffs on what matters most. The Fraud team at Affirm Bank works cross-functionally with Machine Learning, Product, Engineering, Operations to combat fraudulent activities to foster a safe platform. This role requires abundant cross-functional partnership. This individual will be the representative of the Credit Risk org, leading the charge on refining our Identity Verification and Fraud processes as well as our Application flow. Additionally, this role will work closely with the Product and Engineering teams to improve our Fraud solution. Come join us in our mission to change consumer finance through better technology, lower costs, and increased transparency while providing the best customer experience. What You'll Do This role will take charge of owning fraud performance for depository products, including monitoring fraud losses, approval rates, false positives, customer friction, and other key risk metrics Data Pipeline, Analytics & Monitoring Build and maintain scalable data models and transformation pipelines, using tools (such as DBT) to standardize depository product, transaction, customer, fraud, and operational data. Define trusted fraud performance metrics and analytical datasets, including fraud loss rates, approval and decline rates, false-positive rates, customer friction, and operational efficiency. Develop recurring dashboards, scorecards, and monitoring frameworks to provide clear visibility into fraud performance, portfolio health, and emerging risks. Conduct deep-dive analyses to diagnose fraud losses, control gaps, false positives, portfolio shifts, and unexpected performance changes, translating findings into actionable recommendations. Fraud Strategy Building & Optimization Develop and optimize fraud rules, policies, thresholds, models, and decision strategies

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Build, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor engineers with less experience and provide technical leadership to project teams. Define and improve compose methodologies applying AI-enabled tools, automation, and protocols. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and collaborators. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Design Engineer in the Non-Volatile Memory Core Functional Group , you will design and optimize critical Flash memory circuits such as row/column drivers, sense amplifiers, and associated core circuitry , with focus on performance, power, area, timing, and reliability . Responsibilities Own block and subsystem-level circuit design, optimization, verification, and layout supervision . Optimize designs from base-cell to full-chip level using HSPICE, FastSPICE, NC-Verilog, and related tools. Collaborate with Logic/RTL teams to define array functionality and develop efficient Analog/Mixed-Signal (AMS) architectures combining custom circuits and digital techniques. Work with Technology and project teams on array waveforms, circuit integration, and full-chip floorplanning. Use scripting, automation, and AI/Agentic AI technologies to accelerate design, simulation, validation, and engineering productivity. Develop and maintain Micro-Architecture Specifications (MAS) and required design documentation, including ISO 26262 compliance where applicable. Provide technical guidance and mentor junior engineers . Requirements MS/PhD with 2–6 years or BS with 6–10 years of relevant semiconductor experience. Strong knowledge of analog, digital, and mixed-signal circuit design, CMOS device physics, Flash/NAND architecture, and reliability . <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Location: Richardson, TX We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities · Lead the design and execution of sophisticated memory subsystems and top-level integration activities. · Own design planning, technical decision-making, risk assessment, and schedule execution. · Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. · Review design specifications, microarchitecture documents, and implementation plans. · Drive memory array design, including address decoders and data path, internal power supplies, and custom circuit design activities depending on project needs. · Lead design reviews and drive issue resolution across organizations. · Guide engineers who are developing their skills and provide technical leadership to project teams. · Define and improve building methodologies by applying AI-enabled tools, automation, and guidelines. · Support silicon bring-up, debug, characterization, and yield improvement activities. · Communicate project status, risks, and mitigat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions that enable advanced AI, high-performance computing, data center, and networking applications. Our team collaborates across architecture, RTL design, verification, physical design, firmware, and product engineering to deliver innovative memory-centric SoC solutions that meet demanding power, performance, area, quality, and schedule objectives. As an HBM SoC Design Engineer/Architect, you will contribute to the design, integration, and validation of advanced HBM logic die and memory-centric SoCs. Working alongside experienced engineers, you will apply knowledge gained through academic coursework, research, internships, and engineering projects to solve real-world semiconductor design challenges. This role offers opportunities to develop expertise in digital design, ASIC development, HBM architecture, and AI-enabled engineering methodologies that improve design productivity and quality. Responsibilities Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions. Collaborate with architects and multi-functional engineering teams to translate functional requirements into microarchitectures, interface definitions, and implementation plans. Support design-quality activities including simulation, synthesis, static timing analy

