Yield Analysis Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Your responsibilities will include, but are not limited to, the following: Primarily focus on wafer matching including lot pairing and execution. Configure the bonding UI and continuously track development lots, including interpreting wafer matching outputs, executing wafer shuffling within the bonding UI, and monitoring subsequent wafer build and pairing. Apply AI-enabled ways of working to improve efficiency in wafer matching operations, lot tracking, data summarization, exception monitoring, and routine reporting where applicable. Assist Process Integration (PI) Engineers to coordinate and trouble shoot daily line issues such as disposition of line deviations and engineering job submissions for analysis. Assist in inline inspection and coordinate non-routine metro/RDA inspection on R&D experiments. Support process flow setup activities for production and the short loop flow. Extract, analyze, and summarize data from SWR and Conversion experiments in a report format and make recommendations to engineering based on the data. Manage wafer shipment logistics between fabs (swap lots and fab-to-fab offloads) for technology transfer and yield learning. Monitor key inline/probe/final parametric indices for any deviation an

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Your responsibilities will include, but are not limited to, the following: Primarily focus on wafer matching including lot pairing and execution. Configure the bonding UI and continuously track development lots, including interpreting wafer matching outputs, executing wafer shuffling within the bonding UI, and monitoring subsequent wafer build and pairing. Apply AI-enabled ways of working to improve efficiency in wafer matching operations, lot tracking, data summarization, exception monitoring, and routine reporting where applicable. Assist Process Integration (PI) Engineers to coordinate and trouble shoot daily line issues such as disposition of line deviations and engineering job submissions for analysis. Assist in inline inspection and coordinate non-routine metro/RDA inspection on R&D experiments. Support process flow setup activities for production and the short loop flow. Extract, analyze, and summarize data from SWR and Conversion experiments in a report format and make recommendations to engineering based on the data. Manage wafer shipment logistics between fabs (swap lots and fab-to-fab offloads) for technology transfer and yield learning. Monitor key inline/probe/final parametric indices for any deviation an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: HBM development Improve Probe testing coverage, quality and on HBM products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating HBM features and commands Use high-speed tester hardware to perform validation of new HBM devices Analysis of failures generated from the evaluations Automation of program development and work processes using scripting Product Yield Enhancement Identify causes of low yield through systematic analysis Work closely with various engineering groups in resolving process/defects related issues Perform electri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The role is junior level, only for fresh graduates.該職缺提供給畢業生。 The general responsibilities of the position are the following: DRAM Probe Testing Improve DRAM probe testing coverage and quality on DRAM products Own the DRAM probe test flow , review and sign off probe test program releases to ensure quality control Develop innovative DRAM test algorithms and Leveraging Artificial Intelligence to improve test efficiency and reduce test cost New Generation DRAM Product Development Responsible for new DRAM product startup and yield improvement Support design verification and in-depth DRAM circuit analysis using CAD tools and Verilog simulations Work with the wafer fab process / integration teams to address process-related defects impacting DRAM yield Identify design marginalities in DRAM circuits and recommend design fixes for circuit-related issues Functional and Design Validation (DRAM) Design novel DRAM test algorithms and develop test programs for validating DRAM features, modes, and commands Analyze failures generated from characterization and validation activities Automate DRAM test program development and engineering workflows using scripting and data processing tools DRAM Product Yield Enhance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data‑driven root‑cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross‑fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability to act as a technical point of contact for blocking issues and lead problem solving involving multiple functions Strong data-driven approach and communication skills; comfortable working with

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: AI Technologies Basic understanding of AI concepts and emerging technologies. Familiarity with generative AI tools (e.g., Copilot) is a plus. Interest in leveraging AI to improve productivity, automation, and decision-making. NAND Probe/ Back End Testing Improve Probe testing coverage, quality and on NAND products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating NAND features and commands Use high-speed tester hardware to perform validation of new NAND devices Analysis of failures generated from the evaluations Automation of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. Develop efficient and innovative solutions of production test flows through test algo optimization. Design test plans for new tests and test algorithms for DRAM, which cover test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Develop test programs for products using primarily C++ coding and Python on Automated Test Equipment (ATE) in the given area followed by test program release to manufacturing areas. Drive innovation and improvement through optimizing test programs by applying more efficient testing methods to reduce product test times and manufacturing costs. Demonstrate a thorough understanding of the device/part as it applies to device/part testing. Automate test processes by writing software to improve work efficiency. Develop tools to help provide better analysis and insight of the terabytes of probe data. Develop new Design for Test (DFT), Design For Manufacturability (DFM), and Design For Reliability (DFR) capabilities. Independently debug and identify root causes of test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and justification of program validation and its release to ensure program quality and data integrity. Evaluate and verify yields/quality with global teams to ensure shipping

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping, micro‑cracks, subsurface damage,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Leveraging AI for design quality

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Process Control Engineer at Micron Fab 10, you will build advanced process control, automation and analytics solutions to improve manufacturing efficiency, quality and yields. As a PCS engineer you will gain exposure and knowledge of many process areas in the fab as you assist them with their process control needs. The PCS team at micron is a hotbed of innovation and as a PCS engineer you will develop smart-manufacturing applications that integrate artificial intelligence and machine learning techniques. Responsibilities : Collaborate with process teams to develop, implement and improve advanced control solutions for optimum manufacturing performances Create manufacturing and business process automation tools for efficiency improvement. Understand and utilize manufacturing process data to apply statistical analysis or machine learning to identify problems and translate it into control/automation solutions. Work with a global team to maintain, align and improve process control applications. Develop and deliver training on control systems and related topics. Integrates AI-assisted tools and insights in

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Process Control Engineer at Micron Fab 10, you will build advanced process control, automation and analytics solutions to improve manufacturing efficiency, quality and yields. As a PCS engineer you will gain exposure and knowledge of many process areas in the fab as you assist them with their process control needs. The PCS team at micron is a hotbed of innovation and as a PCS engineer you will develop smart-manufacturing applications that integrate artificial intelligence and machine learning techniques. Responsibilities : Collaborate with process teams to develop, implement and improve advanced control solutions for optimum manufacturing performances Create manufacturing and business process automation tools for efficiency improvement. Understand and utilize manufacturing process data to apply statistical analysis or machine learning to identify problems and translate it into control/automation solutions. Work with a global team to maintain, align and improve process control applications. Develop and deliver training on control systems and related topics. Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Process Development & Optimization Develop, optimize, and characterize thin film processes (ALD/CVD) to meet performance, reliability, and manufacturability targets. Execute well ‑ designed experiments, analyze data, and translate results into process improvements. Support scaling of cell film processes across nodes and platforms. Module Ownership (Growing Scope) Own defined portions of a process module or sub ‑ module under guidance from senior engineers. Track process margins, key sensitivities, and integration risks. Drive issue resolution for process and tool ‑ related problems within assigned scope. Process Integration & Correlation Work closely with integration and device teams to ensure process compatibility and electrical performance. Correlate material, structural, and electrical data to guide process optimization. Support failure analysis and root ‑ cause investigations for yiel