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Building, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor early-career engineers and provide technical leadership to project teams. Define and improve develop methodologies applying AI-enabled tools, automation, and standard processes. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and collaborators. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are building innovative physical design capabilities that help bring advanced semiconductor products from concept to silicon. Our team collaborates across design, verification, and manufacturing disciplines to deliver high-quality solutions using leading-edge technologies. We value technical excellence, continuous learning, and a culture of teamwork and innovation. As a Physical Design Engineer, you will play a key role in driving semicustom physical implementation from netlist handoff through tapeout. You will work closely with cross-functional engineering teams to optimize design quality, achieve physical signoff, and support successful product delivery in advanced technology nodes. Responsibilities: Execute the semi-custom physical design flow from netlist handoff through physical verification and tapeout Develop and maintain floorplans, placement, routing, power distribution networks (PDN), and physical design constraints Perform DRC, LVS, parasitic extraction, and physical signoff activities Analyze and resolve timing, signal integrity, electromigration, IR drop, reliability, and manufacturability issues Partner with cross-functional teams to drive design closure, debug issues, and support tapeout readiness Minimum Qualifications: Bachelor's or Master's degree in Electrical Engineering or a related field Experience in VLSI physical design, semiconductor lay

Work Flexibility: Onsite It's Time to Join Stryker! Stryker is seeking a Staff Systems Engineer, Robotics to lead systems engineering activities for critical electromechanical components within a complex robotic medical platform. In this role, you will serve as a systems engineering owner for robotic end effectors , including powered surgical tools and future attachments that interface directly with the robotic system. You will help translate user and clinical needs into system architecture and requirements, define interfaces across electrical, mechanical, and software disciplines, and guide the product from requirements development through integration and verification. This role requires a highly collaborative engineer who can bring together input from multiple technical disciplines and maintain a system-level view throughout development. What You Will Do Systems Engineering Own systems engineering activities for robotic end effectors and related electromechanical subsystems. Translate user, clinical, and product needs into clear, verifiable system requirements and design inputs. Develop and refine system architectures, interfaces, and functional requirements across electrical, mechanical, software, and controls disciplines. Allocate and decompose system requirements to appropriate subsystems and engineering disciplines. Lead technical trade studies, design assessments, performance analyses, and other systems engineering activities used to guide design decisions. Support concept development and architecture definition for new end effectors, features, and product capabilities. Requirements, Integration, and Verification Establish and maintain requirements traceability throughout the product development lifec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High Bandwidth Memory (HBM) organization develops industry-leading memory solutions that power artificial intelligence, high-performance computing, graphics, and data center applications. The team brings together experts across architecture, design, verification, physical design, product engineering, and validation to deliver advanced memory products that enable the world's most demanding computing workloads. As an HBM Design Development Technical Leadership (DDTL) Intern, you will support the planning, execution, and coordination of next-generation HBM product development programs. You will work closely with technical leaders and engineering teams to track project execution, manage risks, analyze program data, and improve engineering productivity through automation, analytics, and AI-enabled workflows. This role offers exposure to both the technical and leadership aspects of semiconductor product development. Responsibilities Support HBM product execution by tracking schedules, achievements, dependencies, technical risks, and design readiness throughout the development lifecycle. Collaborate with multi-functional engineering teams to monitor project status, coordinate deliverables, and support successful achievement completion. Develop dashboards, reports, data analytics solutions, and executive summaries to provide transparency into program health and key performance indicators. Create automation tools, workflow improvements, and AI-assisted solutions that improve engineering productivity, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High Bandwidth Memory Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. We bring architecture and physical implementation together to shape products that are efficient, manufacturable, and ready for demanding applications! As a Custom Layout Architecture Engineer , you will use physical layout expertise to inform HBM architecture and implementation decisions from concept through tapeout. You will work with design, architecture, process, verification, and product engineering teams to balance performance, power, area, routability, and manufacturability. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Assess HBM architecture choices through layout feasibility, floorplanning, and performance, power, and area analysis Lead custom layout and full-chip integration for analog, mixed-signal, digital, and memory blocks Resolve antenna, latch-up, ESD, electromigration, IR drop, routability, and power-delivery constraints Complete DRC/LVS, parasitic extraction, post-layout validation, and tapeout support using industry-standard EDA tools Build scripts and automation that improve layout quality, verification, and design-cycle time Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field 4&#43; years of semiconductor physical layout experience with a